21.46 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	NJM2146BD New Japan Radio	1	New Japan Radio NJM2146BD, Voltage Supervisor 8-Pin, PDIP	Dual-In-Line Packages	NJM2146BD	3D model available Symbol and footprint available 3	1 Download Model
	MAL214699108E3 Vishay	1	Vishay Extreme 470μF 50 V Aluminium Electrolytic Capacitor 1616, 146 CTI Series 4000 h, 5000 h, 350000 h	Capacitor Al Electrolytic	MAL214699108E3	3D model available Symbol and footprint available 3	1 Download Model
	MAL214658471E3 Vishay	1	Aluminum Electrolytic Capacitors - Radial Leaded 470uF 20% 63volts	Capacitor, Polarized Radial Diameter	MAL214658471E3	3D model available Symbol and footprint available 3	1 Download Model
	V62/14616-01XE Texas Instruments	1	MOSFET 2.7-5.5V Dual In/Single Out MOSFET	SOT23 (5-Pin)	V62/14616-01XE	3D model available Symbol and footprint available 3	1 Download Model

	MAL214699502E3 Vishay	1	Vishay Extreme 470μF 16 V Aluminium Electrolytic Capacitor 1012, 146 CTI Series 1500 h, 2000 h, 200000 h	Capacitor Al Electrolytic	MAL214699502E3	3D model available Symbol and footprint available 3	1 Download Model
	2-1462039-9 TE Connectivity	1	IM23GR=IM RELAY 50MW 5V	Other	2-1462039-9	3D model available Symbol and footprint available 3	1 Download Model
	R5F72146BDFA#V1 Renesas Electronics	1	The SH7216 Series with 32-bit SH-2A CPU core offers a maximum operating frequency of 200 MHz, representing a 1.25-fold improvement in performance over the 160 MHz of Renesas Electronics's existing the SH7211. They also include large-capacity high-speed flash memory and RAM through the use of cutting-edge flash memory technology. Featuring an on-chip power supply step-down circuit, these microcontrollers are designed to achieve lower current dissipation by suppressing the increase in current dissipation asso	Quad Flat Packages	R5F72146BDFA#V1	3D model available Symbol and footprint available 3	1 Download Model
	R5F72146ADFP#V1 Renesas Electronics	1	The SH7216 Series with 32-bit SH-2A CPU core offers a maximum operating frequency of 200 MHz, representing a 1.25-fold improvement in performance over the 160 MHz of Renesas Electronics's existing the SH7211. They also include large-capacity high-speed flash memory and RAM through the use of cutting-edge flash memory technology. Featuring an on-chip power supply step-down circuit, these microcontrollers are designed to achieve lower current dissipation by suppressing the increase in current dissipation asso	Quad Flat Packages	R5F72146ADFP#V1	3D model available Symbol and footprint available 3	1 Download Model
	44472-1464 Molex	1	Mini-Fit HCS Header, 4.20mm Pitch, Dual Row, Vertical, without Snap-in Plastic Peg PCB Lock, 14 Circuits, PA Polyamide Nylon 6/6 94V-0	Other	44472-1464	3D model available Symbol and footprint available 3	1 Download Model
	44472-1463 Molex	1	Mini-Fit HCS Header, 4.20mm Pitch, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 14 Circuits	Other	44472-1463	3D model available Symbol and footprint available 3	1 Download Model
	S1721-46R Harwin	1	S1721-46R, Beryllium Copper Grounding Contact Used with Surface Mount, 5.08 x 1.07 x 2.23mm	Other	S1721-46R	3D model available Symbol and footprint available 3	1 Download Model
	LPC2146FBD64,151 NXP	1	MCU	Other	LPC2146FBD64,151	3D model available Symbol and footprint available 3	1 Download Model
	21.4650-2 Multi-Contact AG	1	Interconnection Device,		21.4650-2	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.4600-5 Multi-Contact AG	1	Interconnection Device,		21.4600-5	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.4610-2 Multi-Contact AG	1	Interconnection Device,		21.4610-2	3D model not available Symbol and footprint not available 0	0 Build or Request

	21.4640-1 Multi-Contact AG	1	Interconnection Device,		21.4640-1	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.4630-1 Multi-Contact AG	1	Interconnection Device,		21.4630-1	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.4610-4 Multi-Contact AG	1	Interconnection Device,		21.4610-4	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.4600-6 Multi-Contact AG	1	Interconnection Device,		21.4600-6	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.4640-4 Multi-Contact AG	1	Interconnection Device,		21.4640-4	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.4640-6 Multi-Contact AG	1	Interconnection Device,		21.4640-6	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.4640-5 Multi-Contact AG	1	Interconnection Device,		21.4640-5	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.4640-2 Multi-Contact AG	1	Interconnection Device,		21.4640-2	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.4630-6 Multi-Contact AG	1	Interconnection Device,		21.4630-6	3D model not available Symbol and footprint not available 0	0 Build or Request
	21.4630-4 Multi-Contact AG	1	Interconnection Device,		21.4630-4	3D model not available Symbol and footprint not available 0	0 Build or Request
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