22145 Model Download Search Results

Showing 25 of 2531 results

Price & Stock Powered by Findchips

Filter by Manufacturer

Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image
2214514-3 TE Connectivity
1 Board Connector 2214514-3 0 Build or Request
Part Image Part Image
2214507-2 TE Connectivity
1 Board Connector 2214507-2 0 Build or Request
Part Image Part Image
2214508-2 TE Connectivity
1 Board Connector 2214508-2 0 Build or Request
Part Image Part Image
2214508-3 TE Connectivity
1 Board Connector 2214508-3 0 Build or Request
Part Image Part Image
2214501-6 TE Connectivity
1 Board Connector 2214501-6 0 Build or Request
Part Image Part Image
2214544-4 TE Connectivity
1 Board Connector 2214544-4 0 Build or Request
Part Image Part Image
2214516-6 TE Connectivity
1 Board Connector 2214516-6 0 Build or Request
Part Image Part Image
2214543-5 TE Connectivity
1 Board Connector 2214543-5 0 Build or Request
Part Image Part Image
2214505-3 TE Connectivity
1 Board Connector 2214505-3 0 Build or Request
Part Image Part Image
2214506-5 TE Connectivity
1 Board Connector 2214506-5 0 Build or Request
Part Image Part Image
2214514-1 TE Connectivity
1 IMP85S,H,V2P14C,UG,DEW39,4.5 2214514-1 0 Build or Request
Part Image Part Image
2214539-2 TE Connectivity
1 Board Connector 2214539-2 0 Build or Request
Part Image Part Image
2214542-5 TE Connectivity
1 Board Connector 2214542-5 0 Build or Request
Part Image Part Image
2214516-2 TE Connectivity
1 Board Connector 2214516-2 0 Build or Request
Part Image Part Image
2214593-1 TE Connectivity
1 Configuration Features: Number of Rear EONs per Port Column 3 | Port Matrix Configuration 2 x 2 | Number of Positions 152 | Number of Ports 4 | Contact Features: PCB Contact Termination Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Tin | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness 2214593-1 1 Download Model
Part Image Part Image
2214507-5 TE Connectivity
1 Board Connector 2214507-5 0 Build or Request
Part Image Part Image
2214514-6 TE Connectivity
1 Board Connector 2214514-6 0 Build or Request
Part Image Part Image
2214510-6 TE Connectivity
1 Board Connector 2214510-6 0 Build or Request
Part Image Part Image
2214512-2 TE Connectivity
1 Board Connector 2214512-2 0 Build or Request
Part Image Part Image
2214593-1 TE Connectivity
1 Telecom and Datacom Connector, 152 Contact(s), Press Fit Terminal 2214593-1 0 Build or Request
Part Image Part Image
2214593-2 TE Connectivity
1 Telecom and Datacom Connector, 152 Contact(s), Press Fit Terminal 2214593-2 0 Build or Request
Part Image Part Image
2214511-2 TE Connectivity
1 Board Connector 2214511-2 0 Build or Request
Part Image Part Image
2214519-5 TE Connectivity
1 Board Connector 2214519-5 0 Build or Request
Part Image Part Image
2214565-1 TE Connectivity
1 Telecom and Datacom Connector, 190 Contact(s), Press Fit Terminal 2214565-1 0 Build or Request
Part Image Part Image
2214539-5 TE Connectivity
1 Board Connector 2214539-5 0 Build or Request
Can't find what you're looking for? Request this part