HMB.1 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Prices / Stock	Model	Action
	D2541HMB-10P-WH-G30 CJT Changjiang Connectors Co Ltd	1	IDC Wire-to-Board Connector; 2.54mm (0.100 in) Pitch Disconnectable Insulation Displacement Connector,10 Positions,White,Gold; Temperature Range:: -40~+105º; RoHS: Yes; REACH: Yes	D2541HMB-10P-WH-G30	3D model not available Symbol and footprint not available 0	0 Build or Request
	D2541HMB-18P-WH-G30 CJT Changjiang Connectors Co Ltd	1	IDC Wire-to-Board Connector; 2.54mm (0.100 in) Pitch Disconnectable Insulation Displacement Connector,18 Positions,White,Gold; Temperature Range:: -40~+105º; RoHS: Yes; REACH: Yes	D2541HMB-18P-WH-G30	3D model not available Symbol and footprint not available 0	0 Build or Request
	D2541HMB-11P-GN-G30 CJT Changjiang Connectors Co Ltd	1	IDC Wire-to-Board Connector; 2.54mm (0.100 in) Pitch Disconnectable Insulation Displacement Connector,11 Positions,Green,Gold; Temperature Range:: -40~+105º; RoHS: Yes; REACH: Yes	D2541HMB-11P-GN-G30	3D model not available Symbol and footprint not available 0	0 Build or Request
	D2541HMB-19P-RD CJT Changjiang Connectors Co Ltd	1	IDC Wire-to-Board Connector; 2.54mm (0.100 in) Pitch Disconnectable Insulation Displacement Connector,19 Positions,Red; Temperature Range:: -40~+105º; RoHS: Yes; REACH: Yes	D2541HMB-19P-RD	3D model not available Symbol and footprint not available 0	0 Build or Request

	D2541HMB-15P-BL-G30 CJT Changjiang Connectors Co Ltd	1	IDC Wire-to-Board Connector; 2.54mm (0.100 in) Pitch Disconnectable Insulation Displacement Connector,15 Positions,Blue,Gold; Temperature Range:: -40~+105º; RoHS: Yes; REACH: Yes	D2541HMB-15P-BL-G30	3D model not available Symbol and footprint not available 0	0 Build or Request
	D2541HMB-11P-BL-G30 CJT Changjiang Connectors Co Ltd	1	IDC Wire-to-Board Connector; 2.54mm (0.100 in) Pitch Disconnectable Insulation Displacement Connector,11 Positions,Blue,Gold; Temperature Range:: -40~+105º; RoHS: Yes; REACH: Yes	D2541HMB-11P-BL-G30	3D model not available Symbol and footprint not available 0	0 Build or Request
	8183LHMB100GH040 Fenghua (HK) Electronics Ltd	1	Aluminum Electrolytic Capacitor, Polarized, Aluminum, 80V, 20% +Tol, 20% -Tol, 18000uF	8183LHMB100GH040	3D model not available Symbol and footprint not available 0	0 Build or Request
	8223LHMB120GHN3110 Fenghua (HK) Electronics Ltd	1	CAP,AL2O3,22MF,80VDC,20% -TOL,20% +TOL	8223LHMB120GHN3110	3D model not available Symbol and footprint not available 0	0 Build or Request
	S25FL512SAGBHMB10 Infineon Technologies AG	1	Flash	S25FL512SAGBHMB10	3D model not available Symbol and footprint not available 0	0 Build or Request
	HMB151KM3A Xiamen Wanming Electronics Co Ltd	1	Ceramic Capacitor, Ceramic, 10% +Tol, 10% -Tol, Y5P, 10% TC, 0.00015uF	HMB151KM3A	3D model not available Symbol and footprint not available 0	0 Build or Request
	8183LHMB100GHN3110 Fenghua (HK) Electronics Ltd	1	CAP,AL2O3,18MF,80VDC,20% -TOL,20% +TOL	8183LHMB100GHN3110	3D model not available Symbol and footprint not available 0	0 Build or Request
	1183LHMB100GSN3110 Fenghua (HK) Electronics Ltd	1	CAP,AL2O3,18MF,80VDC,20% -TOL,20% +TOL	1183LHMB100GSN3110	3D model not available Symbol and footprint not available 0	0 Build or Request
	HMB1131G00 TE Connectivity	1	RF Relay, DPDT, Momentary, 0.075A (Coil), 12VDC (Coil), 900mW (Coil), 2A (Contact), 28VDC (Contact), 1000MHz, DC Input, AC/DC Output, Panel Mount	HMB1131G00	3D model not available Symbol and footprint not available 0	0 Build or Request
	2223LHMB120GHN71E0 Fenghua (HK) Electronics Ltd	1	Aluminum Electrolytic Capacitor,	2223LHMB120GHN71E0	3D model not available Symbol and footprint not available 0	0 Build or Request
	2183LHMB100GHN1110 Fenghua (HK) Electronics Ltd	1	CAP,AL2O3,18MF,80VDC,20% -TOL,20% +TOL	2183LHMB100GHN1110	3D model not available Symbol and footprint not available 0	0 Build or Request

	HMB1FV-W Rectron Semiconductor	1	Bridge Rectifier Diode, 1 Phase, 0.5A, 100V V(RRM), Silicon	HMB1FV-W	3D model not available Symbol and footprint not available 0	0 Build or Request
	HMB151KG3R Xiamen Wanming Electronics Co Ltd	1	Ceramic Capacitor, Ceramic, 10% +Tol, 10% -Tol, Y5P, 10% TC, 0.00015uF	HMB151KG3R	3D model not available Symbol and footprint not available 0	0 Build or Request
	1223LHMB120GHN11E0 Fenghua (HK) Electronics Ltd	1	Aluminum Electrolytic Capacitor,	1223LHMB120GHN11E0	3D model not available Symbol and footprint not available 0	0 Build or Request
	L7CL185HMB12 LOGIC Devices Inc	1	Standard SRAM, 8KX8, 12ns, CMOS, CDIP28	L7CL185HMB12	3D model not available Symbol and footprint not available 0	0 Build or Request
	8333LHMB120GTN2850 Fenghua (HK) Electronics Ltd	1	CAP,AL2O3,33MF,80VDC,20% -TOL,20% +TOL	8333LHMB120GTN2850	3D model not available Symbol and footprint not available 0	0 Build or Request
	HMB121KD3R Xiamen Wanming Electronics Co Ltd	1	Ceramic Capacitor, Ceramic, 10% +Tol, 10% -Tol, Y5P, 10% TC, 0.00012uF	HMB121KD3R	3D model not available Symbol and footprint not available 0	0 Build or Request
	1273LHMB100GTN2850 Fenghua (HK) Electronics Ltd	1	CAP,AL2O3,27MF,80VDC,20% -TOL,20% +TOL	1273LHMB100GTN2850	3D model not available Symbol and footprint not available 0	0 Build or Request
	2273LHMB100GTN08F0 Fenghua (HK) Electronics Ltd	1	CAP,AL2O3,27MF,80VDC,20% -TOL,20% +TOL	2273LHMB100GTN08F0	3D model not available Symbol and footprint not available 0	0 Build or Request
	HMB102KG3B Xiamen Wanming Electronics Co Ltd	1	Ceramic Capacitor, Ceramic, 10% +Tol, 10% -Tol, Y5P, 10% TC, 0.001uF	HMB102KG3B	3D model not available Symbol and footprint not available 0	0 Build or Request
	8333LHMB120GTN4810 Fenghua (HK) Electronics Ltd	1	CAP,AL2O3,33MF,80VDC,20% -TOL,20% +TOL	8333LHMB120GTN4810	3D model not available Symbol and footprint not available 0	0 Build or Request
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