4-682 Model Download Search Results
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09195146829
HARTING
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1 | SEK mezz Fe 14P Press-in 4.5mm PL2 | Other | 09195146829 |
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09027646825
HARTING
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1 | DIN B female straight 64pin, w/ coding, 4.5mm tails, PL2 | Other | 09027646825 |
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B82464G4682M000
TDK
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1 | Epcos B82462-G4 Series Shielded Wire-wound SMD Inductor with a Ferrite Core, 6.8 μH ±20% 4.3A Idc | Inductors Precision Moulded | B82464G4682M000 |
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MMSZ4682T1G
onsemi
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1 | 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit | Small Outline Diode | MMSZ4682T1G |
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B32633B4682J010
TDK
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1 | Metallized Polypropylene Capacitors (MKP/MFP), 0.0068uF, 3000V DC, 13mm(W) x 22mm(H) x 27mm(L) | Other | B32633B4682J010 |
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B32620A4682K189
TDK
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1 | Metallized Polypropylene Capacitors (MKP/MFP), 0.0068uF, 400V DC, 4mm(W) x 8.5mm(H) x 10mm(L) | Other | B32620A4682K189 |
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B32620A4682K289
TDK
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1 | Metallized Polypropylene Capacitors (MKP/MFP), 0.0068uF, 400V DC, 4mm(W) x 8.5mm(H) x 10mm(L) | Other | B32620A4682K289 |
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PIC18F4682-I/PT
Microchip
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1 | MCU 80K Flash 3328 RAM ECAN TQFP44 | Quad Flat Packages | PIC18F4682-I/PT |
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15-44-6826
Molex
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1 | 2.54mm Pitch C-Grid Receptacle Through Hole Dual Row High Profile Vertical High-Temperature 26 Circuits | Other | 15-44-6826 |
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046824612000846+
Kyocera AVX
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1 | FFC & FPC Connectors FPC 0.5MM 12POS | Other | 046824612000846+ |
3
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046824610000846+
Kyocera AVX
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1 | 10 Position FPC Connector Contacts, Top and Bottom 0.016" (0.40mm) Surface Mount, Right Angle | Other | 046824610000846+ |
3
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MIC4682YM
Microchip
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1 | Microchip, MIC4682YM Step-Down Switching Regulator 2A Adjustable, SOIC 8-Pin | Small Outline Packages | MIC4682YM |
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PIC18F4682-E/PT
Microchip
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1 | MCU 80K Flash 3328 RAM ECAN TQFP44 | Quad Flat Packages | PIC18F4682-E/PT |
3
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EPL2014-682MLC
COILCRAFT
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1 | Power Inductors - SMD 6.8uH Shld 20% 915mA 316mOhms AECQ2 | Other | EPL2014-682MLC |
3
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BQ294682DRVR
Texas Instruments
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1 | Family Overvoltage Protection Device for 1-Cell Li-Ion Batteries, with 4.35v OVP | Small Outline No-lead | BQ294682DRVR |
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B82464G4682M
TDK
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1 | Fixed Inductors 6.8uH 4.3A 20% 10x10.4mm SMD | Inductors Precision Moulded | B82464G4682M |
3
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2834682-2
TE Connectivity
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1 | PCB Mount Header, Right Angle, Wire-to-Board, 2 Position, 1.8 mm [.072 in] Centerline, Tin (Sn), Surface Mount, -40°C ~ 125°C | Other | 2834682-2 |
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MKP4-.68/250/10
WIMA
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1 | Film Capacitors 250V .68uF 10% PCM15 | Other | MKP4-.68/250/10 |
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MKT1813468255G
Vishay
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1 | Film Capacitors MKT 680nF +/-10% 250Vdc AXIAL ENCASED | Capacitors, Polarized Axial Diameter Horizontal Mounting | MKT1813468255G |
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4-794682-0
TE Connectivity
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1 | Configuration Features: Number of Power Positions 10 | Number of Positions 10 | Number of Rows 2 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Multiple Contact Types Without | Contact Type Pin | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 4.81 MICM | Contact Retention Within Housing Without | Contact | Other | 4-794682-0 |
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4-794682-8
TE Connectivity
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1 | 18P MICRO MNL ASSY,VRT,THRU,L | Other | 4-794682-8 |
3
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LTM4682EY#PBF
Analog Devices
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1 | Low Profile Quad 31.25A or Single 125A μModule Regulator with Digital Power System Management | BGA | LTM4682EY#PBF |
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5-794682-4
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 24 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Through Hole - Solder, Micro MATE-N-LOK | Other | 5-794682-4 |
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3-794682-8
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 8 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Through Hole - Solder, Power, Micro MATE-N-LOK | Other | 3-794682-8 |
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4-794682-2
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 12 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold (Au), Through Hole - Solder, Micro MATE-N-LOK | Other | 4-794682-2 |
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![Part Image](["https://componentsearchengine.com/2D/0/15091599.png",null,null])
![Part Image](["https://componentsearchengine.com/Images/1/09027646825.jpg",null,null])
![Part Image](["https://product.tdk.com/system/files/dam/img/product/inductor/inductor/smd/020001_b82464g4_pi0801.png","https://product.tdk.com/system/files/dam/img/product/inductor/inductor/smd/020001_b82464g4_pi0801.png",null])
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![Part Image](["https://componentsearchengine.com/Images/9/PIC18F4682-I_PT.jpg",null,"//content.supplyframe.com/images/process/fit-in/100x100/p/qfp_44.jpg"])
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![Part Image](["https://componentsearchengine.com/Images/1/BQ294682DRVR.jpg",null,"//content.supplyframe.com/images/process/fit-in/100x100/p/2477_BQ2946.jpg"])
![Part Image](["https://componentsearchengine.com/Images/9/B82464G4682M.jpg",null,null])
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