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66003 Model Download Search Results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image
6600390-2 TE Connectivity
1 Configuration Features: Number of Power Positions 4 | PCB Mount Orientation Vertical | Number of Positions 4 | Contact Features: Contact Type Blade | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness .076 MICM | Power Contact Base Material Tin | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Current Rating (Max) 42 AMP | Contact Underplating M 6600390-2 1 Download Model
Part Image Part Image
6600303-7 TE Connectivity
1 Configuration Features: Number of Power Positions 3 | Number of Positions 3 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Type Blade | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Current Rating (Max) 42 AMP | Power Contact Base Material Tin | Contact Underplating Material Thickness 5.97 MICM | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | 6600303-7 1 Download Model
Part Image Part Image
6600303-6 TE Connectivity
1 Configuration Features: Number of Power Positions 6 | Number of Positions 6 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 3 MICIN | Contact Underplating Material Thickness 5.97 MICM | PCB Contact Termination Area Plating Material Tin | Contact Type Blade | Contact Retention Within Housing Without | Contact Underplating Material Nickel | Contact Current Rating (Max) 42 AMP | Contact Mating Area Plating Material Gold Flash over Palladium 6600303-6 1 Download Model
Part Image Part Image
6600333-7 TE Connectivity
1 Configuration Features: Number of Signal Positions 16 | Number of Power Positions 6 | PCB Mount Orientation Vertical | Number of Positions 22 | Number of Rows 4 | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Underplating Material Thickness 5.97 MICM | Contact Current Rating (Max) 42 AMP | Contact Underplating Material Nickel | Power Contact Base Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Type Blade | Cont 6600333-7 1 Download Model
Part Image Part Image
6600303-2 TE Connectivity
1 Configuration Features: Number of Power Positions 4 | Number of Positions 4 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 42 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness .076 MICM | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Type Blade | Power Contact Base Mat 6600303-2 1 Download Model
Part Image Part Image
6600310-9 TE Connectivity
1 Board Connector, 14 Contact(s), Male, Straight, Solder Terminal, Locking, Black Insulator 6600310-9 0 Build or Request
Part Image Part Image
6600310-4 TE Connectivity
1 15 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER 6600310-4 0 Build or Request
Part Image Part Image
6600310-7 TE Connectivity
1 Configuration Features: Number of Power Positions 2 | Number of Signal Positions 16 | Number of Positions 18 | PCB Mount Orientation Vertical | Contact Features: Power Contact Base Material Tin | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness .076 MICM | Contact Current Rating (Max) 42 AMP | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Type Pin | Contact Underplating Material Thickness 5.97 MICM | Contact Mating Area Plating Material Gold Flash over P 6600310-7 1 Download Model
Part Image Part Image
6600383-9 TE Connectivity
1 Configuration Features: Number of Signal Positions 24 | Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Rows 4 | Number of Positions 32 | Contact Features: Contact Current Rating (Max) 42 AMP | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | PCB Contact Termination Area Plating Material Gold | Power Contact Base Material Tin | Contact Retention Within Housing Without | Contact Type Blade | Contact Type Pin | Contact Mating Area Plating Material Thickness 3 MI 6600383-9 1 Download Model
Part Image Part Image
6600333-1 TE Connectivity
1 MBXL VERT HDR 5ACP+24S+5ACP 6600333-1 1 Download Model
Part Image Part Image
6600330-9 TE Connectivity
1 MBXL VERT HDR 4P+24S+4P 6600330-9 1 Download Model
Part Image Part Image
6600383-2 TE Connectivity
1 Configuration Features: Number of Rows 4 | Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Positions 44 | Number of Signal Positions 36 | Contact Features: Contact Type Blade | Contact Base Material Copper Alloy | Contact Current Rating (Max) 42 AMP | Contact Underplating Material Nickel | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness .076 MICM | Contact Type Pin | Power Contact Base Material Tin | Contact Mating Area Plating Material Thic 6600383-2 1 Download Model
Part Image Part Image
6600383-5 TE Connectivity
1 Configuration Features: Number of Rows 4 | PCB Mount Orientation Vertical | Number of Power Positions 4 | Number of Signal Positions 16 | Number of Positions 20 | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Retention Within Housing Without | Contact Type Blade | PCB Contact Termination Area Plating Material Gold | Contact Current Rating (Max) 6600383-5 1 Download Model
Part Image Part Image
6600383-5 TE Connectivity
1 Configuration Features: Number of Rows 4 | PCB Mount Orientation Vertical | Number of Power Positions 4 | Number of Signal Positions 16 | Number of Positions 20 | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Retention Within Housing Without | Contact Type Blade | PCB Contact Termination Area Plating Material Gold | Contact Current Rating (Max) 6600383-5 1 Download Model
Part Image Part Image
6600323-1 TE Connectivity
1 Board Connector, 40 Contact(s), 4 Row(s), Male, Straight, Press Fit Terminal 6600323-1 0 Build or Request
Part Image Part Image
6600383-6 TE Connectivity
1 Configuration Features: Number of Positions 30 | PCB Mount Orientation Vertical | Number of Power Positions 6 | Number of Signal Positions 24 | Number of Rows 4 | Contact Features: Contact Mating Area Plating Material Thickness 3 MICIN | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 42 AMP | Contact Mating Area Plating Material Thickness .076 MICM | Contact Type Pin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Gold | Contact Underplati 6600383-6 1 Download Model
Part Image Part Image
6600333-5 TE Connectivity
1 Configuration Features: Number of Power Positions 4 | PCB Mount Orientation Vertical | Number of Positions 28 | Number of Rows 4 | Mating & Unmating Configuration Sequencing | Number of Signal Positions 24 | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Underplating Material Thickness 5.97 MICM | Contact Current Rating (Max) 42 AMP | Contact Mating Area Plating Material Thickness .076 MICM | Contact Type Blade | Contact Underplating Material Nickel | C 6600333-5 1 Download Model
Part Image Part Image
6600333-4 TE Connectivity
1 Configuration Features: PCB Mount Orientation Vertical | Number of Rows 4 | Number of Positions 20 | Number of Signal Positions 16 | Number of Power Positions 4 | Contact Features: Contact Mating Area Plating Material Thickness .076 MICM | Contact Current Rating (Max) 42 AMP | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Power Contact Base Material Tin | Contact Retention Within Housing Without | Contact Type Blade | Contact Mating Area Plating Material Thicknes 6600333-4 1 Download Model
Part Image Part Image
6600310-5 TE Connectivity
1 Board Connector, 31 Contact(s), 4 Row(s), Male, Straight, Solder Terminal 6600310-5 0 Build or Request
Part Image Part Image
6600323-5 TE Connectivity
1 Configuration Features: Number of Positions 50 | Number of Signal Positions 40 | PCB Mount Orientation Vertical | Number of Power Positions 10 | Number of Rows 4 | Contact Features: Power Contact Base Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness .076 MICM | Contact Current Rating (Max) 42 AMP | Contact Type Pin | Contact Underplating Material Thickness 5.97 MICM | Contact Retention Within Housing With 6600323-5 1 Download Model
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6600333-8 TE Connectivity
1 Configuration Features: Number of Power Positions 3 | Number of Rows 4 | Number of Signal Positions 88 | Number of Positions 91 | PCB Mount Orientation Vertical | Contact Features: Power Contact Base Material Tin | Contact Current Rating (Max) 42 AMP | Contact Type Blade | Contact Mating Area Plating Material Thickness .076 MICM | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Thickness 5.9 MICM | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Cont 6600333-8 1 Download Model
Part Image Part Image
6600330-5 TE Connectivity
1 Configuration Features: Number of Power Positions 14 | Number of Positions 46 | Number of Rows 4 | PCB Mount Orientation Vertical | Number of Signal Positions 32 | Contact Features: Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Gold | Power Contact Base Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Mating Area Plating Material Thickness .076 MICM | Contact Type Blade | Contact Underplating Material Nickel | Conta 6600330-5 1 Download Model
Part Image Part Image
6600390-2 TE Connectivity
1 Configuration Features: Number of Power Positions 4 | PCB Mount Orientation Vertical | Number of Positions 4 | Contact Features: Contact Type Blade | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness .076 MICM | Power Contact Base Material Tin | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Current Rating (Max) 42 AMP | Contact Underplating M 6600390-2 1 Download Model
Part Image Part Image
6600323-6 TE Connectivity
1 MBXL VERT HDR 4S+8ACP 6600323-6 1 Download Model
Part Image Part Image
6600330-9 TE Connectivity
1 MBXL VERT HDR 4P+24S+4P 6600330-9 1 Download Model
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