21983 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Prices / Stock	Model	Action
	2198339-1 TE Connectivity	1	Configuration Features: Lightpipe Style Standard \| Number of Positions 240 \| Number of Ports 12 \| Port Matrix Configuration 2 x 6 \| Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN \| Contact Mating Area Plating Material Thickness .76 MICM \| Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel \| Tail Plating Material Tin \| Dimensions: PCB Thickness (Recommended) 1.5 MM \| PCB Thickness (Recommended) .059 INCH \| Electrical Characteristics: Data Rate (Max) 32	2198339-1	3D model available Symbol and footprint not available 1	1 Download Model
	2198339-7 TE Connectivity	1	Configuration Features: Number of Positions 240 \| Lightpipe Style Standard \| Port Matrix Configuration 2 x 6 \| Number of Ports 12 \| Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel \| Contact Mating Area Plating Material Thickness .76 MICM \| Contact Mating Area Plating Material Thickness 29.92 MICIN \| Tail Plating Material Tin \| Dimensions: PCB Thickness (Recommended) 1.5 MM \| PCB Thickness (Recommended) .059 INCH \| Electrical Characteristics: Data Rate (Max) 32	2198339-7	3D model available Symbol and footprint not available 1	1 Download Model
	2198318-7 TE Connectivity	1	Configuration Features: Number of Positions 40 \| Number of Ports 2 \| Lightpipe Style Standard \| Port Matrix Configuration 2 x 1 \| Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel \| Tail Plating Material Tin \| Contact Mating Area Plating Material Thickness .76 MICM \| Contact Mating Area Plating Material Thickness 29.92 MICIN \| Dimensions: PCB Thickness (Recommended) .059 INCH \| PCB Thickness (Recommended) 1.5 MM \| Electrical Characteristics: Data Rate (Max) 32 G	2198318-7	3D model available Symbol and footprint not available 1	1 Download Model
	2198325-1 TE Connectivity	1	Configuration Features: Port Matrix Configuration 2 x 2 \| Number of Ports 4 \| Lightpipe Style Standard \| Number of Positions 80 \| Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel \| Tail Plating Material Tin \| Contact Mating Area Plating Material Thickness 29.92 MICIN \| Contact Mating Area Plating Material Thickness .76 MICM \| Dimensions: PCB Thickness (Recommended) .059 INCH \| PCB Thickness (Recommended) 1.5 MM \| Electrical Characteristics: Data Rate (Max) 32 G	2198325-1	3D model available Symbol and footprint not available 1	1 Download Model

	2198325-5 TE Connectivity	1	Configuration Features: Number of Ports 4 \| Number of Positions 80 \| Lightpipe Style Standard \| Port Matrix Configuration 2 x 2 \| Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel \| Contact Mating Area Plating Material Thickness .76 MICM \| Contact Mating Area Plating Material Thickness 29.92 MICIN \| Tail Plating Material Tin \| Dimensions: PCB Thickness (Recommended) .059 INCH \| PCB Thickness (Recommended) 1.5 MM \| Electrical Characteristics: Data Rate (Max) 32 G	2198325-5	3D model available Symbol and footprint not available 1	1 Download Model
	2198325-4 TE Connectivity	1	Configuration Features: Port Matrix Configuration 2 x 2 \| Lightpipe Style Standard \| Number of Ports 4 \| Number of Positions 80 \| Contact Features: Tail Plating Material Tin \| Contact Mating Area Plating Material Thickness .76 MICM \| Contact Mating Area Plating Material Thickness 29.92 MICIN \| Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel \| Dimensions: PCB Thickness (Recommended) .059 INCH \| PCB Thickness (Recommended) 1.5 MM \| Electrical Characteristics: Data Rate (Max) 32 G	2198325-4	3D model available Symbol and footprint not available 1	1 Download Model
	2198339-4 TE Connectivity	1	Configuration Features: Number of Ports 12 \| Lightpipe Style Standard \| Number of Positions 240 \| Port Matrix Configuration 2 x 6 \| Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel \| Contact Mating Area Plating Material Thickness .76 MICM \| Contact Mating Area Plating Material Thickness 29.92 MICIN \| Tail Plating Material Tin \| Dimensions: PCB Thickness (Recommended) .059 INCH \| PCB Thickness (Recommended) 1.5 MM \| Electrical Characteristics: Data Rate (Max) 32	2198339-4	3D model available Symbol and footprint not available 1	1 Download Model
	2198339-8 TE Connectivity	1	Configuration Features: Lightpipe Style Standard \| Number of Positions 240 \| Number of Ports 12 \| Port Matrix Configuration 2 x 6 \| Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN \| Tail Plating Material Tin \| Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel \| Contact Mating Area Plating Material Thickness .76 MICM \| Dimensions: PCB Thickness (Recommended) .059 INCH \| PCB Thickness (Recommended) 1.5 MM \| Electrical Characteristics: Data Rate (Max) 32	2198339-8	3D model available Symbol and footprint not available 1	1 Download Model
	2198339-3 TE Connectivity	1	Configuration Features: Lightpipe Style Standard \| Number of Ports 12 \| Number of Positions 240 \| Port Matrix Configuration 2 x 6 \| Contact Features: Contact Mating Area Plating Material Thickness .76 MICM \| Tail Plating Material Tin \| Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel \| Contact Mating Area Plating Material Thickness 29.92 MICIN \| Dimensions: PCB Thickness (Recommended) .059 INCH \| PCB Thickness (Recommended) 1.5 MM \| Electrical Characteristics: Data Rate (Max) 32	2198339-3	3D model available Symbol and footprint not available 1	1 Download Model
	2198318-1 TE Connectivity	1	Configuration Features: Number of Positions 40 \| Number of Ports 2 \| Port Matrix Configuration 2 x 1 \| Lightpipe Style Standard \| Contact Features: Contact Mating Area Plating Material Thickness .76 MICM \| Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel \| Contact Mating Area Plating Material Thickness 29.92 MICIN \| Tail Plating Material Tin \| Dimensions: PCB Thickness (Recommended) .059 INCH \| PCB Thickness (Recommended) 1.5 MM \| Electrical Characteristics: Data Rate (Max) 32 G	2198318-1	3D model available Symbol and footprint not available 1	1 Download Model
	U742198386 OTTO Engineering Inc	1	Pendant Switch, SPST, Momentary, Wire Terminal, Panel Mount	U742198386	3D model not available Symbol and footprint not available 0	0 Build or Request
	GUS-QS8A-021983-BG TT Electronics Resistors	1	Array/Network Resistor, Isolated, Tantalum Nitride/nickel Chrome, 0.1W, 198000ohm, 100V, 0.1% +/-Tol, -50,50ppm/Cel, 1915,	GUS-QS8A-021983-BG	3D model not available Symbol and footprint not available 0	0 Build or Request
	BLU2512-1983-DT15Q RCD Components Inc	1	Fixed Resistor, Thin Film, 1W, 198000ohm, 200V, 0.5% +/-Tol, 15ppm/Cel, 2512,	BLU2512-1983-DT15Q	3D model not available Symbol and footprint not available 0	0 Build or Request
	SIP-4769SD-02-1983DD TT Electronics Resistors	1	Array/Network Resistor, Isolated, Thin Film, 0.6W, 198000ohm, 100V, 0.5% +/-Tol, 50ppm/Cel, Through Hole Mount, 6007, SIP-6	SIP-4769SD-02-1983DD	3D model not available Symbol and footprint not available 0	0 Build or Request
	BLU2512-1983-QT50Q RCD Components Inc	1	Fixed Resistor, Thin Film, 1W, 198000ohm, 200V, 0.02% +/-Tol, 50ppm/Cel, 2512,	BLU2512-1983-QT50Q	3D model not available Symbol and footprint not available 0	0 Build or Request

	GUS-SL0ALF-02-1983-CF TT Electronics Resistors	1	Array/Network Resistor, Isolated, Tantalum Nitride/nickel Chrome, 0.1W, 198000ohm, 100V, 0.25% +/-Tol, -50,50ppm/Cel, 5030,	GUS-SL0ALF-02-1983-CF	3D model not available Symbol and footprint not available 0	0 Build or Request
	WBDDQSC-B-02-1983-D-D TT Electronics Resistors	1	Array/Network Resistor, Bussed, 0.05W, 198000ohm, 100V, 0.5% +/-Tol, -50,50ppm/Cel, 1109,	WBDDQSC-B-02-1983-D-D	3D model not available Symbol and footprint not available 0	0 Build or Request
	GUB-GL0BLF-02-1983-B-D TT Electronics Resistors	1	Array/Network Resistor, Bussed, Thin Film, 0.1W, 198000ohm, 0.1% +/-Tol, -50,50ppm/Cel, 5030,	GUB-GL0BLF-02-1983-B-D	3D model not available Symbol and footprint not available 0	0 Build or Request
	DIP1998SD021983BB TT Electronics Resistors	1	Array/Network Resistor, Bussed, 0.1W, 198000ohm, 100V, 0.1% +/-Tol, -50,50ppm/Cel, 8025,	DIP1998SD021983BB	3D model not available Symbol and footprint not available 0	0 Build or Request
	PCF-W2010-12-1983-D-E-LT TT Electronics Resistors	1	Fixed Resistor, Thin Film, 0.25W, 198000ohm, 150V, 0.5% +/-Tol, -10,10ppm/Cel, 1909,	PCF-W2010-12-1983-D-E-LT	3D model not available Symbol and footprint not available 0	0 Build or Request
	DIP1987021983DF TT Electronics Resistors	1	Array/Network Resistor, Bussed, 0.1W, 198000ohm, 100V, 0.5% +/-Tol, -50,50ppm/Cel, 7025,	DIP1987021983DF	3D model not available Symbol and footprint not available 0	0 Build or Request
	1421983 Phoenix Contact	1	Circular Connector,	1421983	3D model not available Symbol and footprint not available 0	0 Build or Request
	U712198314 OTTO Engineering Inc	1	Pendant Switch, SPST, Momentary, Wire Terminal, Panel Mount	U712198314	3D model not available Symbol and footprint not available 0	0 Build or Request
	FP-8989-02-1983-BA TT Electronics Resistors	1	Array/Network Resistor, Isolated, Tantalum Nitride/nickel Chrome, 0.05W, 198000ohm, 50V, 0.1% +/-Tol, -50,50ppm/Cel, 3825,	FP-8989-02-1983-BA	3D model not available Symbol and footprint not available 0	0 Build or Request
	12198378 Delphi Automotive LLP	1	Connector Accessory	12198378	3D model not available Symbol and footprint not available 0	0 Build or Request
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