2170- Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	217006SE Linkman	1	6 pin box type header	Header, Shrouded - Straight PTH Box	217006SE	3D model available Symbol and footprint available 3	1 Download Model
	OPA2170AIDSGT Texas Instruments	1	36V, microPower, Rail-to-Rail Output, Dual, General Purpose Op Amp in microPackage	Small Outline No-lead	OPA2170AIDSGT	3D model available Symbol and footprint available 3	1 Download Model
	LMZ21701SILR Texas Instruments	1	3V to 17V, 1A Step-Down DC/DC Power Module in 3.5mm × 3.5mm Package	Other	LMZ21701SILR	3D model not available Symbol and footprint available 2	1 Download Model
	217064-0051 Molex	1	Micro-One Wire-to-Board Header, Right-Angle, 2.00mm Pitch, Single Row, Glow-Wire Capable, Surface Mount, 5 Circuits, Tin-Bismuth Plating, Black	Other	217064-0051	3D model available Symbol and footprint available 3	1 Download Model

	MAL217056102E3 Vishay	1	Aluminium Electrolytic Capacitors - Radial Leaded 1000uF 20% 25V 12.5 x 20	Capacitor, Polarized Radial Diameter	MAL217056102E3	3D model available Symbol and footprint available 3	1 Download Model
	5962-9221701MRA Texas Instruments	1	Latches Octal Transparent D-Type Latches with 3-State Outputs 20-CDIP -55 to 125	Ceramic Dual-In-Line Packages	5962-9221701MRA	3D model not available Symbol and footprint available 2	1 Download Model
	217063-0025 Molex	1	Connector Shrouded Header 2 Position 2mm Solder Straight Surface Mount Emboss T/R	Other	217063-0025	3D model available Symbol and footprint available 3	1 Download Model
	52808-2170 Molex	1	FFC & FPC Connectors 1.0 FFC NonZIFSMTSTH sgAssy21CktEmbsTpPkg	Other	52808-2170	3D model available Symbol and footprint available 3	1 Download Model
	1217056-1 TE Connectivity	1	Contact Features: Terminal Plating Material Tin \| Mating Tab Width .25 INCH \| PCB Contact Termination Area Plating Material Thickness 150 MICIN \| Mating Tab Width 6.35 MM \| Contact Mating Area Plating Material Thickness 3.81 MICM \| Contact Underplating Material Thickness 2.54 MICM \| Contact Underplating Material Thickness 100 MICIN \| Contact Underplating Material Brass \| Contact Mating Area Plating Material Thickness 150 MICIN \| Mating Tab Thickness .81 MM \| Terminal Orientation Straight \| PCB Terminal Type	Other	1217056-1	3D model available Symbol and footprint available 3	1 Download Model
	1217062-1 TE Connectivity	1	Configuration Features: Connection Capacity Single \| Contact Features: PCB Contact Termination Area Plating Material Thickness 150 MICIN \| PCB Contact Termination Area Plating Material Thickness 3.81 MICM \| Mating Tab Width 4.75 MM \| Contact Underplating Material Nickel \| PCB Terminal Type Tab \| Contact Mating Area Plating Material Thickness 150 MICIN \| Terminal Size 4.75 \| Terminal Plating Material Tin \| Contact Underplating Material Thickness 50 MICIN \| Contact Underplating Material Thickness 1.27 MICM \|	Other	1217062-1	3D model available Symbol and footprint available 3	1 Download Model
	STPS2170AF STMicroelectronics	1	170 V, 2 A power Schottky rectifier	Small Outline Diode Flat Lead	STPS2170AF	3D model available Symbol and footprint available 3	1 Download Model
	DEA202170LT-5071A1 TDK	1	Filters, Pass Band=699 to 2170MHz, Zc=50se \| 50se	Other	DEA202170LT-5071A1	3D model available Symbol and footprint available 3	1 Download Model
	5962-9221703MRA Renesas Electronics	1	The 5962-92217 (equivalent to IDT 54FCT373T) is an octal transparent latch with 3-state outputs and is intended for bus oriented applications. The flip-flops appear transparent to the data when Latch Enable (LE) is high. When LE is low, the data that meets the set-up time is latched. The 5962-92217 operates at -55C to +125C. (For commercial version, see 74FCT373T)	Ceramic Dual-In-Line Packages	5962-9221703MRA	3D model not available Symbol and footprint available 2	1 Download Model
	2170640071 Molex	1	Micro-One Wire-to-Board Header, Right-Angle, 2.00mm Pitch, Single Row, Glow-Wire Capable, Surface Mount, 7 Circuits, Tin-Bismuth Plating, Black	Other	2170640071	3D model available Symbol and footprint available 3	1 Download Model
	1217080-1 TE Connectivity	1	Configuration Features: Connection Capacity Single \| Contact Features: Terminal Size 5.2 \| Mating Tab Thickness .81 MM \| PCB Contact Termination Area Plating Material Thickness 100 MICIN \| Terminal Size 6.35 \| Mating Tab Width 5.21 MM \| Contact Mating Area Plating Material Thickness 100 MICIN \| Contact Underplating Material Thickness 100 MICIN \| Contact Underplating Material Copper \| Contact Underplating Material Thickness 1.27 MICM \| Contact Underplating Material Thickness 2.54 MICM \| Mating Tab Width .25	Other	1217080-1	3D model available Symbol and footprint available 3	1 Download Model

	L17H2170134 Amphenol Communications Solutions	1	Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (.750in), 9/15HD (Pin/Socket), Flash Gold, Bright Tin Sh	Other	L17H2170134	3D model not available Symbol and footprint available 2	1 Download Model
	SL612170GECO Fischer Elektronik GmbH & Co. KG	1	male header	Other	SL612170GECO	3D model available Symbol and footprint available 3	1 Download Model
	H2170-05 Harwin	1	Hardware: Plug Straight THT Ø1mm Terminal Pin 13.21mm high Gold	Other	H2170-05	3D model available Symbol and footprint available 3	1 Download Model
	SI51214-B12170-GM Silicon Labs	1	Two Output Factory Programmable Clock Generator, TDFN6	Small Outline No-lead	SI51214-B12170-GM	3D model available Symbol and footprint available 3	1 Download Model
	2170668-1 TE Connectivity	1	Body Features: Modular Jack Latch Orientation Inverted - Latch Up \| Shield Material Copper Alloy \| Connector Profile Standard \| Configuration Features: Number of Panel Ground Tabs 2 \| Port Matrix Configuration 1 x 1 \| Panel Ground Location Top \| Number of Positions 8 \| Number of Loaded Positions 8 \| PCB Mount Orientation Right Angle \| Status Light Type Not Illuminated \| Port Configuration Single Port \| Number of PCB Ground Tabs 2 \| Connector Contact Density Standard \| Contact Features: PCB Contact Terminati	Other	2170668-1	3D model available Symbol and footprint available 3	1 Download Model
	LTC2170IUKG-12TRPBF Analog Devices	0	80Msps Low Power Quad ADCs	Other	LTC2170IUKG-12TRPBF	3D model available Symbol and footprint available 3	1 Download Model
	52793-2170 Molex	1	1.0 FFC Non ZIFHsgAssySMT 21CktEmbsTpPkg	Other	52793-2170	3D model available Symbol and footprint available 3	1 Download Model
	MAL217051471E3 Vishay	1	Aluminum Electrolytic Capacitors - Radial Leaded 470uF 20% 50V 12.5 x 25	Other	MAL217051471E3	3D model available Symbol and footprint available 3	1 Download Model
	TPS62170QDSGTQ1 Texas Instruments	1	3-17V 0.5A Automotive Step-Down Converter in 2x2 QFN package	Small Outline No-lead	TPS62170QDSGTQ1	3D model available Symbol and footprint available 3	1 Download Model
	217063-0065 Molex	1	Headers & Wire Housings M-One 2mm VRT HDR SR 6CKT GW W/POTNG CAP	Other	217063-0065	3D model available Symbol and footprint available 3	1 Download Model
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