00158 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Prices / Stock	Model	Action
	0015800149 Molex	1	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing	0015800149	3D model available Symbol and footprint not available 1	1 Download Model
	0015800441 Molex	1	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, Tin (Sn) Plating	0015800441	3D model available Symbol and footprint not available 1	1 Download Model
	0015800185 Molex	1	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.76µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating	0015800185	3D model available Symbol and footprint not available 1	1 Download Model
	0015800087 Molex	1	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating, 3.81mm Inside Shroud to End Circuit Spacing	0015800087	3D model available Symbol and footprint not available 1	1 Download Model

	0015800241 Molex	1	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating	0015800241	3D model available Symbol and footprint not available 1	1 Download Model
	0015800461 Molex	1	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, Tin (Sn) Plating	0015800461	3D model available Symbol and footprint not available 1	1 Download Model
	0015800467 Molex	1	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, Tin (Sn) Plating, 3.81mm Inside Shroud to End Circuit Spacing	0015800467	3D model available Symbol and footprint not available 1	1 Download Model
	0015800481 Molex	1	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, Tin (Sn) Plating	0015800481	3D model available Symbol and footprint not available 1	1 Download Model
	0015800469 Molex	1	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, 0.38µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing	0015800469	3D model available Symbol and footprint not available 1	1 Download Model
	0015800587 Molex	1	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, Tin (Sn) Plating, 3.81mm Inside Shroud to End Circuit Spacing	0015800587	3D model available Symbol and footprint not available 1	1 Download Model
	0015801321 Molex	1	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.76µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing	0015801321	3D model available Symbol and footprint not available 1	1 Download Model
	0015800667 Molex	1	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, Tin (Sn) Plating, 3.81mm Inside Shroud to End Circuit Spacing	0015800667	3D model available Symbol and footprint not available 1	1 Download Model
	0015801223 Molex	1	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing	0015801223	3D model available Symbol and footprint not available 1	1 Download Model
	0015801103 Molex	1	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing	0015801103	3D model available Symbol and footprint not available 1	1 Download Model
	0015801242 Molex	1	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating, 3.81mm Inside Shroud to End Circuit Spacing, Polarization Rib Cut Out Rib Cut Out	0015801242	3D model available Symbol and footprint not available 1	1 Download Model

	0015801264 Molex	1	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.76µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing	0015801264	3D model available Symbol and footprint not available 1	1 Download Model
	0015801322 Molex	1	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, Tin (Sn) Plating, 3.81mm Inside Shroud to End Circuit Spacing, Polarization Rib Cut Out Rib Cut Out	0015801322	3D model available Symbol and footprint not available 1	1 Download Model
	0015801202 Molex	1	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating, 3.81mm Inside Shroud to End Circuit Spacing, Polarization Rib Cut Out Rib Cut Out	0015801202	3D model available Symbol and footprint not available 1	1 Download Model
	0015801323 Molex	1	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.38µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing	0015801323	3D model available Symbol and footprint not available 1	1 Download Model
	0015801123 Molex	1	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing	0015801123	3D model available Symbol and footprint not available 1	1 Download Model
	0015801504 Molex	1	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing	0015801504	3D model available Symbol and footprint not available 1	1 Download Model
	0015801063 Molex	1	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing	0015801063	3D model available Symbol and footprint not available 1	1 Download Model
	0015801483 Molex	1	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, 0.38µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing	0015801483	3D model available Symbol and footprint not available 1	1 Download Model
	0015801144 Molex	1	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing	0015801144	3D model available Symbol and footprint not available 1	1 Download Model
	0015801182 Molex	1	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.76µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing	0015801182	3D model available Symbol and footprint not available 1	1 Download Model
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