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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	B32756G2126J000 TDK	1	Metallized Polypropylene Capacitors (MKP/MFP), 12μF, 500V DC, 20(W) x 39.5(H) x 42mm(L)	Other	B32756G2126J000	3D model available Symbol and footprint available 3	1 Download Model
	B32754C2126K000 TDK	1	Metallized Polypropylene Capacitors (MKP/MFP), 12μF, 500V DC, 22(W) x 48(H) x 31.5mm(L)	Other	B32754C2126K000	3D model available Symbol and footprint available 3	1 Download Model
	TSW-121-26-SS-S SAMTEC	1	21 Position, Single Row, Classic PCB Header Strips, 0.100" pitch	Other	TSW-121-26-SS-S	3D model not available Symbol and footprint available 2	1 Download Model
	44472-1264 Molex	1	Mini-Fit HCS Header, 4.20mm Pitch, Dual Row, Vertical, without Snap-in Plastic Peg PCB Lock, 12 Circuits, PA Polyamide Nylon 6/6 94V-0	Other	44472-1264	3D model available Symbol and footprint available 3	1 Download Model

	TSW-121-26-L-S SAMTEC	1	21 Position, Single Row, Classic PCB Header Strips, 0.100" pitch	Other	TSW-121-26-L-S	3D model not available Symbol and footprint available 2	1 Download Model
	TSW-121-26-F-Q SAMTEC	1	POST HEADER , THROUGH-HOLE	Other	TSW-121-26-F-Q	3D model not available Symbol and footprint available 2	1 Download Model
	21.2640-0 Multi-Contact AG	1	Interconnection Device		21.2640-0	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.2650-4 Multi-Contact AG	1	Interconnection Device		21.2650-4	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.2630-9 Multi-Contact AG	1	Interconnection Device		21.2630-9	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.2620-7 Multi-Contact AG	1	Interconnection Device		21.2620-7	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.2650-3 Multi-Contact AG	1	Interconnection Device		21.2650-3	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.2600-7 Multi-Contact AG	1	Interconnection Device		21.2600-7	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.2600-5 Multi-Contact AG	1	Interconnection Device		21.2600-5	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.2620-9 Multi-Contact AG	1	Interconnection Device		21.2620-9	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.2600-6 Multi-Contact AG	1	Interconnection Device		21.2600-6	3D model not available Symbol and footprint not available 0	0 Build or Request

	21.2640-5 Multi-Contact AG	1	Interconnection Device		21.2640-5	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.2630-2 Multi-Contact AG	1	Interconnection Device		21.2630-2	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.2650-7 Multi-Contact AG	1	Interconnection Device		21.2650-7	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.2620-2 Multi-Contact AG	1	Interconnection Device		21.2620-2	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.2630-6 Multi-Contact AG	1	Interconnection Device		21.2630-6	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.2610-3 Multi-Contact AG	1	Interconnection Device		21.2610-3	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.2650-8 Multi-Contact AG	1	Interconnection Device		21.2650-8	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.2650-6 Multi-Contact AG	1	Interconnection Device		21.2650-6	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.2640-7 Multi-Contact AG	1	Interconnection Device		21.2640-7	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.2630-4 Multi-Contact AG	1	Interconnection Device		21.2630-4	3D model not available Symbol and footprint not available 0	0 Build or Request
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