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Technical Content

144-5 Model Download Search Results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image
2-1445091-3 TE Connectivity
1 Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 3 | Number of Positions 3 | Number of Rows 1 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Type Pin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thic Other 2-1445091-3
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
2-1445054-2 TE Connectivity
1 Configuration Features: Number of Positions 2 | Number of Power Positions 2 | Number of Rows 1 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Tin | Contact Type Pin | PCB Contac Other 2-1445054-2
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
2-1445098-4 TE Connectivity
1 Configuration Features: Number of Rows 1 | Number of Power Positions 4 | Number of Positions 4 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Gold | Contact Layout Inline | Multiple Contact Types Without | Contact Type Pin | Contact Mating A Other 2-1445098-4
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
2-1445055-7 TE Connectivity
1 Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 7 | Number of Positions 7 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Wit Other 2-1445055-7
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
2-1445052-2 TE Connectivity
1 Configuration Features: PCB Mount Orientation Vertical | Number of Positions 2 | Number of Rows 1 | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contac Other 2-1445052-2
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
2-1445085-3 TE Connectivity
1 Configuration Features: Number of Positions 3 | Number of Rows 1 | PCB Mount Orientation Vertical | Number of Power Positions 3 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness .38 MICM | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickn Other 2-1445085-3
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
2-1445050-3 TE Connectivity
1 Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 3 | Number of Power Positions 3 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Layout Inline | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Retention Within Housing Withou Other 2-1445050-3
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
2-1445055-3 TE Connectivity
1 Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Power Positions 3 | Number of Positions 3 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Layout Inline | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating M Other 2-1445055-3
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
ROB-14450 SparkFun
1 Power Management IC Development Tools SparkFun MotorDriver Dual TB6612FNG Head. Other ROB-14450
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
1-1445088-0 TE Connectivity
1 CONN HEADER R/A 10POS 3MM Other 1-1445088-0
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
EPM7256AETC144-5 Intel
1 IC CPLD 256MC 5.5NS 144TQFP Quad Flat Packages EPM7256AETC144-5
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
BFCN-1445+ Mini-Circuits
1 Signal Conditioning BANDPASS FLTR / SURF MT / RoHS Other BFCN-1445+
3D model not available
Symbol and footprint available
 2
1 Download Model
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214-4541 Weidmüller
1 OMNIMATE Power - series BU/SU 10.16HP SU 10.16HP/03/90G 3.5AG BK BX Other 214-4541
3D model available
Symbol and footprint available
 3
1 Download Model
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10144518-062802LF Amphenol
1 BergStak® Lite 0.80mm, Board-to-Board Connector, 60 Positions, Dual Row, Vertical Header. Other 10144518-062802LF
3D model not available
Symbol and footprint available
 2
1 Download Model
Part Image Part Image
ADUM1445ARSZ-RL7 Analog Devices
1 Digital Isolators Micro-power Quad-CH Digital Isolator Small Outline Packages ADUM1445ARSZ-RL7
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
TMS-144-54-L-S SAMTEC
1 44 Position, Single-Row .050" x .100" Micro Terminal Strip Other TMS-144-54-L-S
3D model not available
Symbol and footprint available
 2
1 Download Model
Part Image Part Image
ADUM1445ARQZ-RL7 Analog Devices
1 Digital Isolators Micro-power Quad-CH Digital Isolator Small Outline Packages ADUM1445ARQZ-RL7
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
2-1445098-8 TE Connectivity
1 Connector Header Through Hole, Right Angle 8 position 0.118" (3.00mm) Other 2-1445098-8
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
TMS-144-59-F-S SAMTEC
1 44 Position, Single-Row .050" x .100" Micro Terminal Strip Other TMS-144-59-F-S
3D model not available
Symbol and footprint available
 2
1 Download Model
Part Image Part Image
TMS-144-58-G-S SAMTEC
1 44 Position, Single-Row .050" x .100" Micro Terminal Strip Other TMS-144-58-G-S
3D model not available
Symbol and footprint available
 2
1 Download Model
Part Image Part Image
21433814451 HARTING
1 Circular connectors M12, R/A, 4P Other 21433814451
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
2-1445097-3 TE Connectivity
1 Configuration Features: Number of Power Positions 3 | Number of Positions 3 | PCB Mount Orientation Right Angle | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | Contact Retention Within Housing Other 2-1445097-3
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
14450R-500 Renesas Electronics
1 The FT 6050 Smart Transceiver system on chip (SoC) combines a high-performance Neuron® core with a Free Topology transceiver on a single chip to facilitate the design of Industrial Internet of Things (IIoT) devices and consolidate smart control networks. The FT 6050 is a key product in the IzoT® platform — the most comprehensive and open control networking platform for the IIoT. The device natively supports both BACnet and LON communications on the same network and offers compatibility with the large instal Quad Flat No-Lead 14450R-500
3D model available
Symbol and footprint available
 3
1 Download Model
Part Image Part Image
TMS-144-52-FM-S SAMTEC
1 44 Position, Single-Row .050" x .100" Micro Terminal Strip Other TMS-144-52-FM-S
3D model not available
Symbol and footprint available
 2
1 Download Model
Part Image Part Image
TMS-144-52-G-S SAMTEC
1 44 Position, Single-Row .050" x .100" Micro Terminal Strip Other TMS-144-52-G-S
3D model not available
Symbol and footprint available
 2
1 Download Model
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