57555 Model Download Search Results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
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BUK7575-55 NXP Semiconductors
1 Power Field-Effect Transistor, 19.7A I(D), 55V, 0.075ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220AB BUK7575-55 0 Build or Request
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13575-5561-AT90 RCD Components Inc
1 Fixed Resistor, Wire Wound, 3W, 5560ohm, 140V, 0.05% +/-Tol, 90ppm/Cel, 13575-5561-AT90 0 Build or Request
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13575-5561-AT90Q RCD Components Inc
1 Fixed Resistor, Wire Wound, 3W, 5560ohm, 140V, 0.05% +/-Tol, 90ppm/Cel, 13575-5561-AT90Q 0 Build or Request
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13575-5561-AB20 RCD Components Inc
1 Fixed Resistor, Wire Wound, 3W, 5560ohm, 140V, 0.05% +/-Tol, 20ppm/Cel, 13575-5561-AB20 0 Build or Request
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257-555/000-009/999-950 WAGO Innovative Connections
1 Strip Terminal Block, 16A, 2.5mm2, 1 Row(s), 1 Deck(s) 257-555/000-009/999-950 0 Build or Request
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13575-55R6-ABW RCD Components Inc
1 Fixed Resistor, Wire Wound, 3W, 55.6ohm, 140V, 0.05% +/-Tol, 13575-55R6-ABW 0 Build or Request
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2057555-1 TE Connectivity
1 Configuration Features: Number of Ports 2 | Port Matrix Configuration 1 x 2 | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Pluggable I/O Applications SFP+ | Heat Sink Compatible No | Other: EMI Containment Feature Type Elastomeric Gasket | Included Lightpipe No | Packaging Features: Packaging Method Tray | Product Type Features: Form Factor S 2057555-1 1 Download Model
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