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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AR11-4454I
Allied Components International
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1 | 1 Port RJ45 Through Hole 10/100/1000 Base-T, AutoMDIX, -40°C ~ 85°C | Other | AR11-4454I |
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2-1445057-5
TE Connectivity
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1 | Configuration Features: Number of Power Positions 5 | PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 5 | Contact Features: Contact Mating Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Are | Other | 2-1445057-5 |
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2-1445054-4
TE Connectivity
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1 | Configuration Features: Number of Power Positions 4 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Layout Inline | Other | 2-1445054-4 |
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2-1445050-8
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Positions 8 | Contact Features: PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Layout Inline | Contact Mating Area Plating Material Th | Other | 2-1445050-8 |
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2-1445050-9
TE Connectivity
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1 | Configuration Features: Number of Power Positions 9 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 9 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 3 | Other | 2-1445050-9 |
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2-1445093-5
TE Connectivity
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1 | Configuration Features: Number of Positions 5 | Number of Rows 1 | Number of Power Positions 5 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Type Pin | Contact Mating Area Plating Material Thickness 30 MICIN | Cont | Other | 2-1445093-5 |
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2-1445100-5
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Signal Positions 0 | PCB Mount Orientation Right Angle | Number of Power Positions 5 | Number of Positions 5 | Contact Features: PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Type Pin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Retention Within Housi | Other | 2-1445100-5 |
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2-1445088-6
TE Connectivity
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1 | Configuration Features: Number of Positions 6 | Number of Power Positions 6 | PCB Mount Orientation Right Angle | Number of Rows 1 | Contact Features: Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Layout Inline | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Terminat | Other | 2-1445088-6 |
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2-1445055-5
TE Connectivity
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1 | Configuration Features: Number of Positions 5 | PCB Mount Orientation Right Angle | Number of Power Positions 5 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Retention W | Other | 2-1445055-5 |
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2-1445093-8
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 8 | PCB Mount Orientation Vertical | Number of Power Positions 8 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Layout Inline | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Ter | Other | 2-1445093-8 |
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2-1445055-7
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 7 | Number of Positions 7 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Wit | Other | 2-1445055-7 |
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2-1445099-4
TE Connectivity
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1 | Configuration Features: Number of Positions 4 | Number of Rows 1 | Number of Power Positions 4 | PCB Mount Orientation Right Angle | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plati | Other | 2-1445099-4 |
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2-1445099-3
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 3 | Number of Power Positions 3 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness .76 MI | Other | 2-1445099-3 |
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2-1445088-4
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 4 | PCB Mount Orientation Right Angle | Number of Power Positions 4 | Contact Features: Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Retention Within Housing Without | Contact Type Pin | Contact Layout Inline | PCB Contact Terminati | Other | 2-1445088-4 |
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2-1445091-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 2 | PCB Mount Orientation Right Angle | Number of Positions 2 | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.5 | Other | 2-1445091-2 |
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2-1445053-6
TE Connectivity
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1 | Configuration Features: Number of Positions 6 | Number of Power Positions 6 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: Contact Type Pin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 2.54 MIC | Other | 2-1445053-6 |
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2-1445088-5
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 5 | Number of Rows 1 | Number of Positions 5 | Contact Features: Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Type Pin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Tin | Dimensions: Produ | Other | 2-1445088-5 |
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2-1445057-8
TE Connectivity
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1 | Configuration Features: Number of Positions 8 | PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Power Positions 8 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Layout Inline | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PC | Other | 2-1445057-8 |
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2-1445053-8
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Positions 8 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Terminatio | Other | 2-1445053-8 |
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2-1445057-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 6 | Number of Positions 6 | Number of Rows 1 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | Contact Type Pin | Contact Retention Within Hou | Other | 2-1445057-6 |
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2-1445094-4
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 4 | PCB Mount Orientation Vertical | Number of Positions 4 | Contact Features: Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 2.54 MICM | Contac | Other | 2-1445094-4 |
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2-1445050-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Are | Other | 2-1445050-2 |
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2-1445085-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | Number of Rows 1 | Number of Positions 2 | PCB Mount Orientation Vertical | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB | Other | 2-1445085-2 |
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2-1445057-3
TE Connectivity
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1 | Configuration Features: Number of Power Positions 3 | PCB Mount Orientation Right Angle | Number of Positions 3 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.5 | Other | 2-1445057-3 |
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2-1445087-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 6 | Number of Rows 1 | Number of Positions 6 | PCB Mount Orientation Vertical | Contact Features: Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Mater | Other | 2-1445087-6 |
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