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C0402C103K5RAC31217042
Yageo Group
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1 | Cap Ceramic 0.01uF 50V X7R 10% Pad SMD 0402 125°C | Capacitor Chip Non-polarised | C0402C103K5RAC31217042 |
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5962-9221701MRA
Renesas Electronics
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1 | The 5962-92217 (equivalent to IDT 54FCT373T) is an octal transparent latch with 3-state outputs and is intended for bus oriented applications. The flip-flops appear transparent to the data when Latch Enable (LE) is high. When LE is low, the data that meets the set-up time is latched. The 5962-92217 operates at -55C to +125C. (For commercial version, see 74FCT373T) | Ceramic Dual-In-Line Packages | 5962-9221701MRA |
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LTC2170IUKG-14#TRPBF
Analog Devices
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1 | 14-Bit, 25Msps Low Power Quad ADCs | Quad Flat No-Lead | LTC2170IUKG-14#TRPBF |
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2170630027
Molex
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1 | Micro-One Wire-to-Board Header, Vertical, 2.00mm Pitch, Single Row, Glow-Wire Capable, Surface Mount, 2 Circuits, Tin-Bismuth Plating, Black, with Potting Capability, with Cover Tape | Other | 2170630027 |
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SiT9121_7.0x5.0
SiTime
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1 | 1 MHz to 220 MHz Ultra-low Jitter Differential Oscillator 7.0 x 5.0 x 1 mm | Other | SiT9121_7.0x5.0 |
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1217061-1
TE Connectivity
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1 | Configuration Features: Connection Capacity Single | Contact Features: PCB Terminal Type Tab | Terminal Orientation Right Angle | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Terminal Size 4.75 | Contact Underplating Material Thickness 1.27 MICM | Mating Tab Thickness .8 MM | Mating Tab Width 4.75 MM | Contact Underplating Material Nickel | Contact Underplating Material Thickness 50 MICIN | Mating Tab Width .187 INCH | Other | 1217061-1 |
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2170630047
Molex
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1 | Micro-One Wire-to-Board Header, Vertical, 2.00mm Pitch, Single Row, Glow-Wire Capable, Surface Mount, 4 Circuits, Tin-Bismuth Plating, Black, with Potting Capability, with Cover Tape | Other | 2170630047 |
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2170640041
Molex
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1 | Micro-One Wire-to-Board Header, Right-Angle, 2.00mm Pitch, Single Row, Glow-Wire Capable, Surface Mount, 4 Circuits, Tin-Bismuth Plating, Black | Other | 2170640041 |
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ST02-170F1-5073
Shindengen Electric Manufacturing Co., Ltd.
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1 | ・TVS・Peak pulse power:200W・Small SMD・Available for automotive use・Pb free terminal・RoHS:Yes | Other | ST02-170F1-5073 |
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1 | Diplexers, Pass Band/Low Band=824 to 960MHz, Pass Band/High Band=1710 to 2170MHz | Other | DPX202170DT-4149A1 |
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2170640021
Molex
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1 | Micro-One Wire-to-Board Header, Right-Angle, 2.00mm Pitch, Single Row, Glow-Wire Capable, Surface Mount, 2 Circuits, Tin-Bismuth Plating, Black | Other | 2170640021 |
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2170640031
Molex
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1 | Micro-One Wire-to-Board Header, Right-Angle, 2.00mm Pitch, Single Row, Glow-Wire Capable, Surface Mount, 3 Circuits, Tin-Bismuth Plating, Black | Other | 2170640031 |
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B72510E2170K062
TDK
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1 | Chip Varistors / Ceramic Transient Voltage Suppressors, Maximum continuous voltage=22V, Maximum Clamping Voltage (8/20?s)=50V | Varistors Chip | B72510E2170K062 |
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2092-1704
Wago
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1 | THT pin strip; 1.4 mm Ø solder pin; straight; Pin spacing 5 mm; 4-pole | Other | 2092-1704 |
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ST02-170F1-5053
Shindengen Electric Manufacturing Co., Ltd.
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1 | ・TVS・Peak pulse power:200W・Small SMD・Available for automotive use・Pb free terminal・RoHS:Yes | Other | ST02-170F1-5053 |
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LTC2170IUKG-14#PBF
Analog Devices
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1 | 14-Bit, 25Msps Low Power Quad ADCs | Quad Flat No-Lead | LTC2170IUKG-14#PBF |
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2170630057
Molex
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1 | Micro-One Wire-to-Board Header, Vertical, 2.00mm Pitch, Single Row, Glow-Wire Capable, Surface Mount, 5 Circuits, Tin-Bismuth Plating, Black, with Potting Capability, with Cover Tape | Other | 2170630057 |
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2170902-1
TE Connectivity
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1 | HM-EZD+,4PAIRS,10COLS,VERTICAL,ASSEMBLY | Other | 2170902-1 |
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2170640081
Molex
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1 | Micro-One Wire-to-Board Header, Right-Angle, 2.00mm Pitch, Single Row, Glow-Wire Capable, Surface Mount, 8 Circuits, Tin-Bismuth Plating, Black | Other | 2170640081 |
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2492170000
Weidmüller
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1 | PCB terminal, 1000 V, 101 A, Pitch in mm: 10.00, 16 mm², Number of poles: 8, PUSH IN with actuator, THT solder connection, 180°, Box | Other | 2492170000 |
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2170136-1
TE Connectivity
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1 | Body Features: Modular Jack Latch Orientation Standard - Latch Down | Shield Material Brass | Shield Plating Material Nickel | Connector Profile Standard | Configuration Features: Number of PCB Ground Tabs 4 | PCB Mount Orientation Right Angle | Port Configuration Single Port | Number of Loaded Positions 8 | Port Matrix Configuration 1 x 1 | Status Light Type Not Illuminated | Connector Contact Density Standard | Number of Positions 8 | Contact Features: PCB Contact Termination Area Plating Material Gold Fl | Other | 2170136-1 |
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2170088-1
TE Connectivity
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1 | Configuration Features: Number of Positions 20 | Contact Features: Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Electrical Characteristics: Data Rate (Max) 32 GBS | Housing Features: Centerline (Pitch) .031 INCH | Centerline (Pitch) .8 MM | Industry Standards: UL Flammability Rating UL 94V-0 | Operation/Application: Pluggable I/O Applications SFP+ | Circuit Application Power & Signal | Other: Included Lightpipe No | Packaging Features: | Other | 2170088-1 |
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2170088-2
TE Connectivity
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1 | Configuration Features: Number of Positions 20 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Current Rating (Max) .5 AMP | Electrical Characteristics: Data Rate (Max) 32 GBS | Housing Features: Centerline (Pitch) .8 MM | Centerline (Pitch) .031 INCH | Industry Standards: UL Flammability Rating UL 94V-0 | Operation/Application: Pluggable I/O Applications SFP+ | Circuit Application Power & Signal | Other: Included Lightpipe No | Packaging Features: | Other | 2170088-2 |
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LTC2170CUKG-14#PBF
Analog Devices
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1 | 14-Bit, 25Msps Low Power Quad ADCs | Quad Flat No-Lead | LTC2170CUKG-14#PBF |
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2092-1708
Wago
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1 | THT pin strip; 1.4 mm Ø solder pin; straight; Pin spacing 5 mm; 8-pole | Other | 2092-1708 |
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