2-170 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	2170630047 Molex	1	Micro-One Wire-to-Board Header, Vertical, 2.00mm Pitch, Single Row, Glow-Wire Capable, 4 Circuits, Black, with Potting Capability, with Cover Tape	Other	2170630047	3D model available Symbol and footprint available 3	1 Download Model
	B72510E2170K062 TDK	1	Chip Varistors / Ceramic Transient Voltage Suppressors, Maximum continuous voltage=22V, Maximum Clamping Voltage (8/20?s)=50V	Varistors Chip	B72510E2170K062	3D model available Symbol and footprint available 3	1 Download Model
	B72510E2170K062 TDK	1	Chip Varistors / Ceramic Transient Voltage Suppressors, Maximum continuous voltage=22V, Maximum Clamping Voltage (8/20?s)=50V	Varistors Chip	B72510E2170K062	3D model available Symbol and footprint available 3	1 Download Model
	SiT9121_7.0x5.0 SiTime	1	1 MHz to 220 MHz Ultra-low Jitter Differential Oscillator 7.0 x 5.0 x 1 mm	Other	SiT9121_7.0x5.0	3D model available Symbol and footprint available 3	1 Download Model

	ST02-170F1-5073 Shindengen Electric Manufacturing Co., Ltd.	1	・TVS・Peak pulse power:200W・Small SMD・Available for automotive use・Pb free terminal・RoHS:Yes	Other	ST02-170F1-5073	3D model available Symbol and footprint available 3	1 Download Model
	LMZ21701SILR Texas Instruments	1	3V to 17V, 1A Step-Down DC/DC Power Module in 3.5mm × 3.5mm Package	Other	LMZ21701SILR	3D model not available Symbol and footprint available 2	1 Download Model
	LMZ21700SILT Texas Instruments	1	3V to 17V, 0.65A Step-Down DC/DC Power Module in 3.5mm × 3.5mm Package	Other	LMZ21700SILT	3D model not available Symbol and footprint available 2	1 Download Model
	OPA2170AIDSGT Texas Instruments	1	36V, microPower, Rail-to-Rail Output, Dual, General Purpose Op Amp in microPackage	Small Outline No-lead	OPA2170AIDSGT	3D model available Symbol and footprint available 3	1 Download Model
	MAL217058471E3 Vishay	1	Aluminum Electrolytic Capacitors - Radial Leaded 470uF 63V 20% 12.5 x 25	Capacitor, Polarized Radial Diameter	MAL217058471E3	3D model available Symbol and footprint available 3	1 Download Model
	5962-9221701MRA Texas Instruments	1	Latches Octal Transparent D-Type Latches with 3-State Outputs 20-CDIP -55 to 125	Ceramic Dual-In-Line Packages	5962-9221701MRA	3D model not available Symbol and footprint available 2	1 Download Model
	32.21.7.012.2000 FINDER	1	Finder SPDT Non-Latching Relay PCB Mount, 12V dc Coil, 6 A	Other	32.21.7.012.2000	3D model available Symbol and footprint available 3	1 Download Model
	C0402C103K5RAC31217042 KEMET	1	Cap Ceramic 0.01uF 50V X7R 10% Pad SMD 0402 125°C	Capacitor Chip Non-polarised	C0402C103K5RAC31217042	3D model available Symbol and footprint available 3	1 Download Model
	MAL217056102E3 Vishay	1	Aluminium Electrolytic Capacitors - Radial Leaded 1000uF 20% 25V 12.5 x 20	Capacitor, Polarized Radial Diameter	MAL217056102E3	3D model available Symbol and footprint available 3	1 Download Model
	217006SE Linkman	1	6 pin box type header	Header, Shrouded - Straight PTH Box	217006SE	3D model available Symbol and footprint available 3	1 Download Model
	DEA202170LT-5071A1 TDK	1	Filters, Pass Band=699 to 2170MHz, Zc=50se \| 50se	Other	DEA202170LT-5071A1	3D model available Symbol and footprint available 3	1 Download Model

	1217062-1 TE Connectivity	1	Configuration Features: Connection Capacity Single \| Contact Features: PCB Contact Termination Area Plating Material Thickness 150 MICIN \| PCB Contact Termination Area Plating Material Thickness 3.81 MICM \| Mating Tab Width 4.75 MM \| Contact Underplating Material Nickel \| PCB Terminal Type Tab \| Contact Mating Area Plating Material Thickness 150 MICIN \| Terminal Size 4.75 \| Terminal Plating Material Tin \| Contact Underplating Material Thickness 50 MICIN \| Contact Underplating Material Thickness 1.27 MICM \|	Other	1217062-1	3D model available Symbol and footprint available 3	1 Download Model
	1217080-1 TE Connectivity	1	Configuration Features: Connection Capacity Single \| Contact Features: Terminal Size 5.2 \| Mating Tab Thickness .81 MM \| PCB Contact Termination Area Plating Material Thickness 100 MICIN \| Terminal Size 6.35 \| Mating Tab Width 5.21 MM \| Contact Mating Area Plating Material Thickness 100 MICIN \| Contact Underplating Material Thickness 100 MICIN \| Contact Underplating Material Copper \| Contact Underplating Material Thickness 1.27 MICM \| Contact Underplating Material Thickness 2.54 MICM \| Mating Tab Width .25	Other	1217080-1	3D model available Symbol and footprint available 3	1 Download Model
	2170640071 Molex	1	Micro-One Wire-to-Board Header, Right-Angle, 2.00mm Pitch, Single Row, Glow-Wire Capable, 7 Circuits	Other	2170640071	3D model available Symbol and footprint available 3	1 Download Model
	5962-9221703MRA Renesas Electronics	1	The 5962-92217 (equivalent to IDT 54FCT373T) is an octal transparent latch with 3-state outputs and is intended for bus oriented applications. The flip-flops appear transparent to the data when Latch Enable (LE) is high. When LE is low, the data that meets the set-up time is latched. The 5962-92217 operates at -55C to +125C. (For commercial version, see 74FCT373T)	Ceramic Dual-In-Line Packages	5962-9221703MRA	3D model not available Symbol and footprint available 2	1 Download Model
	232-170/039-000 Wago	1	THT female header; straight; Pin spacing 5.08 mm; 10-pole; Locking lever; 0.6 x 1.0 mm solder pin	Other	232-170/039-000	3D model available Symbol and footprint available 3	1 Download Model
	1217056-1 TE Connectivity	1	Contact Features: Terminal Plating Material Tin \| Mating Tab Width .25 INCH \| PCB Contact Termination Area Plating Material Thickness 150 MICIN \| Mating Tab Width 6.35 MM \| Contact Mating Area Plating Material Thickness 3.81 MICM \| Contact Underplating Material Thickness 2.54 MICM \| Contact Underplating Material Thickness 100 MICIN \| Contact Underplating Material Brass \| Contact Mating Area Plating Material Thickness 150 MICIN \| Mating Tab Thickness .81 MM \| Terminal Orientation Straight \| PCB Terminal Type	Other	1217056-1	3D model available Symbol and footprint available 3	1 Download Model
	SI51214-B12170-GM Silicon Labs	1	Two Output Factory Programmable Clock Generator, TDFN6	Small Outline No-lead	SI51214-B12170-GM	3D model available Symbol and footprint available 3	1 Download Model
	2170704-5 TE Connectivity	1	Body Features: Heat Sink Height Class SAN \| Heat Sink Height .256 INCH \| Heat Sink Style Pin \| Heat Sink Finish Anodized Black \| Configuration Features: Port Matrix Configuration 1 x 1 \| Number of Ports 1 \| Number of Rear EONs per Port Column 0 \| Contact Features: PCB Contact Termination Area Plating Material Tin \| Dimensions: PCB Thickness (Recommended) .062 INCH \| PCB Thickness (Recommended) 1.57 MM \| Electrical Characteristics: Data Rate (Max) 28 GBS \| Housing Features: Cage Material Nickel Silver \| Indu	Other	2170704-5	3D model available Symbol and footprint available 3	1 Download Model
	H2170-05 Harwin	1	Ø1mm Terminal Pin, 13.2mm high, for 1.6mm panel thickness, gold	Other	H2170-05	3D model available Symbol and footprint available 3	1 Download Model
	LTC2170CUKG-12PBF Analog Devices	0	80Msps Low Power Quad ADCs	Other	LTC2170CUKG-12PBF	3D model available Symbol and footprint available 3	1 Download Model
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