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10146997-10201LF
Amphenol Communications Solutions
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1 | Minitek®Pwr 5.7, Right Angle Through Hole Header, Dual Row, Black Color, 10 Positions, 100μin Tin overall plating, LCP, GW Compatible, Tape and Reel. | Other | 10146997-10201LF |
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10127721-242LF
Amphenol Communications Solutions
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1 | Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 24 Position, 3.2mm Kink Tail (Gold Flash) plating, Non GW Compatible LCP, Black Color,Tray Packing. | Other | 10127721-242LF |
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10127720-041LF
Amphenol Communications Solutions
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1 | Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 4 Positions, 100μin Tin plating, Non GW Compatible LCP, With Pegs, Tray Packing. | Other | 10127720-041LF |
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10144754-2021LF
Amphenol Communications Solutions
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1 | Minitek® Pwr 3.0 BMI, Dual Row, Right Angle Through Hole Header, Gold Flash plating, 20 Positions, Black Color, LCP, GW Compatible, Tray packing. | Other | 10144754-2021LF |
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10132449-1811GLF
Amphenol Communications Solutions
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1 | Minitek® Pwr 3.0 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Black Color, 18 Positions, GW Compatible PA9T, Tray packing. | Other | 10132449-1811GLF |
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10160920-1241100LF
Amphenol Communications Solutions
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1 | Minitek Pwr CEM-5 PCIe Connector System, Right Angle Through Hole Hybrid Header (12Power + 4 Signal), 100μin Matte Tin Plating, 2.2mm Tail Length, GW Compatible LCP, Black Color, Tray Packing. | Other | 10160920-1241100LF |
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10131319-10422G0LF
Amphenol Communications Solutions
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1 | Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 30μin Gold on Contact area (100μin Matte Tin on Tails) plating, Black Color, 10 Positions, LCP, GW Compatible, Tray Packing. | Other | 10131319-10422G0LF |
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UCC2891PW
Texas Instruments
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1 | Texas Instruments UCC2891PW, PWM Current Mode Controller, 2 A, 1000 kHz, 12 V, 16-Pin TSSOP | Small Outline Packages | UCC2891PW |
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UCC2893PW
Texas Instruments
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1 | Current Mode Active Clamp PWM Controller | Small Outline Packages | UCC2893PW |
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LM5026SDX/NOPB
Texas Instruments
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1 | Active Clamp Current Mode PWM Controller | Small Outline No-lead | LM5026SDX/NOPB |
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UCC2891D
Texas Instruments
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1 | Texas Instruments UCC2891D, PWM Current Mode Controller, 2 A, 1000 kHz, 12 V, 16-Pin SOIC | Small Outline Packages | UCC2891D |
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1969795-1
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Power Positions 2 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Pre-Tin | Contact Retention Within Housing Without | Contact Type Socket | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Housing Features: Housing C | Header, Shrouded - Straight PTH Box | 1969795-1 |
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1586892-3
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 3 | Number of Power Positions 3 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 150 – 200 MICIN | PCB Contact Termination Area Plating Material Pre-Tin | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Current Rating (Max | Other | 1586892-3 |
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LM5025MTC/NOPB
Texas Instruments
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1 | Active Clamp Voltage Mode PWM Controller | Small Outline Packages | LM5025MTC/NOPB |
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1744439-2
TE Connectivity
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1 | Body Features: Primary Product Color Natural | Configuration Features: Number of Positions 2 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Tin | Mating Pin Diameter .024 INCH | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Mating Pin Diameter .6 MM | Contact Mating Area Plating Material Thickness 2 – 5 MICM | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 80 MICIN | Contact Mating Area | Other | 1744439-2 |
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LM5026MT/NOPB
Texas Instruments
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1 | Active Clamp Current Mode PWM Controller | Small Outline Packages | LM5026MT/NOPB |
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LM5025ASD/NOPB
Texas Instruments
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1 | Active Clamp Voltage Mode PWM Controller | Small Outline No-lead | LM5025ASD/NOPB |
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LM5025AMTC/NOPB
Texas Instruments
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1 | Texas Instruments LM5025AMTC/NOPB, Dual PWM Voltage Mode Controller, 1000 mA, 3000 mA, 1000 kHz, 16-Pin TSSOP | Small Outline Packages | LM5025AMTC/NOPB |
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1969806-1
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 4 | Number of Power Positions 4 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Current Rating (Max) 12 AMP | Contact Type Socket | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Electrical Characteristics: | Other | 1969806-1 |
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1744439-6
TE Connectivity
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1 | Body Features: Primary Product Color Natural | Configuration Features: Number of Positions 6 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: Contact Current Rating (Max) 4.2 AMP | Mating Pin Diameter .6 MM | PCB Contact Termination Area Plating Material Thickness 80 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Layout | Other | 1744439-6 |
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1969796-1
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Power Positions 2 | Number of Rows 1 | PCB Mount Orientation Right Angle | Contact Features: Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Housing Features: Centerline (P | Other | 1969796-1 |
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1969798-1
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 2 | Number of Power Positions 2 | Contact Features: Contact Current Rating (Max) 12 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Housing Features: Centerline (Pitc | Other | 1969798-1 |
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1744446-8
TE Connectivity
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1 | Body Features: Primary Product Color Natural | Configuration Features: Number of Positions 8 | PCB Mount Orientation Right Angle | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 2 – 5 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.032 MICM | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Type Pin | Mating Pin Diameter .6 MM | Mating Pin Diameter .024 INCH | Contact Mating | Other | 1744446-8 |
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1969815-1
TE Connectivity
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1 | Configuration Features: Number of Positions 8 | PCB Mount Orientation Right Angle | Number of Power Positions 8 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Electrical Characteristics: Ope | Other | 1969815-1 |
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1744428-8
TE Connectivity
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1 | Configuration Features: Number of Power Positions 8 | Number of Signal Positions 0 | PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 8 | Contact Features: Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Mating Post Length 8.6 MM | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Retention Within Housing Without | Contact Layout Inline | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 80 MIC | Other | 1744428-8 |
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