2132. Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	UPTF2512-2W-N-2132CT Venkel	1	Ultra Precision Thin Film CR,2512,1/2W,?10PPM,21.3K,?0.25%	Other	UPTF2512-2W-N-2132CT	3D model available Symbol and footprint available 3	1 Download Model
	SiT1421_3.2 x 2.5 SiTime	1	XCalibur High frequency, -55°C to 125°C Active Resonator Drop-In Replacement for 4-pin SMD XTAL	Other	SiT1421_3.2 x 2.5	3D model available Symbol and footprint available 3	1 Download Model
	2132273471 Molex	1	1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Dual Row, Surface Mount, Vertical, 0.76µm Gold (Au) Plating, 34 Circuits, Black	Other	2132273471	3D model available Symbol and footprint available 3	1 Download Model
	UPTF2512-2W-N-2132DT Venkel	1	Ultra Precision Thin Film CR,2512,1/2W,?10PPM,21.3K,?0.5%	Other	UPTF2512-2W-N-2132DT	3D model available Symbol and footprint available 3	1 Download Model

	2132272430 Molex	1	1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Dual Row, Surface Mount, Vertical, 0.38µm Gold (Au) Plating, 24 Circuits, Natural	Other	2132272430	3D model available Symbol and footprint available 3	1 Download Model
	2132260871 Molex	1	1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Surface Mount, Right-Angle, 0.76µm Gold (Au) Plating, 8 Circuits, Black	Other	2132260871	3D model available Symbol and footprint available 3	1 Download Model
	R5F21321MNSP#30 Renesas Electronics	1	The R8C/32M Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32M Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow	Small Outline Packages	R5F21321MNSP#30	3D model available Symbol and footprint available 3	1 Download Model
	2132272631 Molex	1	1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Dual Row, Surface Mount, Vertical, 0.38µm Gold (Au) Plating, 26 Circuits, Black	Other	2132272631	3D model available Symbol and footprint available 3	1 Download Model
	TFCR1206-8W-C-2132CT Venkel	1	Thin Film CR,1206,1/8W,?50PPM,21.3K,?0.25%	Other	TFCR1206-8W-C-2132CT	3D model available Symbol and footprint available 3	1 Download Model
	2132273010 Molex	1	1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Dual Row, Surface Mount, Vertical, 0.10µm Gold (Au) Plating, 30 Circuits, Natural	Other	2132273010	3D model available Symbol and footprint available 3	1 Download Model
	R5F21322DDSP#54 Renesas Electronics	1	The R8C/32D Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32D Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow	Small Outline Packages	R5F21322DDSP#54	3D model available Symbol and footprint available 3	1 Download Model
	TFCR2010-4W-C-2132DT Venkel	1	Thin Film CR,2010,1/4W,?50PPM,21.3K,?0.5%	Other	TFCR2010-4W-C-2132DT	3D model available Symbol and footprint available 3	1 Download Model
	2132272070 Molex	1	1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Dual Row, Surface Mount, Vertical, 0.76µm Gold (Au) Plating, 20 Circuits, Natural	Other	2132272070	3D model available Symbol and footprint available 3	1 Download Model
	09221326921222 HARTING	1	DIN 2B male angled 32pin, PL2, NFF F1-I2	Other	09221326921222	3D model available Symbol and footprint available 3	1 Download Model
	2132261131 Molex	1	1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Surface Mount, Right-Angle, 0.38µm Gold (Au) Plating, 11 Circuits, Black	Other	2132261131	3D model available Symbol and footprint available 3	1 Download Model

	2132280671 Molex	1	1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Dual Row, Surface Mount, Right-Angle, 6 Circuits, Natural	Other	2132280671	3D model not available Symbol and footprint available 2	1 Download Model
	2132261211 Molex	1	1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Surface Mount, Right-Angle, 0.10µm Gold (Au) Plating, 12 Circuits, Black	Other	2132261211	3D model available Symbol and footprint available 3	1 Download Model
	TFM-121-32-F-D-A-P-TR SAMTEC	1	High-Reliability Tiger Eye™ Terminal Strips, .050" Pitch	Other	TFM-121-32-F-D-A-P-TR	3D model not available Symbol and footprint available 2	1 Download Model
	TFCR0603-16W-C-2132DT Venkel	1	Thin Film CR,0603,1/16W,?50PPM,21.3K,?0.5%	Other	TFCR0603-16W-C-2132DT	3D model available Symbol and footprint available 3	1 Download Model
	TFM-121-32-SM-D-P SAMTEC	1	42 Position, High-Reliability Tiger Eye™ Terminal Strips, .050" Pitch, Surface Mount, Vertical	Other	TFM-121-32-SM-D-P	3D model not available Symbol and footprint available 2	1 Download Model
	2132281370 Molex	1	1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Dual Row, Surface Mount, Right-Angle, 13 Circuits, Natural	Other	2132281370	3D model not available Symbol and footprint available 2	1 Download Model
	G03V21322HR Amphenol Communications Solutions	1	164 (160 + 4 Power) Position Female Connector PCI Express™ Gold Black	Other	G03V21322HR	3D model available Symbol and footprint available 3	1 Download Model
	2132280410 Molex	1	1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Dual Row, Surface Mount, Right-Angle, 4 Circuits, Natural	Other	2132280410	3D model not available Symbol and footprint available 2	1 Download Model
	R5F21322DNSP#54 Renesas Electronics	1	The R8C/32D Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32D Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow	Small Outline Packages	R5F21322DNSP#54	3D model available Symbol and footprint available 3	1 Download Model
	SL612132GECO Fischer Elektronik GmbH & Co. KG	1	male header	Other	SL612132GECO	3D model available Symbol and footprint available 3	1 Download Model
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