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Technical Content

2-767 Model Download Search Results

Showing 25 of 3039 results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image
2327677-9 TE Connectivity
1 Configuration Features: Number of Positions 140 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .762 MICM | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Nickel | Contact Current Rating (Max) 1.1 AMP | PCB Contact Termination Area Plating Material Tin | Housing Features: Centerline (Pitch) .6 MM | Centerline (Pitch) 2327677-9
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
276741-000 TE Connectivity
1 Configuration Features: Number of Cores 1 | Dimensions: Power Cable Termination Conductor Diameter 7.36 – 14.73 MM | Length (Installed) 292.1 MM | Power Cable Termination Insulation Diameter .64 – 1.09 INCH | Power Cable Termination Conductor Diameter .29 – .58 INCH | Length (Installed) 11.5 INCH | Cross-Section Range 2 – 250 AWGKC | Power Cable Termination Insulation Diameter 16.25 – 27.68 MM | Electrical Characteristics: Power Cable Termination Voltage Class ≤ 15 KV | Industry Standards: Desig 276741-000
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2327678-7 TE Connectivity
1 Configuration Features: Number of Positions 84 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Current Rating (Max) 1.1 AMP | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .076 MICM | Contact Mating Area Plating Material Gold | Contact Underplating Material Nickel | Housing Features: Centerline (Pitch) .6 MM | Centerline (Pitch) .0 2327678-7
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2327670-1 TE Connectivity
1 Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 140 | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Thickness .076 MICM | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 1.1 AMP | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Gold | Housing Features: Centerline (Pitch) .6 MM | Centerline (Pitch 2327670-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
1-2227671-2 TE Connectivity
1 Configuration Features: Port Matrix Configuration 2 x 3 | Number of Rear EONs per Port Column 3 | Number of Ports 6 | Number of Positions 228 | Contact Features: Contact Current Rating (Max) .5 AMP | Electrical Characteristics: Data Rate (Max) 28 GBS | Housing Features: Cage Material Nickel Silver Alloy | Centerline (Pitch) .031 INCH | Centerline (Pitch) .8 MM | Operation/Application: Circuit Application Signal | Other: EMI Containment Feature Type Internal/External EMI Springs | Included Lightpipe Yes | Pr 1-2227671-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2227671-8 TE Connectivity
1 Configuration Features: Port Matrix Configuration 2 x 3 | Number of Positions 228 | Number of Rear EONs per Port Column 3 | Number of Ports 6 | Contact Features: Contact Current Rating (Max) .5 AMP | Electrical Characteristics: Data Rate (Max) 28 GBS | Housing Features: Cage Material Nickel Silver Alloy | Centerline (Pitch) .8 MM | Centerline (Pitch) .031 INCH | Operation/Application: Circuit Application Signal | Other: Included Lightpipe Yes | EMI Containment Feature Type Internal/External EMI Springs | Pr 2227671-8
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2327678-6 TE Connectivity
1 Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 84 | Contact Features: Contact Mating Area Plating Material Gold | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness .762 MICM | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 1.1 AMP | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 30 MICIN | Housing Features: Centerline (Pitch) .6 MM | Centerline (Pitch) . 2327678-6
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2327678-2 TE Connectivity
1 Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 84 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact Base Material Copper Alloy | Contact Current Rating (Max) 1.1 AMP | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Thickness .381 MICM | Contact Mating Area Plating Material Gold | Housing Features: Centerline (Pitch) .023 INCH | Centerline (Pitc 2327678-2
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
1-2227671-0 TE Connectivity
1 Configuration Features: Number of Ports 6 | Number of Rear EONs per Port Column 3 | Port Matrix Configuration 2 x 3 | Number of Positions 228 | Contact Features: Contact Current Rating (Max) .5 AMP | Electrical Characteristics: Data Rate (Max) 28 GBS | Housing Features: Centerline (Pitch) .8 MM | Centerline (Pitch) .031 INCH | Cage Material Nickel Silver Alloy | Operation/Application: Circuit Application Signal | Other: Included Lightpipe Yes | EMI Containment Feature Type Internal/External EMI Springs | Pr 1-2227671-0
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2227671-9 TE Connectivity
1 Configuration Features: Number of Positions 228 | Number of Rear EONs per Port Column 3 | Port Matrix Configuration 2 x 3 | Number of Ports 6 | Contact Features: Contact Current Rating (Max) .5 AMP | Electrical Characteristics: Data Rate (Max) 28 GBS | Housing Features: Centerline (Pitch) .031 INCH | Cage Material Nickel Silver Alloy | Centerline (Pitch) .8 MM | Operation/Application: Circuit Application Signal | Other: EMI Containment Feature Type Internal/External EMI Springs | Included Lightpipe Yes | Pr 2227671-9
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2227671-2 TE Connectivity
1 Configuration Features: Port Matrix Configuration 2 x 3 | Number of Positions 228 | Number of Rear EONs per Port Column 3 | Number of Ports 6 | Contact Features: Contact Current Rating (Max) .5 AMP | PCB Contact Termination Area Plating Material Gold | Contact Underplating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickne 2227671-2
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2327678-9 TE Connectivity
1 Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 84 | Contact Features: Contact Underplating Material Nickel | Contact Current Rating (Max) 1.1 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .762 MICM | Contact Mating Area Plating Material Gold | Housing Features: Centerline (Pitch) .023 INCH | Centerline (Pitc 2327678-9
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2227671-1 TE Connectivity
1 Configuration Features: Number of Rear EONs per Port Column 3 | Number of Ports 6 | Port Matrix Configuration 2 x 3 | Number of Positions 228 | Contact Features: Contact Underplating Material Tin | Contact Current Rating (Max) .5 AMP | PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickne 2227671-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2227671-1 TE Connectivity
1 Configuration Features: Number of Rear EONs per Port Column 3 | Number of Ports 6 | Port Matrix Configuration 2 x 3 | Number of Positions 228 | Contact Features: Contact Underplating Material Tin | Contact Current Rating (Max) .5 AMP | PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickne 2227671-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
64-21127-67-03501 Gould Fiber Optics
1 Cable Assembly 64-21127-67-03501
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
AC117A-27-67 Spectrum Control
1 Variable Attenuator, 0MHz Min, 4000MHz Max, 0.9dB Insertion Loss-Max, AC117A-27-67
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
91276-705LF Amphenol FCi
1 Board Connector, 5 Contact(s), 1 Row(s), Male, Straight, Solder Terminal, LEAD FREE 91276-705LF
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
78276-770LF Amphenol FCi
1 Board Connector, 70 Contact(s), 2 Row(s), Male, Right Angle, Solder Terminal, LEAD FREE 78276-770LF
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
WSC452767R30DEK Vishay Intertechnologies
1 Fixed Resistor, Wire Wound, 2W, 67.3ohm, 0.5% +/-Tol, 20ppm/Cel, Surface Mount, 4527, CHIP, GREEN WSC452767R30DEK
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
91276-708HLF Amphenol Communications Solutions
1 Board Connector, 8 Contact(s), 1 Row(s), Male, Straight, Solder Terminal, LEAD FREE 91276-708HLF
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
HG532767T26GJT CTS Corporation
1 Parallel - 3Rd Overtone Quartz Crystal, 76.7426MHz Nom, ROHS COMPLIANT PACKAGE-2 HG532767T26GJT
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
78276-7032 Amphenol FCi
1 Board Connector, 32 Contact(s), 2 Row(s), Male, Right Angle, Solder Terminal 78276-7032
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
78276-708 Amphenol FCi
1 Board Connector, 8 Contact(s), 2 Row(s), Male, Right Angle, 0.1 inch Pitch, Solder Terminal, Locking, Black Insulator 78276-708
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
E1UNA27-6.764375MTR Ecliptek Corporation
1 QUARTZ CRYSTAL RESONATOR, 6.764375 MHz E1UNA27-6.764375MTR
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
55-4276-722-MC ECS
1 Board Euro Connector 55-4276-722-MC
3D model not available
Symbol and footprint not available
 0
0 Build or Request
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