21983 Model Download Search Results

Showing 25 of 1792 results

Price & Stock Powered by Findchips

Filter by Manufacturer

Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image
2198318-8 TE Connectivity
1 Configuration Features: Lightpipe Style Standard | Number of Ports 2 | Port Matrix Configuration 2 x 1 | Number of Positions 40 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 G 2198318-8 1 Download Model
Part Image Part Image
2198325-4 TE Connectivity
1 Configuration Features: Port Matrix Configuration 2 x 2 | Lightpipe Style Standard | Number of Ports 4 | Number of Positions 80 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G 2198325-4 1 Download Model
Part Image Part Image
2198325-2 TE Connectivity
1 Configuration Features: Number of Ports 4 | Port Matrix Configuration 2 x 2 | Lightpipe Style Standard | Number of Positions 80 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 G 2198325-2 1 Download Model
Part Image Part Image
219839-7 TE Connectivity
1 Interconnection Device 219839-7 0 Build or Request
Part Image Part Image
2198373-2 TE Connectivity
1 Telecom and Datacom Connector, 76 Contact(s), Press Fit Terminal 2198373-2 0 Build or Request
Part Image Part Image
219838-3 TE Connectivity
1 Cable Assembly 219838-3 0 Build or Request
Part Image Part Image
2198339-2 TE Connectivity
1 Telecom and Datacom Connector, 240 Contact(s), Press Fit Terminal 2198339-2 0 Build or Request
Part Image Part Image
219838-6 TE Connectivity
1 Cable Assembly 219838-6 0 Build or Request
Part Image Part Image
219837-3 TE Connectivity
1 Cable Assembly 219837-3 0 Build or Request
Part Image Part Image
2198339-3 TE Connectivity
1 Telecom and Datacom Connector, 240 Contact(s), Press Fit Terminal 2198339-3 0 Build or Request
Part Image Part Image
219836-1 TE Connectivity
1 Cable Assembly 219836-1 0 Build or Request
Part Image Part Image
2198373-3 TE Connectivity
1 Configuration Features: Number of Ports 2 | Port Matrix Configuration 2 x 1 | Number of Positions 76 | Number of Rear EONs per Port Column 3 | Contact Features: Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thicknes 2198373-3 1 Download Model
Part Image Part Image
2198373-1 TE Connectivity
1 Configuration Features: Port Matrix Configuration 2 x 1 | Number of Rear EONs per Port Column 3 | Number of Positions 76 | Number of Ports 2 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Tin | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thicknes 2198373-1 1 Download Model
Part Image Part Image
2198339-1 TE Connectivity
1 Configuration Features: Lightpipe Style Standard | Number of Positions 240 | Number of Ports 12 | Port Matrix Configuration 2 x 6 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 2198339-1 1 Download Model
Part Image Part Image
2198325-3 TE Connectivity
1 Configuration Features: Number of Positions 80 | Port Matrix Configuration 2 x 2 | Number of Ports 4 | Lightpipe Style Standard | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 G 2198325-3 1 Download Model
Part Image Part Image
2198325-5 TE Connectivity
1 Configuration Features: Number of Ports 4 | Number of Positions 80 | Lightpipe Style Standard | Port Matrix Configuration 2 x 2 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G 2198325-5 1 Download Model
Part Image Part Image
2198339-6 TE Connectivity
1 Configuration Features: Lightpipe Style Standard | Port Matrix Configuration 2 x 6 | Number of Positions 240 | Number of Ports 12 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 2198339-6 1 Download Model
Part Image Part Image
219839-5 CommScope Inc
1 Interconnection Device 219839-5 0 Build or Request
Part Image Part Image
2198346-2 TE Connectivity
1 Telecom and Datacom Connector, 320 Contact(s), Press Fit Terminal 2198346-2 0 Build or Request
Part Image Part Image
219839-8 CommScope Inc
1 Interconnection Device 219839-8 0 Build or Request
Part Image Part Image
2198346-4 TE Connectivity
1 Telecom and Datacom Connector, 320 Contact(s), Press Fit Terminal 2198346-4 0 Build or Request
Part Image Part Image
219836-3 TE Connectivity
1 Cable Assembly 219836-3 0 Build or Request
Part Image Part Image
2198325-2 TE Connectivity
1 SFP Connector, 40+40 Contact(s), Female, Right Angle, Press Fit Terminal, Locking, Receptacle 2198325-2 0 Build or Request
Part Image Part Image
2198318-1 TE Connectivity
1 Telecom and Datacom Connector, 40 Contact(s), Press Fit Terminal 2198318-1 0 Build or Request
Part Image Part Image
219836-7 TE Connectivity
1 Cable Assembly 219836-7 0 Build or Request
Can't find what you're looking for? Request this part