14949 Model Download Search Results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
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2HCIS149-49GG3M Advanced Interconnections Corp
1 IC Socket, PGA149, 149 Contact(s), 2.54mm Term Pitch, 2.54mm Row Spacing, Solder 2HCIS149-49GG3M 0 Build or Request
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2HCIS149-49TGRTV Advanced Interconnections Corp
1 IC Socket, PGA149, 149 Contact(s), 2.54mm Term Pitch, 2.54mm Row Spacing, Solder 2HCIS149-49TGRTV 0 Build or Request
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CS149-49TG3M Advanced Interconnections Corp
1 IC Socket, PGA149, 149 Contact(s), 2.54mm Term Pitch, 2.54mm Row Spacing, Solder CS149-49TG3M 0 Build or Request
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HCIS149-49TGRTV Advanced Interconnections Corp
1 IC Socket, PGA149, 149 Contact(s), 2.54mm Term Pitch, 2.54mm Row Spacing, Solder HCIS149-49TGRTV 0 Build or Request
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HCIS149-49GT3M Advanced Interconnections Corp
1 IC Socket, PGA149, 149 Contact(s), 2.54mm Term Pitch, 2.54mm Row Spacing, Solder HCIS149-49GT3M 0 Build or Request
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E1SAA14-9.494531M Ecliptek Corporation
1 Parallel - Fundamental Quartz Crystal, 9.494531MHz Nom E1SAA14-9.494531M 0 Build or Request
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2149490-8 TE Connectivity
1 Configuration Features: Number of Ports 16 | Port Matrix Configuration 2 x 8 | Number of Positions 320 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Centerline (Pitch) .032 INCH | Cage Material Nickel Silver | Ce 2149490-8 1 Download Model
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2141494-9 TE Connectivity
1 1POS,CONTACT KIT,REC HSG,ASSY,CODI 2141494-9 1 Download Model
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2149490-6 TE Connectivity
1 Configuration Features: Number of Positions 320 | Port Matrix Configuration 2 x 8 | Number of Ports 16 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Centerline (Pitch) .032 INCH | Cage Material Nickel Silver | Ce 2149490-6 1 Download Model
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1-2149490-7 TE Connectivity
1 Configuration Features: Number of Ports 16 | Port Matrix Configuration 2 x 8 | Number of Positions 320 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Centerline (Pitch) .8 MM | Centerline (Pitch) .032 INCH | Cage 1-2149490-7 1 Download Model
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1-2149490-6 TE Connectivity
1 Configuration Features: Number of Ports 16 | Port Matrix Configuration 2 x 8 | Number of Positions 320 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Centerline (Pitch) .8 MM | Center 1-2149490-6 1 Download Model
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8779503149490 Wurth Elektronik
1 Board Connector, 49 Contact(s), 1 Row(s), Female, Right Angle, Solder Terminal 8779503149490 0 Build or Request
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2CIS149-49GT3M Advanced Interconnections Corp
1 IC Socket, PGA149, 149 Contact(s), 2.54mm Term Pitch, 2.54mm Row Spacing, Solder 2CIS149-49GT3M 0 Build or Request
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1-1614949-0 TE Connectivity
1 Fixed Resistor, Thin Film, 0.063W, 76800ohm, 0.1% +/-Tol, 25ppm/Cel, Surface Mount, 0805 1-1614949-0 0 Build or Request
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E1UDA14-9.494531M Ecliptek Corporation
1 Parallel - Fundamental Quartz Crystal, 9.494531MHz Nom E1UDA14-9.494531M 0 Build or Request
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1CIS149-49GG Advanced Interconnections Corp
1 IC Socket, PGA149, 149 Contact(s), 2.54mm Term Pitch, 2.54mm Row Spacing, Solder 1CIS149-49GG 0 Build or Request
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E1SLA14-9.494531M Ecliptek Corporation
1 Parallel - Fundamental Quartz Crystal, 9.494531MHz Nom E1SLA14-9.494531M 0 Build or Request
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4-HCS149-49TG Advanced Interconnections Corp
1 IC Socket, PGA149, 149 Contact(s), 2.54mm Term Pitch, 2.54mm Row Spacing, Solder 4-HCS149-49TG 0 Build or Request
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E1SNA14-9.494531MTR Ecliptek Corporation
1 Parallel - Fundamental Quartz Crystal, 9.494531MHz Nom E1SNA14-9.494531MTR 0 Build or Request
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E1UAA14-9.494531M Ecliptek Corporation
1 Parallel - Fundamental Quartz Crystal, 9.494531MHz Nom E1UAA14-9.494531M 0 Build or Request
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CS149-49GT3M Advanced Interconnections Corp
1 IC Socket, PGA149, 149 Contact(s), 2.54mm Term Pitch, 2.54mm Row Spacing, Solder CS149-49GT3M 0 Build or Request
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E1SEA14-9.494531M Ecliptek Corporation
1 Parallel - Fundamental Quartz Crystal, 9.494531MHz Nom E1SEA14-9.494531M 0 Build or Request
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E1UAA14-9.494531MTR Ecliptek Corporation
1 Parallel - Fundamental Quartz Crystal, 9.494531MHz Nom E1UAA14-9.494531MTR 0 Build or Request
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4-FS149-49TG Advanced Interconnections Corp
1 IC Socket, PGA149, 149 Contact(s), 2.54mm Term Pitch, 2.54mm Row Spacing, Solder 4-FS149-49TG 0 Build or Request
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1HCS149-49GT Advanced Interconnections Corp
1 IC Socket, PGA149, 149 Contact(s), 2.54mm Term Pitch, 2.54mm Row Spacing, Solder 1HCS149-49GT 0 Build or Request
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