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Technical Content

66003 Model Download Search Results

Showing 25 of 42028 results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image
6600383-9 TE Connectivity
1 Configuration Features: Number of Signal Positions 24 | Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Rows 4 | Number of Positions 32 | Contact Features: Contact Current Rating (Max) 42 AMP | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | PCB Contact Termination Area Plating Material Gold | Power Contact Base Material Tin | Contact Retention Within Housing Without | Contact Type Blade | Contact Type Pin | Contact Mating Area Plating Material Thickness 3 MI 6600383-9
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
6600333-5 TE Connectivity
1 Configuration Features: Number of Power Positions 4 | PCB Mount Orientation Vertical | Number of Positions 28 | Number of Rows 4 | Mating & Unmating Configuration Sequencing | Number of Signal Positions 24 | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Underplating Material Thickness 5.97 MICM | Contact Current Rating (Max) 42 AMP | Contact Mating Area Plating Material Thickness .076 MICM | Contact Type Blade | Contact Underplating Material Nickel | C 6600333-5
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
6600303-3 TE Connectivity
1 Configuration Features: Number of Power Positions 4 | Number of Rows 1 | Number of Positions 4 | PCB Mount Orientation Vertical | Contact Features: Contact Type Blade | Contact Underplating Material Nickel | Contact Underplating Material Thickness 5.74 MICM | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Current Rating (Max) 42 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness .076 MICM | Contact Mating Area Plating Material Gold Flash over Pa 6600303-3
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
6600393-1 TE Connectivity
1 Configuration Features: Number of Rows 1 | Number of Signal Positions 0 | Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness .076 MICM | Power Contact Base Material Tin | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Type Blade | PCB Contact Te 6600393-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
6600383-4 TE Connectivity
1 Configuration Features: Number of Power Positions 8 | Number of Positions 40 | Number of Signal Positions 32 | PCB Mount Orientation Vertical | Number of Rows 4 | Contact Features: Power Contact Base Material Tin | Contact Current Rating (Max) 42 AMP | Contact Type Pin | Contact Type Blade | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .076 MICM | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Base Material Copper Al 6600383-4
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
6600310-3 TE Connectivity
1 Board Connector, 36 Contact(s), 4 Row(s), Male, Straight, Solder Terminal 6600310-3
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
6600303-4 TE Connectivity
1 Board Connector 6600303-4
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
6600303-5 TE Connectivity
1 Configuration Features: Number of Power Positions 9 | Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 9 | Contact Features: Contact Mating Area Plating Material Thickness 3 MICIN | Contact Retention Within Housing Without | Contact Underplating Material Thickness 4.32 MICM | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Underplating Material Nickel | Power Contact Base Material Tin | Contact Current 6600303-5
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
6600303-2 TE Connectivity
1 Configuration Features: Number of Power Positions 4 | Number of Positions 4 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 42 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness .076 MICM | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Type Blade | Power Contact Base Mat 6600303-2
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
6600383-7 TE Connectivity
1 Configuration Features: Number of Signal Positions 24 | Number of Power Positions 8 | Number of Positions 32 | Number of Rows 4 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 42 AMP | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .076 MICM | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Underplating Material Nickel | Contact Base Material Copper Alloy | Contact Retention Within Hous 6600383-7
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
6600303-1 TE Connectivity
1 MBXL VERT HDR 8P 6600303-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
6600383-1 TE Connectivity
1 Configuration Features: Number of Signal Positions 32 | Number of Power Positions 12 | Number of Positions 44 | Number of Rows 4 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 3 MICIN | Contact Underplating Material Nickel | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness .076 MICM | Contact Type Blade | PCB Contact Termination Area Plating Material Gold | Contact Base Material Copper Alloy | Contact Mating Area P 6600383-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
6600333-7 TE Connectivity
1 Configuration Features: Number of Signal Positions 16 | Number of Power Positions 6 | PCB Mount Orientation Vertical | Number of Positions 22 | Number of Rows 4 | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Underplating Material Thickness 5.97 MICM | Contact Current Rating (Max) 42 AMP | Contact Underplating Material Nickel | Power Contact Base Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Type Blade | Cont 6600333-7
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
6600310-7 TE Connectivity
1 Configuration Features: Number of Power Positions 2 | Number of Signal Positions 16 | Number of Positions 18 | PCB Mount Orientation Vertical | Contact Features: Power Contact Base Material Tin | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness .076 MICM | Contact Current Rating (Max) 42 AMP | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Type Pin | Contact Underplating Material Thickness 5.97 MICM | Contact Mating Area Plating Material Gold Flash over P 6600310-7
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
6600303-3 TE Connectivity
1 Configuration Features: Number of Power Positions 4 | Number of Rows 1 | Number of Positions 4 | PCB Mount Orientation Vertical | Contact Features: Contact Type Blade | Contact Underplating Material Nickel | Contact Underplating Material Thickness 5.74 MICM | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Current Rating (Max) 42 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness .076 MICM | Contact Mating Area Plating Material Gold Flash over Pa 6600303-3
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
6600393-2 TE Connectivity
1 Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 3 | Number of Power Positions 3 | Number of Signal Positions 0 | Contact Features: Contact Mating Area Plating Material Thickness 3 MICIN | PCB Contact Termination Area Plating Material Tin | Power Contact Base Material Tin | Contact Type Blade | Contact Underplating Material Nickel | Contact Retention Within Housing Without | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Current 6600393-2
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
6600393-7 TE Connectivity
0 MBXL VERT HDR 6ACP STR 6600393-7
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
660032 HELUKABEL
1 Wire And Cable, 30V, Communication Cable, 660032
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
660033 HELUKABEL
1 Wire And Cable, 30V, Communication Cable, 660033
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
660031 HELUKABEL
1 Wire And Cable, 30V, Communication Cable, 660031
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
6600393-4 TE Connectivity
1 Configuration Features: Number of Positions 8 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Signal Positions 0 | Number of Power Positions 8 | Contact Features: Contact Mating Area Plating Material Thickness .076 MICM | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Current Rating (Max) 42 AMP | Contact Type Blade | PCB Contact Termination Area Plating Material Tin | Power Contact Base Material Tin | Contact Base Mater 6600393-4
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
6600393-3 TE Connectivity
1 Configuration Features: Number of Rows 1 | Number of Power Positions 6 | PCB Mount Orientation Vertical | Number of Positions 6 | Number of Signal Positions 0 | Contact Features: PCB Contact Termination Area Plating Material Tin | Power Contact Base Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness .076 MICM | Contact Current Rating (Max) 42 AMP | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Underplating Material Nicke 6600393-3
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
6600323-7 TE Connectivity
1 Configuration Features: Number of Rows 4 | Number of Positions 122 | PCB Mount Orientation Vertical | Number of Signal Positions 120 | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness .076 MICM | Power Contact Base Material Tin | Contact Type Blade | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Underplating Material Thickness 5.97 MICM | Contact Type Pin | Contact Mating Area Plating Material Gold Flash o 6600323-7
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
6600323-3 TE Connectivity
0 MBXL VERT HDR 24S+6P 6600323-3
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
1-6600303-1 TE Connectivity
1 MBXL VERT HDR 5ACP 1-6600303-1
3D model available
Symbol and footprint not available
 1
1 Download Model
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