07399 Model Download Search Results
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32207399
Yageo Group
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1 | Industrial Temperature Sensors C220 (Cryo) Pt 100 Class B AgPd- wire | Other | 32207399 |
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0739982023
Molex
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1 | Board Connector, 3 Contact(s), 3 Row(s), Male, Straight, Press Fit Terminal | 0739982023 |
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3073995
Phoenix Contact
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1 | UT 4-PE/HESI (5X20) - Fuse modular terminal block, fuse type: Glass / ceramics / ..., fuse type: G / 5 x 20, nom. voltage: 500 V, nominal current: 6.3 A, connection method: Screw connection, Rated cross section: 4 mm2, cross section: 0.14 mm2- 6 mm2, mounting type: NS 35/7,5, NS 35/15, color: black | 3073995 |
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1073991
Phoenix Contact
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1 | UCT4-EMP (27X27) SR - Plastic label, Sheet, unmarked, can be labeled with: BLUEMARK E.CARD, BLUEMARK ID COLOR, BLUEMARK ID, THERMOMARK PRIME 2.0, THERMOMARK PRIME, THERMOMARK CARD 2.0, THERMOMARK CARD, TOPMARK NEO, TOPMARK LASER, mounting type: latching, Number of individual labels: 6, text field height: 27 mm, text field width: 27 mm | 1073991 |
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89073-999
Amphenol FCi
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1 | Board Connector, 24 Contact(s), 4 Row(s), Male, Straight, 0.079 inch Pitch, Press Fit Terminal, Locking, Plug | 89073-999 |
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2007399-3
TE Connectivity
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1 | Telecom and Datacom Connector | 2007399-3 |
0
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HNA007-399TT
Advanced Interconnections Corp
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1 | IC Socket, SIP7, 7 Contact(s), 2.54mm Term Pitch, 0.1mm Row Spacing, Solder | HNA007-399TT |
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1-2007399-7
TE Connectivity
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1 | Configuration Features: Lightpipe Style Standard | Port Matrix Configuration 2 x 4 | Number of Ports 8 | Number of Positions 160 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Current Rating (Max) .5 AMP | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: | 1-2007399-7 |
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HNA007-399TG
Advanced Interconnections Corp
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1 | IC Socket, SIP7, 7 Contact(s), 2.54mm Term Pitch, 0.1mm Row Spacing, Solder | HNA007-399TG |
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SI5338C-B07399-GM
Silicon Laboratories Inc
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1 | Processor Specific Clock Generator, 200MHz, CMOS | SI5338C-B07399-GM |
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89073-993
Amphenol FCi
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1 | Board Connector, 24 Contact(s), 4 Row(s), Male, Straight, 0.079 inch Pitch, Press Fit Terminal, Locking, Plug | 89073-993 |
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2-1110739-9
TE Connectivity
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1 | CONNECTOR ACCESSORY | 2-1110739-9 |
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89007-399
Amphenol FCi
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1 | Board Connector, 60 Contact(s), 5 Row(s), Male, Straight, 0.079 inch Pitch, Press Fit Terminal, Locking, Plug | 89007-399 |
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89073-996
Amphenol Communications Solutions
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1 | Board Connector, 14 Contact(s), 4 Row(s), Male, Straight, 0.079 inch Pitch, Press Fit Terminal, Locking, Plug | 89073-996 |
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89073-996
Amphenol FCi
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1 | Board Connector, 14 Contact(s), 4 Row(s), Male, Straight, 0.079 inch Pitch, Press Fit Terminal, Locking, Plug | 89073-996 |
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89073-999
Amphenol Communications Solutions
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1 | Board Connector, 24 Contact(s), 4 Row(s), Male, Straight, 0.079 inch Pitch, Press Fit Terminal, Locking, Plug | 89073-999 |
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2007399-1
TE Connectivity
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1 | Telecom and Datacom Connector | 2007399-1 |
0
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NA007-399GT
Advanced Interconnections Corp
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1 | IC Socket, SIP27, 7 Contact(s), 2.54mm Term Pitch, 0.1mm Row Spacing, Solder | NA007-399GT |
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NA007-399TT
Advanced Interconnections Corp
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1 | IC Socket, SIP27, 7 Contact(s), 2.54mm Term Pitch, 0.1mm Row Spacing, Solder | NA007-399TT |
0
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2007399-5
TE Connectivity
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1 | Configuration Features: Number of Ports 8 | Port Matrix Configuration 2 x 4 | Number of Positions 160 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Centerline (Pitch) .032 INCH | Centerline (Pitch) .8 MM | Cage M | 2007399-5 |
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HNA007-399GT
Advanced Interconnections Corp
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1 | IC Socket, SIP7, 7 Contact(s), 2.54mm Term Pitch, 0.1mm Row Spacing, Solder | HNA007-399GT |
0
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ZPF000000000007399
TE Connectivity
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1 | MIL Series Connector, 8 Contact(s), Stainless Steel, Male, Crimp Terminal, Receptacle | ZPF000000000007399 |
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2007399-6
TE Connectivity
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1 | Configuration Features: Number of Ports 8 | Number of Positions 160 | Port Matrix Configuration 2 x 4 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Centerline (Pitch) .032 INCH | Cen | 2007399-6 |
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1-2007399-6
TE Connectivity
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1 | Configuration Features: Number of Positions 160 | Port Matrix Configuration 2 x 4 | Lightpipe Style Standard | Number of Ports 8 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: | 1-2007399-6 |
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32207399
Heraeus Holdings GmBH
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1 | RTD Platinum Sensor, 100ohm, Rectangular, 2 Pin | 32207399 |
0
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![Part Image](["https://componentsearchengine.com/Images/1/32207399.jpg",null,null])
![Part Image](["https://caas.phoenixcontact.com/caas/v1/stable/media/221950/full/b148?format=jpg",null,null])
![Part Image](["https://caas.phoenixcontact.com/caas/v1/stable/media/202274/full/b148?format=jpg",null,null])
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