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214721-0100
Molex
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1 | MOLEX - 214721-0100 - Pin Header, Signal, Wire-to-Board, 0.8 mm, 1 Rows, 10 Contacts, Surface Mount Right Angle | Other | 214721-0100 |
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MAX14720AEWA+
Analog Devices
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1 | MAXIM INTEGRATED PRODUCTS - MAX14720AEWA+ - PMU, 1 BUCK, 1 LDO, 5.5V, WLP-25 | BGA | MAX14720AEWA+ |
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5-147278-5
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Positions 6 | PCB Mount Orientation Right Angle | Number of Rows 1 | Contact Features: Contact Shape & Form Square | Contact Mating Area Length .23 INCH | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Thickness .381 MICM | Contact Type Pin | PCB Contact Termination Area Plating Material Finish Matte | Mating Square Post Dimension | Other | 5-147278-5 |
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MAX14724ETP+T
Analog Devices
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1 | Serial-Controlled 8:4 Matrix Switch Multiplexer 1 Circuit IC Switch 8:4 3Ohm 20-TQFN (4x4) 250nA,1.6V ~ 5.5V | Quad Flat No-Lead | MAX14724ETP+T |
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5-147278-4
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Rows 1 | Number of Positions 5 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 – 5.08 MICM | Contact Mating Area Plating Material Thickness .381 MICM | Contact Mating Area Length .23 INCH | Mating Square Post Dimension .025 INCH | PCB Contact Termination Area Plating Material Thickness 100 – 200 MICIN | Contact Current Rating (Max) 3 AMP | Contact Type Pin | | Other | 5-147278-4 |
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5-147278-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Positions 3 | Contact Features: Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 3 AMP | Mating Square Post Dimension .64 MM | Contact Shape & Form Square | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 100 – 200 MICIN | Mating Square Post Dimension .025 INCH | PCB Contact Termination Area Plating Material Thickness 2.54 | Other | 5-147278-2 |
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MAX14724ETP+
Analog Devices
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1 | Serial-Controlled 8:4 Matrix Switch Multiplexer 1 Circuit IC Switch 8:4 3Ohm 20-TQFN (4x4) -40°C ~ 85°C,1.6V ~ 5.5V,3Ohm | Quad Flat No-Lead | MAX14724ETP+ |
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147278-4
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Rows 1 | Number of Positions 5 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness .381 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 – 5.08 MICM | Contact Base Material Brass | Contact Mating Area Length .23 INCH | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 100 – 2 | Other | 147278-4 |
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721-472/001-000
Wago
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1 | THT male header; 1.2 x 1.2 mm solder pin; angled; 100% protected against mismating; Pin spacing 5 mm; 12-pole | Other | 721-472/001-000 |
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MCR03EZPFX1472
ROHM Semiconductor
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1 | Resistor Chip | Resistor Chip | MCR03EZPFX1472 |
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CR0805-FX-1472ELF
Bourns
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1 | Thick Film Resistors - SMD 14.7K 1% | Resistor Chip | CR0805-FX-1472ELF |
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4609X-101-472LF
Bourns
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1 | 8-bussed thick film resistor,4K7 1.13W Bourns Bussed Resistor Network 4.7kΩ ±2% 8 Resistors, 1.13W Total, SIP package 4600X Through Hole | Other | 4609X-101-472LF |
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4816P-1-472LF
Bourns
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1 | Bourns 4800X Series 4.7kΩ ±2% Isolated SMT Resistor Array, 8 Resistors, 1.28W total SOIC package | Small Outline Packages | 4816P-1-472LF |
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FOXSLF/147-20
Fox
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1 | Crystals 14.7456MHz 20pF | Other | FOXSLF/147-20 |
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44914-7202
Molex
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1 | Headers & Wire Housings MicroFit 3.0 Hdr Ver Vert CPI 22 ckt 208 | Other | 44914-7202 |
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ECWU1472JX5
Panasonic
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1 | PANASONIC - ECWU1472JX5 - DC Film Capacitor, 4700 pF, 100 V, Metallized PEN Stacked, ± 5%, ECWU(X) Series, 1206 [3216 Metric] | Other | ECWU1472JX5 |
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1 | Crystals CRYSTAL 14.7456MHZ 20PF SMD,ECX-64A,+/-50ppm,+/-30ppm,20pF,80 Ohm,Fundamental,-10 C 70 C,4-SMD, No Lead (DFN, LCC),0.236" L x 0.138" W (6.00mm x 3.50mm),0.043" (1.10mm) | Other | ECS-147-20-23A-TR |
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4606X-101-472LF
Bourns
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1 | 4.7k Ohm ±2% 200mW Power Per Element Bussed 5 Resistor Network/Array ±100ppm/°C 6-SIP | Other | 4606X-101-472LF |
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MP1472GJ-P
Monolithic Power Systems (MPS)
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1 | Switching Voltage Regulators 2A, 18V Sync Step-Down DCDC | Small Outline Packages | MP1472GJ-P |
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HPTF0805-TC-1472DT
Venkel
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1 | High Power Thin Film CR,0805,1/4W,?50PPM,14.7K,?0.5% | Other | HPTF0805-TC-1472DT |
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B82498F1472J000
TDK
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1 | Epcos B82498F Series Wire-wound SMD Inductor with a Ferrite Core, 4.7 μH ±5% 90mA Idc Q:20 | Other | B82498F1472J000 |
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87427-1472
Molex
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1 | Mini-Fit Jr. Header, 4.20mm Pitch, Right-Angle, without Flange, 14 Circuits | Other | 87427-1472 |
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HPTF1206-TP-1472FT
Venkel
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1 | High Power Thin Film CR,1206,1/4W,?5PPM,14.7K,?1% | Other | HPTF1206-TP-1472FT |
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HPTF1210-UN-1472FT
Venkel
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1 | High Power Thin Film CR,1210,1/3W,?10PPM,14.7K,?1% | Other | HPTF1210-UN-1472FT |
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HPTF2010-UE-1472CT
Venkel
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1 | High Power Thin Film CR,2010,1/3W,?25PPM,14.7K,?0.25% | Other | HPTF2010-UE-1472CT |
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![Part Image](["//media.rs-online.com/t_large/Y2408487-01.jpg",null,null])
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![Part Image](["https://www.te.com/content/dam/te-com/catalog/part/051/472/785/5-147278-5-t1.jpg/jcr:content/renditions/product-details.png","https://www.te.com/content/dam/te-com/catalog/part/051/472/785/5-147278-5-t1.jpg/jcr:content/renditions/product-details.png",null])
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