620-7 Model Download Search Results
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AC05AT0006207JAC34
Vishay
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1 | Cemented Leaded Wirewound Resistors, AEC-Q200 qualified AC-AT series, Non-flammable coating conforming to UL 94 V-482 | Resistors, Axial Diameter Horizontal Mounting | AC05AT0006207JAC34 |
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46207-0016
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 16 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-0016 |
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46207-0110
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 10 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-0110 |
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46207-5114
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 14 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-5114 |
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46207-4322
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 22 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-4322 |
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46207-5116
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 16 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-5116 |
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46207-4324
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 24 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-4324 |
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46207-5204
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 4 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-5204 |
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1862071
Phoenix Contact
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1 | SPTAF 1/ 5-3,5-EL - Printed circuit board terminal, nominal current: 16 A, rated voltage (III/2): 160 V, nominal cross section: 1.5 mm2, number of potentials: 5, number of rows: 1, number of positions per row: 5, product range: SPTAF 1/..-EL, pitch: 3.5 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 45 °, color: green, Pin layout: Linear pinning, Solder pin [P]: 2.6 mm, number of solder pins per potential: 2, type of packaging: pack | Other | 1862071 |
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L6207PD
STMicroelectronics
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1 | L6207PD, Full Bridge Motor Driver, Full Bridge PWM, 8 → 52 V, 36-Pin PowerSO | Small Outline Packages | L6207PD |
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46207-5020
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 20 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-5020 |
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46207-0118
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 18 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-0118 |
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46207-6620
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 20 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-6620 |
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B43416C6207A000
TDK
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1 | Capacitors for Pulse Applications, 200?F/500VDC, 25mm dia x 45mm length | Capacitor, Polarized Radial Diameter | B43416C6207A000 |
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46207-6622
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 22 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-6622 |
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46207-5214
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 14 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-5214 |
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46207-6602
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 2 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-6602 |
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46207-6008
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 8 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-6008 |
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46207-4004
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 4 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-4004 |
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46207-5112
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 12 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-5112 |
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46207-1008
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 8 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-1008 |
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46207-6614
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 14 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-6614 |
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46207-4304
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 4 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-4304 |
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QPL6207QSB
Qorvo
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1 | Tested in accordance to AEC-100 Grade 2 High Gain device – Typical value 18.5dB Ultra-low noise figure, 0.45 dB NF at 2332 MHz High linearity, +35 dBm Output IP3 High input power ruggedness, >29 dBm PIN, MAX Unconditionally stable Externally controlled Icq with Vbias Integrated shutdown control pin 3.3-5.25 V positive supply voltage: −Vgg not required | Small Outline No-lead | QPL6207QSB |
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46207-4022
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 22 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-4022 |
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