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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	M55302/27-102 TE Connectivity	1	Conn Box Connector RCP 50 POS 2.54mm Solder ST Panel Mount	Other	M55302/27-102	3D model available Symbol and footprint available 3	1 Download Model
	522712279 Molex	1	MOLEX - 522712279 - SOCKET FFC/FPC, SMT, 1MM, 22WAY	Other	522712279	3D model available Symbol and footprint available 3	1 Download Model
	10061122-271320HLF Amphenol	1	FFC & FPC Connectors 10061122-271320HLF-YLL-D	Other	10061122-271320HLF	3D model available Symbol and footprint available 3	1 Download Model
	M22-7130942 Harwin	1	2.00mm (0.079") Pitch SIL Vertical 2.6mm Throughboard Socket Assembly, selective gold + tin, 9 contacts	Header, Receptacle - Straight PTH Box	M22-7130942	3D model available Symbol and footprint available 3	1 Download Model

	72271LA10PFG8 Renesas Electronics	1	The 72271 is a 32K x 9 SuperSync FIFO memory with clocked read and write controls. The Frequency Select pin (FS) has been removed, thus it is no longer necessary to select which of the two clock inputs, RCLK or WCLK, is running at the higher frequency. The period required by the retransmit operation and the first word data latency period is now fixed and short. (The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated on this SuperS	Quad Flat Packages	72271LA10PFG8	3D model available Symbol and footprint available 3	1 Download Model
	B72220S2271K101 TDK	1	Leaded Disk Varistors, Max. Operating Voltage [AC]=275Vrms, Max. Surge Current Imax(8/20?s,1time)=10000A	Other	B72220S2271K101	3D model available Symbol and footprint available 3	1 Download Model
	1782271 Phoenix Contact	1	PCB header, nominal cross section: 1.5 mm?, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Tin, type of contact: Male connector, Number of potentials: 5, Number of rows: 1, Number of positions per row: 5, number of connections: 5, product range: MC 1,5/..-G-THR, pitch: 3.81 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2 mm, Stecksystem: MINI COMBICON, Locking: without, type of packaging: packed in cardboard	Other	1782271	3D model available Symbol and footprint available 3	1 Download Model
	M22-7130442 Harwin	1	2.00mm (0.079") Pitch SIL Vertical 2.6mm Throughboard Socket Assembly, selective gold + tin, 4 contacts	Header, Shrouded - Straight PTH Box	M22-7130442	3D model available Symbol and footprint available 3	1 Download Model
	2132271210 Molex	1	1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Dual Row, Surface Mount, Vertical, 0.10µm Gold (Au) Plating, 12 Circuits	Other	2132271210	3D model not available Symbol and footprint available 2	1 Download Model
	B72210S2271K101 TDK	1	Leaded Disk Varistors, Max. Operating Voltage [AC]=275Vrms, Max. Surge Current Imax(8/20μs,1time)=3500A.,	Other	B72210S2271K101	3D model available Symbol and footprint available 3	1 Download Model
	B72210S2271K101 TDK	1	Leaded Disk Varistors, Max. Operating Voltage [AC]=275Vrms, Max. Surge Current Imax(8/20μs,1time)=3500A.,	Other	B72210S2271K101	3D model available Symbol and footprint available 3	1 Download Model
	72271LA15PFI8 Renesas Electronics	1	The 72271 is a 32K x 9 SuperSync FIFO memory with clocked read and write controls. The Frequency Select pin (FS) has been removed, thus it is no longer necessary to select which of the two clock inputs, RCLK or WCLK, is running at the higher frequency. The period required by the retransmit operation and the first word data latency period is now fixed and short. (The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated on this SuperS	Quad Flat Packages	72271LA15PFI8	3D model available Symbol and footprint available 3	1 Download Model
	52271-1969 Molex	1	FFC & FPC Connectors 1.0 FPCZIFSMTR/Abtm Au19CktEmbsTpPkg	Other	52271-1969	3D model available Symbol and footprint available 3	1 Download Model
	232-271/047-000 Wago	1	THT female header; angled; Pin spacing 5.08 mm; 11-pole; Spacer flange; 0.6 x 1.0 mm solder pin	Other	232-271/047-000	3D model available Symbol and footprint available 3	1 Download Model
	2132271030 Molex	1	1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Dual Row, Surface Mount, Vertical, 0.10µm Gold (Au) Plating, 10 Circuits	Other	2132271030	3D model not available Symbol and footprint available 2	1 Download Model

	232-271 Wago	1	THT female header; angled; Pin spacing 5.08 mm; 11-pole; 0.6 x 1.0 mm solder pin	Other	232-271	3D model available Symbol and footprint available 3	1 Download Model
	M22-7141642 Harwin	1	2.00mm (0.079") Pitch DIL Vertical 2.6mm Throughboard Socket Assembly, selective gold + tin, 16+16 contacts	Other	M22-7141642	3D model available Symbol and footprint available 3	1 Download Model
	232-271/031-000 Wago	1	THT female header; angled; Pin spacing 5.08 mm; 11-pole; clamping collar; 0.6 x 1.0 mm solder pin	Other	232-271/031-000	3D model available Symbol and footprint available 3	1 Download Model
	B72214W2271K501 TDK	1	ThermoFuse Varistors, Max. Operating voltage [AC]=275Vrms, Max. Surge Current Imax(8/20μs,1time)=6kA	Other	B72214W2271K501	3D model available Symbol and footprint available 3	1 Download Model
	72271LA10TF Renesas Electronics	1	The 72271 is a 32K x 9 SuperSync FIFO memory with clocked read and write controls. The Frequency Select pin (FS) has been removed, thus it is no longer necessary to select which of the two clock inputs, RCLK or WCLK, is running at the higher frequency. The period required by the retransmit operation and the first word data latency period is now fixed and short. (The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated on this SuperS	Quad Flat Packages	72271LA10TF	3D model available Symbol and footprint available 3	1 Download Model
	B72205S2271K101 TDK	1	Leaded Disk Varistors, Max. Operating Voltage [AC]=275Vrms, Max. Surge Current Imax(8/20μs,1time)=800A	Other	B72205S2271K101	3D model available Symbol and footprint available 3	1 Download Model
	72271LA15PF Renesas Electronics	1	The 72271 is a 32K x 9 SuperSync FIFO memory with clocked read and write controls. The Frequency Select pin (FS) has been removed, thus it is no longer necessary to select which of the two clock inputs, RCLK or WCLK, is running at the higher frequency. The period required by the retransmit operation and the first word data latency period is now fixed and short. (The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated on this SuperS	Quad Flat Packages	72271LA15PF	3D model available Symbol and footprint available 3	1 Download Model
	72271LA15TFI8 Renesas Electronics	1	The 72271 is a 32K x 9 SuperSync FIFO memory with clocked read and write controls. The Frequency Select pin (FS) has been removed, thus it is no longer necessary to select which of the two clock inputs, RCLK or WCLK, is running at the higher frequency. The period required by the retransmit operation and the first word data latency period is now fixed and short. (The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated on this SuperS	Quad Flat Packages	72271LA15TFI8	3D model available Symbol and footprint available 3	1 Download Model
	52271-0869 Molex	1	8 Position FPC Connector Contacts, Bottom 0.039" (1.00mm) Surface Mount, Right Angle	Other	52271-0869	3D model available Symbol and footprint available 3	1 Download Model
	52271-1169 Molex	1	FFC & FPC Connectors 1.0 FPC CONN ZIF SMT R/A 11C BOTTOM CON	Other	52271-1169	3D model available Symbol and footprint available 3	1 Download Model
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