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R5F21344CDFP#50
Renesas Electronics
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1 | The R8C/34C Group is supported only for customers who have already adopted these products. The RL78/G1F Group is recommended for new designs.The R8C/34C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Quad Flat Packages | R5F21344CDFP#50 |
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R5F21346CDFP#U0
Renesas Electronics
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1 | The R8C/34C Group is supported only for customers who have already adopted these products. The RL78/G1F Group is recommended for new designs.The R8C/34C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Quad Flat Packages | R5F21346CDFP#U0 |
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TFCR1206-8W-C-2134DT-1K
Venkel
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1 | Thin Film CR,1206,1/8W,?50PPM,2.13M,?0.5% | Other | TFCR1206-8W-C-2134DT-1K |
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ESW-121-34-S-D
SAMTEC
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1 | 42 Position, .100" Elevated Socket Strip, Double Row | Other | ESW-121-34-S-D |
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2134536-2
TE Connectivity
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1 | Body Features: Shell Plating Material Tin over Nickel | Shell Plating Finish Matte | Offset 0 MM | Connector Profile Micro | Configuration Features: Number of Ports 1 | Number of Positions 5 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 1.8 AMP | Contact Mating Area Plating Material Thickness 29.52 MICIN | Dimensions: PCB Thickness (Recommended) .031 – .039 INCH | PCB Thickness (Recommended) .8 – 1. | Other | 2134536-2 |
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232-134/031-000
Wago
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1 | THT female header; straight; Pin spacing 5 mm; 4-pole; clamping collar; 0.6 x 1.0 mm solder pin | Other | 232-134/031-000 |
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TFCR2512-2W-E-2134CT
Venkel
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1 | Thin Film CR,2512,1/2W,?25PPM,2.13M,?0.25% | Other | TFCR2512-2W-E-2134CT |
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ABLS2-13.424218MHZ-12-D1X
ABRACON
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1 | ABL Series 4 MHz âÂÂ50 ppm 18 pF -40 to +85 âÂÂC Microprocessor Crystal | Other | ABLS2-13.424218MHZ-12-D1X |
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B82134A5151M000
TDK
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1 | Leaded Inductors (Leaded Coils), L=420μH Rated Current=0.15A, Axial DxL:7.5mmx30mm | Inductors, Axial Diameter Horizontal Mounting | B82134A5151M000 |
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B82134A5152M000
TDK
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1 | Leaded Inductors (Leaded Coils), L=30μH Rated Current=1.5A, Axial DxL:7.5mmx30mm | Inductors, Axial Diameter Horizontal Mounting | B82134A5152M000 |
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TFCR2512-2W-K-2134CT
Venkel
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1 | Thin Film CR,2512,1/2W,?100PPM,2.13M,?0.25% | Other | TFCR2512-2W-K-2134CT |
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B82134A5301M000
TDK
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1 | Leaded Inductors (Leaded Coils), L=210μH Rated Current=0.3A, Axial DxL:7.5mmx30mm | Inductors, Axial Diameter Horizontal Mounting | B82134A5301M000 |
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R5F21344CDFP#U0
Renesas Electronics
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1 | The R8C/34C Group is supported only for customers who have already adopted these products. The RL78/G1F Group is recommended for new designs.The R8C/34C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Quad Flat Packages | R5F21344CDFP#U0 |
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132134-10
Amphenol
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1 | AMPHENOL RF - 132134-10 - RF CONNECTOR, SMA, STRAIGHT JACK, PCB | Other | 132134-10 |
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212134-0003
Molex
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1 | PICO-EZMATE PLUS1.0 PLUGASSY E PLG ASSY LH | Other | 212134-0003 |
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132134RP
Amphenol
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1 | SMA REVERSE POLARITY P.C.B. JACK | Other | 132134RP |
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SPC21349
Multicomp Pro
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1 | MULTICOMP - SPC21349 - CONNECTOR, RCA/PHONO, JACK | Other | SPC21349 |
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212134-0002
Molex
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1 | PICO-EZMATE PLUS1.0 PLUGASSY ETP LH 2CKT - Tape and Reel | Other | 212134-0002 |
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90152-2134
Molex
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1 | Headers & Wire Housings C-Grid PCB Conn DR H n DR Horz Tn-A 34Ckt | Other | 90152-2134 |
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2121340002
Molex
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1 | Conn Picoflex HDR 2 POS 1mm Solder RA Side Entry SMD Pico-EZmate™ T/R | Other | 2121340002 |
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212134-0006
Molex
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1 | CONN, HEADER, 6POS, 1ROW, 1MM | Other | 212134-0006 |
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INA2134UAE4
Texas Instruments
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1 | INA2134UAE4, Differential Line Receiver 2-channel 14-Pin SOIC | Small Outline Packages | INA2134UAE4 |
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TS21-34-035-BK-160-SMT-TR
CUI Devices
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0 | 3.4 x 3.4 mm, 0.35 mm Actuator Height, 160 gf, Surface Mount, SPST, Black Illuminated, Tactile Switch | Other | TS21-34-035-BK-160-SMT-TR |
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TPS62134BRGTR
Texas Instruments
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1 | 17-V Input, Step-down Converter with Low Power Mode Input for Intel SkyLake Platform | Quad Flat No-Lead | TPS62134BRGTR |
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112134-0000
ITT CANNON
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1 | D-Sub Standard Connectors.... | Other | 112134-0000 |
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![Part Image](["https://componentsearchengine.com/Thumbnails/9/R5F21344CDFP#50.jpg",null,"//content.supplyframe.com/images/process/fit-in/100x100/p/mcu.jpg"])
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