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AR11-4454I Allied Components International
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1 1 Port RJ45 Through Hole 10/100/1000 Base-T, AutoMDIX, -40°C ~ 85°C Other AR11-4454I 1 Download Model
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2-1445057-5 TE Connectivity
1 Configuration Features: Number of Power Positions 5 | PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 5 | Contact Features: Contact Mating Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Are Other 2-1445057-5 1 Download Model
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2-1445054-4 TE Connectivity
1 Configuration Features: Number of Power Positions 4 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Layout Inline Other 2-1445054-4 1 Download Model
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2-1445050-8 TE Connectivity
1 Configuration Features: Number of Rows 1 | Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Positions 8 | Contact Features: PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Layout Inline | Contact Mating Area Plating Material Th Other 2-1445050-8 1 Download Model
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2-1445050-9 TE Connectivity
1 Configuration Features: Number of Power Positions 9 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 9 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 3 Other 2-1445050-9 1 Download Model
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2-1445093-5 TE Connectivity
1 Configuration Features: Number of Positions 5 | Number of Rows 1 | Number of Power Positions 5 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Type Pin | Contact Mating Area Plating Material Thickness 30 MICIN | Cont Other 2-1445093-5 1 Download Model
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2-1445100-5 TE Connectivity
1 Configuration Features: Number of Rows 1 | Number of Signal Positions 0 | PCB Mount Orientation Right Angle | Number of Power Positions 5 | Number of Positions 5 | Contact Features: PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Type Pin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Retention Within Housi Other 2-1445100-5 1 Download Model
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2-1445088-6 TE Connectivity
1 Configuration Features: Number of Positions 6 | Number of Power Positions 6 | PCB Mount Orientation Right Angle | Number of Rows 1 | Contact Features: Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Layout Inline | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Terminat Other 2-1445088-6 1 Download Model
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2-1445055-5 TE Connectivity
1 Configuration Features: Number of Positions 5 | PCB Mount Orientation Right Angle | Number of Power Positions 5 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Retention W Other 2-1445055-5 1 Download Model
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2-1445093-8 TE Connectivity
1 Configuration Features: Number of Rows 1 | Number of Positions 8 | PCB Mount Orientation Vertical | Number of Power Positions 8 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Layout Inline | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Ter Other 2-1445093-8 1 Download Model
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2-1445055-7 TE Connectivity
1 Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 7 | Number of Positions 7 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Wit Other 2-1445055-7 1 Download Model
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2-1445099-4 TE Connectivity
1 Configuration Features: Number of Positions 4 | Number of Rows 1 | Number of Power Positions 4 | PCB Mount Orientation Right Angle | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plati Other 2-1445099-4 1 Download Model
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2-1445099-3 TE Connectivity
1 Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 3 | Number of Power Positions 3 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness .76 MI Other 2-1445099-3 1 Download Model
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2-1445088-4 TE Connectivity
1 Configuration Features: Number of Rows 1 | Number of Positions 4 | PCB Mount Orientation Right Angle | Number of Power Positions 4 | Contact Features: Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Retention Within Housing Without | Contact Type Pin | Contact Layout Inline | PCB Contact Terminati Other 2-1445088-4 1 Download Model
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2-1445091-2 TE Connectivity
1 Configuration Features: Number of Rows 1 | Number of Power Positions 2 | PCB Mount Orientation Right Angle | Number of Positions 2 | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.5 Other 2-1445091-2 1 Download Model
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2-1445053-6 TE Connectivity
1 Configuration Features: Number of Positions 6 | Number of Power Positions 6 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: Contact Type Pin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 2.54 MIC Other 2-1445053-6 1 Download Model
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2-1445088-5 TE Connectivity
1 Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 5 | Number of Rows 1 | Number of Positions 5 | Contact Features: Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Type Pin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Tin | Dimensions: Produ Other 2-1445088-5 1 Download Model
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2-1445057-8 TE Connectivity
1 Configuration Features: Number of Positions 8 | PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Power Positions 8 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Layout Inline | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PC Other 2-1445057-8 1 Download Model
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2-1445053-8 TE Connectivity
1 Configuration Features: Number of Rows 1 | Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Positions 8 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Terminatio Other 2-1445053-8 1 Download Model
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2-1445057-6 TE Connectivity
1 Configuration Features: Number of Power Positions 6 | Number of Positions 6 | Number of Rows 1 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | Contact Type Pin | Contact Retention Within Hou Other 2-1445057-6 1 Download Model
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2-1445094-4 TE Connectivity
1 Configuration Features: Number of Rows 1 | Number of Power Positions 4 | PCB Mount Orientation Vertical | Number of Positions 4 | Contact Features: Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 2.54 MICM | Contac Other 2-1445094-4 1 Download Model
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2-1445050-2 TE Connectivity
1 Configuration Features: Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Are Other 2-1445050-2 1 Download Model
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2-1445085-2 TE Connectivity
1 Configuration Features: Number of Power Positions 2 | Number of Rows 1 | Number of Positions 2 | PCB Mount Orientation Vertical | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Other 2-1445085-2 1 Download Model
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2-1445057-3 TE Connectivity
1 Configuration Features: Number of Power Positions 3 | PCB Mount Orientation Right Angle | Number of Positions 3 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.5 Other 2-1445057-3 1 Download Model
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2-1445087-6 TE Connectivity
1 Configuration Features: Number of Power Positions 6 | Number of Rows 1 | Number of Positions 6 | PCB Mount Orientation Vertical | Contact Features: Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Mater Other 2-1445087-6 1 Download Model
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