93156 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Prices / Stock	Model	Action
	X93156WM8I-2.7 Renesas Electronics Corporation	1	Digital Potentiometer, 1 Func, 12500ohm, Increment/decrement Control Interface, 32 Positions, CMOS, PDSO8	X93156WM8I-2.7	3D model not available Symbol and footprint not available 0	0 Build or Request
	X93156WM8IZ-T1 Renesas Electronics Corporation	1	Digital Potentiometer, 1 Func, 12500ohm, Increment/decrement Control Interface, 32 Positions, CMOS, PDSO8	X93156WM8IZ-T1	3D model not available Symbol and footprint not available 0	0 Build or Request
	5962-9315603HYA Mercury Systems Inc	1	Multi-Port SRAM Module, 128KX8, 85ns, CMOS, CDIP32	5962-9315603HYA	3D model not available Symbol and footprint not available 0	0 Build or Request
	68693-156 Amphenol FCi	1	Board Connector, 56 Contact(s), 2 Row(s), Male, Straight, Solder Terminal	68693-156	3D model not available Symbol and footprint not available 0	0 Build or Request

	68693-156 Amphenol Communications Solutions	1	Board Connector, 56 Contact(s), 2 Row(s), Male, Straight, Solder Terminal	68693-156	3D model not available Symbol and footprint not available 0	0 Build or Request
	5962-9315602HYX Microsemi Corporation (now Microchip)	1	SRAM Module, 128KX8, 100ns, CMOS, DIP32	5962-9315602HYX	3D model not available Symbol and footprint not available 0	0 Build or Request
	322-93-156-41-001000 Mill-Max Mfg Corp	1	IC Socket, SIP56, 56 Contact(s)	322-93-156-41-001000	3D model not available Symbol and footprint not available 0	0 Build or Request
	50009-3156A Amphenol Communications Solutions	1	Board Connector, 156 Contact(s), 4 Row(s), Male, Straight, 0.1 inch Pitch, Press Fit Terminal, Black Insulator, Receptacle	50009-3156A	3D model not available Symbol and footprint not available 0	0 Build or Request
	515-93-156-15-061002 Mill-Max Mfg Corp	1	IC Socket, PGA156, 156 Contact(s), 2.54mm Term Pitch, 2.54mm Row Spacing, Solder	515-93-156-15-061002	3D model not available Symbol and footprint not available 0	0 Build or Request
	5962-9315601HXC White Electronic Designs Corp	1	SRAM Module, 128KX8, 120ns, CMOS, CDIP32	5962-9315601HXC	3D model not available Symbol and footprint not available 0	0 Build or Request
	1693156 TE Connectivity	1	Cable Assembly, Communication Cable	1693156	3D model not available Symbol and footprint not available 0	0 Build or Request
	310-93-156-41-001000 Mill-Max Mfg Corp	1	Board Connector, 56 Contact(s), 1 Row(s), Female, Straight, Solder Terminal, Socket	310-93-156-41-001000	3D model not available Symbol and footprint not available 0	0 Build or Request
	518-93-156-15-061003 Mill-Max Mfg Corp	1	IC Socket, PGA156, 156 Contact(s), 2.54mm Term Pitch, Solder	518-93-156-15-061003	3D model not available Symbol and footprint not available 0	0 Build or Request
	X93156WM8I-3 Intersil Corporation	1	Digital Potentiometer, 1 Func, 12500ohm, Increment/decrement Control Interface, 32 Positions, PDSO8	X93156WM8I-3	3D model not available Symbol and footprint not available 0	0 Build or Request
	222293156721 YAGEO Corporation	1	Ceramic Capacitor, Multilayer, Ceramic, 200V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.00068uF, Surface Mount, 1206	222293156721	3D model not available Symbol and footprint not available 0	0 Build or Request

	523-93-156-15-061002 Mill-Max Mfg Corp	1	IC Socket, PGA156, 156 Contact(s), 2.54mm Term Pitch, 2.54mm Row Spacing, Wire Wrap	523-93-156-15-061002	3D model not available Symbol and footprint not available 0	0 Build or Request
	5962-9315603HYX Microsemi Corporation (now Microchip)	1	Multi-Port SRAM Module, 128KX8, 85ns, CMOS, CDIP32	5962-9315603HYX	3D model not available Symbol and footprint not available 0	0 Build or Request
	5962-9315601HYC Microsemi Corporation (now Microchip)	1	SRAM Module, 128KX8, 120ns, CMOS, DIP32	5962-9315601HYC	3D model not available Symbol and footprint not available 0	0 Build or Request
	2293156-2 TE Connectivity	1	Body Features: Heat Sink Height Class SAN \| Heat Sink Height 2.75 MM \| Heat Sink Height .108 INCH \| Heat Sink Style Pin \| Configuration Features: Port Matrix Configuration 1 x 6 \| Lightpipe Style Standard \| Number of Ports 6 \| Dimensions: PCB Thickness (Recommended) .089 INCH \| PCB Thickness (Recommended) 2.25 MM \| Electrical Characteristics: Data Rate (Max) 32 GBS \| Housing Features: Cage Material Nickel Silver Alloy \| Operation/Application: Circuit Application Signal \| Heat Sink Compatible Yes \| Pluggable	2293156-2	3D model available Symbol and footprint not available 1	1 Download Model
	5962-9315603HYC Microsemi Corporation (now Microchip)	1	Multi-Port SRAM Module, 128KX8, 85ns, CMOS, CDIP32	5962-9315603HYC	3D model not available Symbol and footprint not available 0	0 Build or Request
	316-93-156-41-003000 Mill-Max Mfg Corp	1	IC Socket, SIP56, 56 Contact(s), 2.54mm Term Pitch, 0.1mm Row Spacing, Solder	316-93-156-41-003000	3D model not available Symbol and footprint not available 0	0 Build or Request
	5962-9315603HYC White Microelectronics	1	Multi-Port SRAM Module, 128KX8, 85ns, CMOS, CDIP32	5962-9315603HYC	3D model not available Symbol and footprint not available 0	0 Build or Request
	326-93-156-41-002 Mill-Max Mfg Corp	1	IC Socket, SIP56, 56 Contact(s)	326-93-156-41-002	3D model not available Symbol and footprint not available 0	0 Build or Request
	X93156UM8I-2.7-T1 Intersil Corporation	1	Digital Potentiometer, 1 Func, 50000ohm, Increment/decrement Control Interface, 32 Positions, CMOS, PDSO8	X93156UM8I-2.7-T1	3D model not available Symbol and footprint not available 0	0 Build or Request
	315-93-156-41-001 Mill-Max Mfg Corp	1	IC Socket, SIP56, 56 Contact(s), 2.54mm Term Pitch, 0.1mm Row Spacing, Solder	315-93-156-41-001	3D model not available Symbol and footprint not available 0	0 Build or Request
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