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Technical Content

21326 Model Download Search Results

Showing 25 of 1805 results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image
2132622-1 TE Connectivity
1 IMP100O,HMP,V4P8C,UG,LEW46,4.9 2132622-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132602-2 TE Connectivity
1 IMP100O,HMP,V4P6C,LG,REW46,5.5 2132602-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132638-1 TE Connectivity
1 IMP100O,HMP,V4P10C,UG,LEW46,4.9 2132638-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132632-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Signal Positions 80 | Number of Columns 10 | Stackable No | Guide Location Unguided | Number of Pairs 40 | Backplane Architecture Orthogonal | Number of Ground Positions 40 | Number of Rows 12 | Number of Positions 120 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 29.92 – 59.84 MICIN | PCB Contact Termination Area Plating Material Thickness .76 – 1.52 MICM | Contact Mating 2132632-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132633-1 TE Connectivity
1 IMP100O,HMP,V4P10C,LG,OEW46,4.9 2132633-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132626-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Guide Location Left | Number of Ground Positions 40 | Number of Pairs 40 | Backplane Architecture Orthogonal | Number of Columns 10 | Number of Signal Positions 80 | Stackable No | PCB Mount Orientation Vertical | Number of Rows 12 | Number of Positions 120 | Contact Features: Contact Underplating Material Thickness 50 MICIN | PCB Contact Termination Area Plating Material Thickness .76 – 1.52 MICM | PCB Contact Termination Area Plating M 2132626-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132621-1 TE Connectivity
1 IMP100O,HMP,V4P8C,UG,OEW46,4.9 2132621-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132695-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Backplane Architecture Orthogonal | Guide Location Unguided | PCB Mount Orientation Right Angle | Number of Ground Positions 50 | Number of Pairs 50 | Number of Positions 150 | Number of Columns 10 | Number of Signal Positions 100 | Number of Rows 15 | Stackable No | Contact Features: Contact Underplating Material Nickel | Contact Current Rating (Max) .75 AMP | Contact Mating Area Plating Material Thickness 29.92 – 59.84 MICIN | Contact 2132695-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132615-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Stackable No | Number of Positions 96 | PCB Mount Orientation Vertical | Number of Columns 8 | Backplane Architecture Orthogonal | Guide Location Unguided | Number of Signal Positions 64 | Number of Pairs 32 | Number of Ground Positions 32 | Number of Rows 12 | Contact Features: Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Current Rating (Max) .75 AMP | Contact Mating Area Leng 2132615-2
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132615-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Backplane Architecture Orthogonal | Number of Columns 8 | PCB Mount Orientation Vertical | Number of Ground Positions 32 | Number of Pairs 32 | Number of Rows 12 | Number of Positions 96 | Stackable No | Guide Location Unguided | Number of Signal Positions 64 | Contact Features: PCB Contact Termination Area Plating Material Thickness .76 – 1.52 MICM | Contact Mating Area Length 4.9 MM | Contact Mating Area Length .193 INCH | Contact Unde 2132615-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132607-1 TE Connectivity
1 IMP100O,HMP,V4P6C,UG,DEW46,4.9 2132607-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132606-2 TE Connectivity
1 IMP100O,HMP,V4P6C,UG,LEW46,5.5 2132606-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132608-3 TE Connectivity
1 IMP100,O,H,V4P6C,UG,REW46 2132608-3
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132631-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Signal Positions 80 | Guide Location Unguided | Number of Ground Positions 40 | Number of Columns 10 | Number of Rows 12 | Number of Pairs 40 | Stackable No | Number of Positions 120 | PCB Mount Orientation Vertical | Backplane Architecture Orthogonal | Contact Features: PCB Contact Termination Area Plating Material Finish Matte | Contact Mating Area Plating Material Thickness 29.92 – 59.84 MICIN | Contact Layout Inline | Conta 2132631-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132696-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Pairs 60 | Stackable No | Number of Ground Positions 60 | Backplane Architecture Orthogonal | Number of Columns 12 | Guide Location Left | Number of Signal Positions 120 | Number of Positions 180 | PCB Mount Orientation Right Angle | Number of Rows 15 | Contact Features: Contact Current Rating (Max) .75 AMP | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness .76 – 1.52 MICM | Contact Underplating M 2132696-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132640-3 TE Connectivity
1 IMP100,O,H,V4P10C,UG,REW46 2132640-3
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132698-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Signal Positions 120 | Backplane Architecture Orthogonal | PCB Mount Orientation Right Angle | Guide Location Unguided | Number of Columns 12 | Number of Positions 180 | Stackable No | Number of Pairs 60 | Number of Rows 15 | Number of Ground Positions 60 | Contact Features: PCB Contact Termination Area Plating Material Thickness 30 – 60 MICIN | Contact Layout Inline | Contact Mating Area Plating Material Thickness 29.92 – 59 2132698-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
213268-3 TE Connectivity
1 Connector Accessory 213268-3
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132609-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Rows 12 | Number of Positions 96 | Number of Signal Positions 64 | Guide Location Left | Number of Pairs 32 | Number of Columns 8 | Number of Ground Positions 32 | PCB Mount Orientation Vertical | Stackable No | Backplane Architecture Orthogonal | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Thickness 50 MICIN | PCB Contact Termination Area Plating Material Thickness 30 – 6 2132609-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132632-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Rows 12 | Guide Location Unguided | Number of Positions 120 | Stackable No | Number of Ground Positions 40 | Number of Pairs 40 | Backplane Architecture Orthogonal | PCB Mount Orientation Vertical | Number of Columns 10 | Number of Signal Positions 80 | Contact Features: Contact Current Rating (Max) .75 AMP | Contact Layout Inline | Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Plating Material Thickness 2132632-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132629-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Rows 12 | Number of Ground Positions 40 | Number of Columns 10 | Number of Positions 120 | Backplane Architecture Orthogonal | Number of Signal Positions 80 | PCB Mount Orientation Vertical | Number of Pairs 40 | Stackable No | Guide Location Unguided | Contact Features: Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 30 – 60 MICIN | Contact Mating Area Length 4.9 MM | Contact 2132629-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132648-5 TE Connectivity
1 IMP100,S,R,RA2P6P,LG,39 2132648-5
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132623-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Signal Positions 64 | Number of Pairs 32 | Number of Positions 96 | Guide Location Unguided | Number of Ground Positions 32 | Backplane Architecture Orthogonal | Number of Rows 12 | Number of Columns 8 | Stackable No | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Thickness 50 MICIN | Contact Current Rating (Max) .75 AMP | Contact Shape & 2132623-2
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132618-1 TE Connectivity
1 IMP100O,HMP,V4P8C,LG,REW46,4.9 2132618-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132613-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Ground Positions 32 | Backplane Architecture Orthogonal | Number of Signal Positions 64 | Number of Positions 96 | PCB Mount Orientation Vertical | Number of Rows 12 | Guide Location Unguided | Number of Columns 8 | Number of Pairs 32 | Stackable No | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Thickness .76 – 1.52 MICM | Contact Mating Area Length 4. 2132613-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
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