224ST Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Prices / Stock	Model	Action
	TCKID224ST Cal-Chip Electronics	1	Tantalum Capacitor, Polarized, Tantalum (dry/solid), 20V, 10% +Tol, 10% -Tol, 0.22uF, Surface Mount, 1206, CHIP	TCKID224ST	3D model not available Symbol and footprint not available 0	0 Build or Request
	CT1-F12Z5V2B224STE Fenghua (HK) Electronics Ltd	1	Ceramic Capacitor, Ceramic, 50V, 50% +Tol, 20% -Tol, Z5V, -82/+22ppm/Cel TC, 0.22uF,	CT1-F12Z5V2B224STE	3D model not available Symbol and footprint not available 0	0 Build or Request
	MP22.4STGAH10U MPE-Garry GmbH	1	IC Socket, DIP22, 22 Contact(s), 2.54mm Term Pitch, 10.16mm Row Spacing, Solder	MP22.4STGAH10U	3D model not available Symbol and footprint not available 0	0 Build or Request
	CS1-D8Y5V6A224STEW Fenghua (HK) Electronics Ltd	1	Ceramic Capacitor, Ceramic, 16V, 50% +Tol, 20% -Tol, Y5V, 22/-82% TC, 0.22uF, Through Hole Mount	CS1-D8Y5V6A224STEW	3D model not available Symbol and footprint not available 0	0 Build or Request

	MPQ22.4STGAH11100NFU MPE-Garry GmbH	1	IC Socket, DIP22, 22 Contact(s), 2.54mm Term Pitch, 10.16mm Row Spacing, Solder	MPQ22.4STGAH11100NFU	3D model not available Symbol and footprint not available 0	0 Build or Request
	CT1-F12Z5V3D224STP Fenghua (HK) Electronics Ltd	1	Ceramic Capacitor, Ceramic, 50V, 50% +Tol, 20% -Tol, Z5V, -82/+22ppm/Cel TC, 0.22uF,	CT1-F12Z5V3D224STP	3D model not available Symbol and footprint not available 0	0 Build or Request
	CS1-E10Y5V5A224STPW Fenghua (HK) Electronics Ltd	1	Ceramic Capacitor, Ceramic, 25V, 50% +Tol, 20% -Tol, Y5V, 22/-82% TC, 0.22uF, Through Hole Mount	CS1-E10Y5V5A224STPW	3D model not available Symbol and footprint not available 0	0 Build or Request
	ICE-224-S-TG30 3M Interconnect	1	IC Socket, DIP22, 22 Contact(s)	ICE-224-S-TG30	3D model not available Symbol and footprint not available 0	0 Build or Request
	CS1-D8Y5V5C224STPW Fenghua (HK) Electronics Ltd	1	Ceramic Capacitor, Ceramic, 16V, 50% +Tol, 20% -Tol, Y5V, 22/-82% TC, 0.22uF, Through Hole Mount	CS1-D8Y5V5C224STPW	3D model not available Symbol and footprint not available 0	0 Build or Request
	MPQ22.4STG8AH15100NFU MPE-Garry GmbH	1	IC Socket, DIP22, 22 Contact(s), 2.54mm Term Pitch, 10.16mm Row Spacing, Solder	MPQ22.4STG8AH15100NFU	3D model not available Symbol and footprint not available 0	0 Build or Request
	CT1-F12Z5V7B224STP Fenghua (HK) Electronics Ltd	1	Ceramic Capacitor, Ceramic, 50V, 50% +Tol, 20% -Tol, Z5V, -82/+22ppm/Cel TC, 0.22uF,	CT1-F12Z5V7B224STP	3D model not available Symbol and footprint not available 0	0 Build or Request
	TP4224-STYLE-E Allegro MicroSystems LLC	1	Small Signal Field-Effect Transistor, 1-Element, N-Channel, Silicon, Junction FET, TO-226AA	TP4224-STYLE-E	3D model not available Symbol and footprint not available 0	0 Build or Request
	CKD310JB1C224ST TDK Corporation	1	Feed Through Capacitor, 1 Function(s), 16V, 2A, 3 Pin(s)	CKD310JB1C224ST	3D model not available Symbol and footprint not available 0	0 Build or Request
	CS1-D8Y5V5D224STPW Fenghua (HK) Electronics Ltd	1	Ceramic Capacitor, Ceramic, 16V, 50% +Tol, 20% -Tol, Y5V, 22/-82% TC, 0.22uF, Through Hole Mount	CS1-D8Y5V5D224STPW	3D model not available Symbol and footprint not available 0	0 Build or Request
	STL32-24STU MPE-Garry GmbH	1	Board Connector, 24 Contact(s), 1 Row(s), Male, Right Angle, 0.079 inch Pitch, Solder Terminal, Receptacle	STL32-24STU	3D model not available Symbol and footprint not available 0	0 Build or Request

	CT1-F12Z5V4E224STE Fenghua (HK) Electronics Ltd	1	Ceramic Capacitor, Ceramic, 50V, 50% +Tol, 20% -Tol, Z5V, -82/+22ppm/Cel TC, 0.22uF,	CT1-F12Z5V4E224STE	3D model not available Symbol and footprint not available 0	0 Build or Request
	MPQ22.4STG8AH8100NFU MPE-Garry GmbH	1	IC Socket, DIP22, 22 Contact(s), 2.54mm Term Pitch, 10.16mm Row Spacing, Solder	MPQ22.4STG8AH8100NFU	3D model not available Symbol and footprint not available 0	0 Build or Request
	ICE-224-S-TG 3M Interconnect	1	IC Socket, DIP22, 22 Contact(s), 2.54mm Term Pitch, 10.16mm Row Spacing, Solder	ICE-224-S-TG	3D model not available Symbol and footprint not available 0	0 Build or Request
	CT1-F12Z5V4D224STP Fenghua (HK) Electronics Ltd	1	Ceramic Capacitor, Ceramic, 50V, 50% +Tol, 20% -Tol, Z5V, -82/+22ppm/Cel TC, 0.22uF,	CT1-F12Z5V4D224STP	3D model not available Symbol and footprint not available 0	0 Build or Request
	ESQ-112-24-S-T-LL Samtec Inc	1	Board Connector, 36 Contact(s), 3 Row(s), Female, Straight, 0.1 inch Pitch, Wire Wrap Terminal, Black Insulator, Plug	ESQ-112-24-S-T-LL	3D model not available Symbol and footprint not available 0	0 Build or Request
	CT1-F12Z5V5B224STEW Fenghua (HK) Electronics Ltd	1	Ceramic Capacitor, Ceramic, 50V, 50% +Tol, 20% -Tol, Z5V, 22/-82% TC, 0.22uF, Through Hole Mount	CT1-F12Z5V5B224STEW	3D model not available Symbol and footprint not available 0	0 Build or Request
	MP22.4STG8AH10U MPE-Garry GmbH	1	IC Socket, DIP22, 22 Contact(s), 2.54mm Term Pitch, 10.16mm Row Spacing, Solder	MP22.4STG8AH10U	3D model not available Symbol and footprint not available 0	0 Build or Request
	MP22.4STGBOMU MPE-Garry GmbH	1	IC Socket, DIP24, 24 Contact(s), 2.54mm Term Pitch, 10.16mm Row Spacing, Solder	MP22.4STGBOMU	3D model not available Symbol and footprint not available 0	0 Build or Request
	WRB1224ST-3WR2 MORNSUN	1	DC-DC Regulated Power Supply Module	WRB1224ST-3WR2	3D model not available Symbol and footprint not available 0	0 Build or Request
	MP-SMD-G22.4STG8U MPE-Garry GmbH	1	IC Socket, DIP22, 22 Contact(s), 2.54mm Term Pitch, 10.16mm Row Spacing, Surface Mount	MP-SMD-G22.4STG8U	3D model not available Symbol and footprint not available 0	0 Build or Request
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