0508- Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	TSW-105-08-L-D-RA-008 SAMTEC	1	CONN HEADER 10 POS .100"	Header, Unshrouded - Right Angle PTH Pin	TSW-105-08-L-D-RA-008	3D model available Symbol and footprint available 3	1 Download Model
	WLTC0508RLR002FNR LITTELFUSE	1	WLTC0508RLR002FNR	Resistor Chip	WLTC0508RLR002FNR	3D model available Symbol and footprint available 3	1 Download Model
	TSW-105-08-F-S-RA SAMTEC	1	Samtec TSW, 2.54mm Pitch, 5 Way, 1 Row PCB Terminal Block Header, Through Hole	Header, Unshrouded - Right Angle PTH Pin	TSW-105-08-F-S-RA	3D model available Symbol and footprint available 3	1 Download Model
	885012205085R Würth Elektronik	1	Multilayer Ceramic Chip Capacitor WCAP-CSGP Series 0402 40pF X7R0402104K025DFCT20000	Capacitor Chip Non-polarised	885012205085R	3D model available Symbol and footprint available 3	1 Download Model

	1830508 Phoenix Contact	1	PCB header, nominal cross section: 1.5 mm?, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Tin, type of contact: Female connector, Number of potentials: 11, Number of rows: 1, Number of positions per row: 11, number of connections: 11, product range: IMC 1,5/..-G-THR, pitch: 3.5 mm, mounting: THR soldering, pin layout: Linear double pinning, solder pin [P]: 2 mm, Stecksystem: MINI COMBICON, Locking: without, type of packaging: packed in cardboard	Other	1830508	3D model available Symbol and footprint available 3	1 Download Model
	2-1445050-8 TE Connectivity	1	Configuration Features: Number of Rows 1 \| Number of Power Positions 8 \| PCB Mount Orientation Vertical \| Number of Positions 8 \| Contact Features: PCB Contact Termination Area Plating Material Tin \| Multiple Contact Types Without \| Contact Current Rating (Max) 5 AMP \| Contact Mating Area Plating Material Tin \| Contact Mating Area Plating Material Thickness 2.54 â€“ 7.62 MICM \| PCB Contact Termination Area Plating Material Thickness 100 MICIN \| Contact Layout Inline \| Contact Mating Area Plating Material Th	Other	2-1445050-8	3D model available Symbol and footprint available 3	1 Download Model
	250-508/000-012 Wago	1	PCB terminal block; push-button; 1.5 mm²; Pin spacing 5 mm; 8-pole; Push-in CAGE CLAMP®	Other	250-508/000-012	3D model available Symbol and footprint available 3	1 Download Model
	TPP60508L1-DF9R 3Peak Incorporated	1	Buck Switching Regulator IC Positive Fixed 10-DFN (4x4)	Small Outline No-lead	TPP60508L1-DF9R	3D model available Symbol and footprint available 3	1 Download Model
	TSW-105-08-H-S SAMTEC	1	5 Position, Single Row, Classic PCB Header Strips, 0.100" pitch	Other	TSW-105-08-H-S	3D model available Symbol and footprint available 3	1 Download Model
	ERM8-005-08.0-TL-DV-K-TR SAMTEC	1	10 Position Connector Header, Center Strip Contacts Surface Mount	Other	ERM8-005-08.0-TL-DV-K-TR	3D model not available Symbol and footprint available 2	1 Download Model
	MGN1S0508MC-R13 Murata Electronics	1	DC-DC 1W SM 5-8V GAN	Other	MGN1S0508MC-R13	3D model available Symbol and footprint available 3	1 Download Model
	ME030-50812 Multicomp Pro	1	Terminal Block, Header, 5.08 mm, 12 Positions, 16 A, 300 V, Through Hole Right Angle	Other	ME030-50812	3D model available Symbol and footprint available 3	1 Download Model
	TSW-105-08-G-D SAMTEC	1	CONN HEADER 10 POS .100"	Header, Vertical	TSW-105-08-G-D	3D model available Symbol and footprint available 3	1 Download Model
	1705081 Phoenix Contact	1	PCB terminal block for tin-plated stranded cables, e.g., type PV 1-F, nominal current: 41 A, 1-pos., connection method: spring-cage connection, mounting: THT/THR, user information on through hole reflow technology can be found at: combicon.com	Other	1705081	3D model available Symbol and footprint available 3	1 Download Model
	TSW-105-08-G-D-RA SAMTEC	1	CONN HEADER 10 POS .100"	Header, Unshrouded - Right Angle PTH Pin	TSW-105-08-G-D-RA	3D model available Symbol and footprint available 3	1 Download Model

	WLTC0508QLR003FNR LITTELFUSE	1	WLTC0508QLR003FNR	Resistor Chip	WLTC0508QLR003FNR	3D model available Symbol and footprint available 3	1 Download Model
	TSW-205-08-L-S-RA SAMTEC	1	CONN HEADER 5 POS .200"	Header, Unshrouded - Right Angle PTH Pin	TSW-205-08-L-S-RA	3D model available Symbol and footprint available 3	1 Download Model
	TSW-105-08-T-T-RA SAMTEC	1	CONN HEADER 15 POS .100"	Header, Unshrouded - Right Angle PTH Pin	TSW-105-08-T-T-RA	3D model available Symbol and footprint available 3	1 Download Model
	WLTC0508QLR005FNR LITTELFUSE	1	WLTC0508QLR005FNR	Resistor Chip	WLTC0508QLR005FNR	3D model available Symbol and footprint available 3	1 Download Model
	HI3-0508A-5Z Renesas Electronics	1	The HI-506A, HI-507A, HI-508A and HI-509A are analog multiplexers with active overvoltage protection. Analog input levels may greatly exceed either power supply without damaging the device or disturbing the signal path of other channels. Active protection circuitry assures that signal fidelity is maintained even under fault conditions that would destroy other multiplexers. Analog inputs can withstand constant 70VP-P levels with ±15V supplies. Digital inputs will also sustain continuous faults up to 4V great	Dual-In-Line Packages	HI3-0508A-5Z	3D model available Symbol and footprint available 3	1 Download Model
	CU4S0508BC-3650-00 TDK	1	Audio Transformers / Signal Transformers 3650MHz Circulator CCW Circulation	Other	CU4S0508BC-3650-00	3D model available Symbol and footprint available 3	1 Download Model
	CU4S0508BT-3450-00 TDK	1	Isolators / Circulators, Center Freq.=3450MHz, Handling Power=5W max	Other	CU4S0508BT-3450-00	3D model available Symbol and footprint available 3	1 Download Model
	CU4S0508BT-3600-00 TDK	1	Isolators / Circulators, Center Freq.=3600MHz, Handling Power=5W max	Other	CU4S0508BT-3600-00	3D model available Symbol and footprint available 3	1 Download Model
	TSW-105-08-S-S-RA SAMTEC	1	CONN HEADER 5 POS .100"	Header, Unshrouded - Right Angle PTH Pin	TSW-105-08-S-S-RA	3D model available Symbol and footprint available 3	1 Download Model
	HI9P0508-5Z96 Renesas Electronics	1	The HI-506/HI-507 and HI-508/HI-509 monolithic CMOS multiplexers each include an array of sixteen and eight analog switches respectively, a digital decoder circuit for channel selection, voltage reference for logic thresholds, and an enable input for device selection when several multiplexers are present. The Dielectric Isolation (DI) process used in fabrication of these devices eliminates the problem of latchup. DI also offers much lower substrate leakage and parasitic capacitance than conventional junctio	Small Outline Packages	HI9P0508-5Z96	3D model available Symbol and footprint available 3	1 Download Model
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