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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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CYUSB3084FCAXIXQMA1
Infineon
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1 | ARM® Cortex®-M0+, Cortex®-M4F EZ-USB™ FX5 USB Peripheral Controller Microcontroller IC FLASH (512kB) 169-TFBGA | BGA | CYUSB3084FCAXIXQMA1 |
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110-43-308-41-001000
Mill-Max
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1 | MILL MAX - 110-43-308-41-001000 - DIP SOCKET, 8POS, 2.54MM, TH | Other | 110-43-308-41-001000 |
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5530841-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Keying & Polarized Position Locations 0 | Number of Signal Positions 0 | Number of Positions 30 | Number of Dual Positions 15 | Number of Power Positions 30 | Contact Features: Contact Current Rating (Max) 3 AMP | Contact Type Socket | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Finish Matte | PCB Contact Term | Other | 5530841-2 |
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5530843-3
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Power Positions 36 | Keying & Polarized Position Locations 0 | Number of Signal Positions 0 | Number of Dual Positions 18 | PCB Mount Orientation Vertical | Number of Positions 36 | Contact Features: PCB Contact Termination Area Plating Material Finish Matte | Contact Mating Area Plating Material Thickness .76 MICM | Contact Base Material Phosphor Bronze | Contact Current Rating (Max) 3 AMP | Contact Mating Area Plating Material | Header, Receptacle - Straight PTH Box | 5530843-3 |
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M50-3630842R
Harwin
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1 | Archer: 8 Pos Plug SIL Straight SMT Connector 3mm pin (T+R) | Other | M50-3630842R |
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5530843-7
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Signal Positions 0 | Number of Dual Positions 30 | Keying & Polarized Position Locations 0 | Number of Power Positions 60 | Number of Positions 60 | PCB Mount Orientation Vertical | Contact Features: Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Socket | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness | Other | 5530843-7 |
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2308-4DCG8
Renesas Electronics
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1 | The 2308 is a high-speed phase-lock loop (PLL) clock multiplier. It is designed to address high-speed clock distribution and multiplication applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2308 has two banks of four outputs each that are controlled via two select addresses. By proper selection of input addresses, both banks can be put in tri-state mode. In test mode, the PLL is turned off, and the i | Small Outline Packages | 2308-4DCG8 |
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5530843-5
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Keying & Polarized Position Locations 0 | Number of Dual Positions 25 | Number of Power Positions 50 | PCB Mount Orientation Vertical | Number of Positions 50 | Number of Signal Positions 0 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Finish Matte | Contact Base Material Phosphor Bronze | Contac | Other | 5530843-5 |
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M80-8530845
Harwin
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1 | Datamate L-Tek: 4+4 Pos Plug DIL Straight 3mm THT Connector Latches Gold | Other | M80-8530845 |
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5530843-6
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Power Positions 56 | Number of Dual Positions 28 | Number of Signal Positions 0 | PCB Mount Orientation Vertical | Keying & Polarized Position Locations 0 | Number of Positions 56 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Other | 5530843-6 |
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AB308-48.000MHZ
ABRACON
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1 | HIGH FREQUENCY CYLINDRICAL TYPE MICROPROCESSOR CRYSTAL | Other | AB308-48.000MHZ |
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SIT3921AI-1CF-33NZ174.703084
SiTime
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1 | Digitally Controlled Differential Oscillator (DCXO), 5 x 3.2mm Package | Other | SIT3921AI-1CF-33NZ174.703084 |
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AB308-4.096MHZ
ABRACON
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1 | HIGH FREQUENCY CYLINDRICAL TYPE MICROPROCESSOR CRYSTAL | Other | AB308-4.096MHZ |
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0558-0-15-80-30-84-10-0
Mill-Max
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1 | Pin Receptacle Connector 0.015" ~ 0.025" (0.38mm ~ 0.64mm) No Tail Solder | Other | 0558-0-15-80-30-84-10-0 |
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115-93-308-41-001000
Mill-Max
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1 | IC & Component Sockets | Dual-In-Line Sockets | 115-93-308-41-001000 |
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110-43-308-41-105000
Mill-Max
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1 | 8 (2 x 4) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Surface Mount | Other | 110-43-308-41-105000 |
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FPIB130840-R47M-XA
Changjiang Electronics Tech (CJ)
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1 | Molding power inductors Frequency up to 3 MHz . 125°C Temperature operation , 470nH ±20% 50A | Other | FPIB130840-R47M-XA |
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115-43-308-41-003000
Mill-Max
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1 | 8 (2 x 4) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole | Dual-In-Line Sockets | 115-43-308-41-003000 |
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8-5530843-8
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 40 | Number of Dual Positions 20 | Number of Positions 40 | Number of Signal Positions 0 | Contact Features: Contact Current Rating (Max) 3 AMP | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating M | Other | 8-5530843-8 |
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8-5530843-3
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Signal Positions 0 | Number of Positions 24 | Number of Dual Positions 12 | Number of Power Positions 24 | Keying & Polarized Position Locations 0 | PCB Mount Orientation Vertical | Contact Features: Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Tin | Contact Mating A | Other | 8-5530843-3 |
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1930840000
Weidmüller
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1 | PCB connector (board connection), 630 V, 57 A, Pitch in mm: 7.62, Number of poles: 4, THT solder connection, Box | Other | 1930840000 |
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1719730840
Molex
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1 | Nano-Fit Right-Angle Header, Through Hole, 2.50mm Pitch, Dual Row, 40 Circuits, Black, Glow-Wire Capable | Other | 1719730840 |
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110-93-308-41-001000
Mill-Max
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1 | MILL MAX - 110-93-308-41-001000 - DIP SOCKET, 8 POSITION, THROUGH HOLE | Dual-In-Line Sockets | 110-93-308-41-001000 |
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DE 158-TU-30/8,4
Display Elektronik
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1 | Display: LCD; 7-segment; STN Positive; No.of dig: 4; 94x45.7x1.1mm | Other | DE 158-TU-30/8,4 |
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5-5530843-3
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Keying & Polarized Position Locations 0 | PCB Mount Orientation Vertical | Number of Power Positions 34 | Number of Dual Positions 17 | Number of Positions 34 | Number of Signal Positions 0 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Base Material Phosphor Bronze | PCB Contact Termination Area Plating Material Tin | Conta | Other | 5-5530843-3 |
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