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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2-1445093-7
TE Connectivity
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1 | MICRO MNL HDR ASSY S/ROW AU LF | Other | 2-1445093-7 |
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2-1445054-8
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 8 | Number of Power Positions 8 | Number of Rows 1 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Mating Area Plating Material Thickne | Other | 2-1445054-8 |
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2-1445098-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 2 | Number of Positions 2 | Contact Features: Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Retenti | Other | 2-1445098-2 |
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2-1445098-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 2 | Number of Positions 2 | Contact Features: Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Retenti | Other | 2-1445098-2 |
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2-1445098-8
TE Connectivity
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1 | Connector Header Through Hole, Right Angle 8 position 0.118" (3.00mm) | Other | 2-1445098-8 |
3
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ADUM1445ARQZ
Analog Devices
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1 | Micropower Quad-Channel Digital Isolator, Default Low (4/0 Channel Directionality) | Small Outline Packages | ADUM1445ARQZ |
3
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M80-8511445
Harwin
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1 | Datamate L-Tek DIL Male Horizontal 3mm Throughboard Connector, latched, gold, 7+7 contacts | Other | M80-8511445 |
3
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2-1445053-3
TE Connectivity
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1 | Configuration Features: Number of Power Positions 3 | Number of Rows 1 | Number of Positions 3 | PCB Mount Orientation Vertical | Contact Features: Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Type Pin | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area | Other | 2-1445053-3 |
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2-1445053-4
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 4 | Number of Power Positions 4 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Type Pin | Contact Retention Within Housing Without | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating M | Other | 2-1445053-4 |
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2-1445093-2
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Rows 1 | PCB Mount Orientation Vertical | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Pla | Other | 2-1445093-2 |
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2-1445093-8
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 8 | PCB Mount Orientation Vertical | Number of Power Positions 8 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Layout Inline | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Ter | Other | 2-1445093-8 |
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2-1445087-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 6 | Number of Rows 1 | Number of Positions 6 | PCB Mount Orientation Vertical | Contact Features: Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Mater | Other | 2-1445087-6 |
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2-1445089-4
TE Connectivity
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1 | Configuration Features: Number of Positions 4 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 4 | Contact Features: Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | Contact Type Pin | Contact Layout Inline | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Platin | Other | 2-1445089-4 |
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2-1445084-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Positions 2 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Gold | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material T | Other | 2-1445084-2 |
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TMS-144-58-H-S
SAMTEC
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1 | 44 Position, Single-Row .050" x .100" Micro Terminal Strip | Other | TMS-144-58-H-S |
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2-1445096-3
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Power Positions 3 | Number of Positions 3 | Contact Features: Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Tin | Conta | Other | 2-1445096-3 |
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2-1445088-3
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 3 | Number of Power Positions 3 | Number of Rows 1 | Contact Features: Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | Multiple Contact Types Without | Contact Ma | Other | 2-1445088-3 |
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2-1445089-4
TE Connectivity
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1 | Configuration Features: Number of Positions 4 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 4 | Contact Features: Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | Contact Type Pin | Contact Layout Inline | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Platin | Other | 2-1445089-4 |
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2-1445084-5
TE Connectivity
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1 | Configuration Features: Number of Power Positions 5 | Number of Positions 5 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .38 MICM | Multiple Contact Types Without | Contact Retention Within | Other | 2-1445084-5 |
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TMS-144-58-TM-S
SAMTEC
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1 | 44 Position, Single-Row .050" x .100" Micro Terminal Strip | Other | TMS-144-58-TM-S |
2
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TMS-144-53-TM-S
SAMTEC
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1 | 44 Position, Single-Row .050" x .100" Micro Terminal Strip | Other | TMS-144-53-TM-S |
2
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TMS-144-55-G-S
SAMTEC
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1 | 44 Position, Single-Row .050" x .100" Micro Terminal Strip | Other | TMS-144-55-G-S |
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TMS-144-51-FM-S
SAMTEC
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1 | 44 Position, Single-Row .050" x .100" Micro Terminal Strip | Other | TMS-144-51-FM-S |
2
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2-1445091-4
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Positions 4 | Number of Power Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .38 MICM | Contact Type Pin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Plating | Other | 2-1445091-4 |
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TMS-144-51-SM-S
SAMTEC
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1 | 44 Position, Single-Row .050" x .100" Micro Terminal Strip | Other | TMS-144-51-SM-S |
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