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Technical Content

21325 Model Download Search Results

Showing 25 of 2105 results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image
2132592-1 TE Connectivity
1 IMP100O,HMP,V3P8C,UG,REW46,4.9 2132592-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132541-1 TE Connectivity
1 IMP100S,H,V3P6C,UG,REW39,4.5 2132541-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132571-1 TE Connectivity
1 IMP100O,HMP,V3P6C,RG,OEW46,4.9 2132571-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132585-1 TE Connectivity
1 IMP100O,HMP,V3P8C,LG,OEW46,4.9 2132585-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132588-2 TE Connectivity
1 IMP100O,HMP,V3P8C,RG,LEW46,5.5 2132588-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132573-2 TE Connectivity
1 IMP100O,HMP,V3P6C,UG,OEW46,5.5 2132573-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132572-2 TE Connectivity
1 IMP100O,HMP,V3P6C,RG,LEW46,5.5 2132572-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132576-3 TE Connectivity
1 IMP100,O,H,V3P6C,UG,REW46 2132576-3
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132590-1 TE Connectivity
1 IMP100O,HMP,V3P8C,UG,LEW46,4.9 2132590-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132589-2 TE Connectivity
1 IMP100O,HMP,V3P8C,UG,OEW46,5.5 2132589-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132576-1 TE Connectivity
1 IMP100O,HMP,V3P6C,UG,REW46,4.9 2132576-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132571-2 TE Connectivity
1 IMP100O,HMP,V3P6C,RG,OEW46,5.5 2132571-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132587-1 TE Connectivity
1 IMP100O,HMP,V3P8C,RG,OEW46,4.9 2132587-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
21325LFBD Custom Components Inc
1 Diode, 21325LFBD
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132565-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Guide Location Unguided | Number of Pairs 18 | PCB Mount Orientation Vertical | Number of Positions 54 | Stackable No | Number of Rows 9 | Backplane Architecture Orthogonal | Number of Signal Positions 36 | Number of Columns 6 | Number of Ground Positions 18 | Contact Features: PCB Contact Termination Area Plating Material Thickness .76 – 1.52 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Layout Inline | Con 2132565-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132528-3 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Ground Positions 18 | Number of Signal Positions 36 | Number of Positions 54 | Guide Location Left | PCB Mount Orientation Vertical | Stackable No | Number of Pairs 18 | Number of Rows 9 | Number of Columns 6 | Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Shape & Form Dual Beam | Contact Type Pin | PCB Contact Termination Area Plating Material Finish Matte | Contact Underplating Material Nickel | 2132528-3
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132563-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Backplane Architecture Orthogonal | PCB Mount Orientation Vertical | Stackable No | Number of Pairs 18 | Number of Positions 54 | Number of Ground Positions 18 | Number of Columns 6 | Number of Signal Positions 36 | Guide Location Right | Number of Rows 9 | Contact Features: Contact Current Rating (Max) .75 AMP | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Thickness .76 – 1.52 MICM | Contact Matin 2132563-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132594-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Guide Location Left | Number of Pairs 24 | Number of Positions 72 | Stackable No | Backplane Architecture Orthogonal | Number of Signal Positions 48 | PCB Mount Orientation Vertical | Number of Rows 12 | Number of Ground Positions 24 | Number of Columns 6 | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Thickness .76 – 1.52 MICM | Contact Mating Area Plating Material Gold | Contact Mating Area Length 4 2132594-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132566-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Guide Location Unguided | Number of Signal Positions 36 | Number of Ground Positions 18 | Number of Pairs 18 | PCB Mount Orientation Vertical | Stackable No | Number of Columns 6 | Number of Positions 54 | Number of Rows 9 | Backplane Architecture Orthogonal | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) .75 AMP | Contact Mating Area Length 4.9 MM | Contact Base Material Copper Ni 2132566-2
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132597-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Columns 6 | Number of Positions 72 | Number of Ground Positions 24 | Number of Pairs 24 | Guide Location Unguided | Backplane Architecture Orthogonal | PCB Mount Orientation Vertical | Number of Signal Positions 48 | Number of Rows 12 | Stackable No | Contact Features: Contact Underplating Material Nickel | Contact Mating Area Length .217 INCH | PCB Contact Termination Area Plating Material Thickness 30 – 60 MICIN | Contact Mat 2132597-2
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132535-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Guide Location Unguided | Number of Rows 9 | Number of Pairs 18 | Number of Positions 54 | Number of Signal Positions 36 | Stackable No | Number of Ground Positions 18 | Number of Columns 6 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) .75 AMP | PCB Contact Termination Area Plating Material Thickness 1.27 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 50 MICIN | Co 2132535-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132534-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Ground Positions 18 | Number of Positions 54 | Guide Location Unguided | Number of Columns 6 | Number of Rows 9 | Number of Signal Positions 36 | Number of Pairs 18 | Stackable No | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Shape & Form Dual Beam | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Length .193 INCH | PCB Contact Termin 2132534-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132577-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Signal Positions 48 | PCB Mount Orientation Vertical | Number of Ground Positions 24 | Number of Columns 8 | Guide Location Left | Stackable No | Number of Rows 9 | Number of Pairs 24 | Backplane Architecture Orthogonal | Number of Positions 72 | Contact Features: Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .75 AMP | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Underplating Mat 2132577-2
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132593-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Pairs 24 | Guide Location Left | Number of Ground Positions 24 | Number of Rows 12 | Number of Positions 72 | Backplane Architecture Orthogonal | Number of Signal Positions 48 | Number of Columns 6 | PCB Mount Orientation Vertical | Stackable No | Contact Features: PCB Contact Termination Area Plating Material Finish Matte | Contact Current Rating (Max) .75 AMP | PCB Contact Termination Area Plating Material Thickness .76 – 1.5 2132593-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132578-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Pairs 24 | Guide Location Left | Number of Positions 72 | Number of Columns 8 | Number of Ground Positions 24 | Number of Rows 9 | PCB Mount Orientation Vertical | Backplane Architecture Orthogonal | Stackable No | Number of Signal Positions 48 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | PCB Contact Termination Area Plating Material Finish Matte | Contact Shape & Form Dual Beam | Contact Under 2132578-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
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