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BUK7575-55
NXP Semiconductors
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1 | Power Field-Effect Transistor, 19.7A I(D), 55V, 0.075ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220AB | BUK7575-55 |
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13575-5561-AT90
RCD Components Inc
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1 | Fixed Resistor, Wire Wound, 3W, 5560ohm, 140V, 0.05% +/-Tol, 90ppm/Cel, | 13575-5561-AT90 |
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13575-5561-AT90Q
RCD Components Inc
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1 | Fixed Resistor, Wire Wound, 3W, 5560ohm, 140V, 0.05% +/-Tol, 90ppm/Cel, | 13575-5561-AT90Q |
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13575-5561-AB20
RCD Components Inc
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1 | Fixed Resistor, Wire Wound, 3W, 5560ohm, 140V, 0.05% +/-Tol, 20ppm/Cel, | 13575-5561-AB20 |
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257-555/000-009/999-950
WAGO Innovative Connections
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1 | Strip Terminal Block, 16A, 2.5mm2, 1 Row(s), 1 Deck(s) | 257-555/000-009/999-950 |
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13575-55R6-ABW
RCD Components Inc
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1 | Fixed Resistor, Wire Wound, 3W, 55.6ohm, 140V, 0.05% +/-Tol, | 13575-55R6-ABW |
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2057555-1
TE Connectivity
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1 | Configuration Features: Number of Ports 2 | Port Matrix Configuration 1 x 2 | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Pluggable I/O Applications SFP+ | Heat Sink Compatible No | Other: EMI Containment Feature Type Elastomeric Gasket | Included Lightpipe No | Packaging Features: Packaging Method Tray | Product Type Features: Form Factor S | 2057555-1 |
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