18-45 Model Download Search Results
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CY7C2263KV18-450BZXI
Infineon
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1 | SRAM Chip Sync Dual 1.8V 36M-bit 2M x 18 0.45ns 165-Pin FBGA Tray | BGA | CY7C2263KV18-450BZXI |
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72T1845L5BB
Renesas Electronics
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1 | The 72T1845 is a 2K x 18 / 4K x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode. | BGA | 72T1845L5BB |
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CY7C1643KV18-450BZI
Infineon
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1 | SRAM Chip Sync Dual 1.8V 144M-bit 8M x 18 0.45ns 165-Pin FBGA Tray | BGA | CY7C1643KV18-450BZI |
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72T1845L5BBI
Renesas Electronics
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1 | The 72T1845 is a 2K x 18 / 4K x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode. | BGA | 72T1845L5BBI |
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72T1845L4-4BB
Renesas Electronics
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1 | The 72T1845 is a 2K x 18 / 4K x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode. | BGA | 72T1845L4-4BB |
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72T1845L6-7BB
Renesas Electronics
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1 | The 72T1845 is a 2K x 18 / 4K x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode. | BGA | 72T1845L6-7BB |
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IS7-1845ASRH-8S9000
Renesas Electronics
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1 | Switching Controllers | Ceramic Dual-In-Line Packages | IS7-1845ASRH-8S9000 |
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PF2W121MNN1845
ELITE
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1 | Capacitor: electrolytic; THT; 120uF; 450VDC; Ø18x45mm; Pitch: 7.5mm | Capacitor, Polarized Radial Diameter | PF2W121MNN1845 |
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MKP1845447405
Vishay
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1 | 0.47 µF Film Capacitor 220V 400V Polypropylene (PP), Metallized Axial, -55°C to 100°C | Other | MKP1845447405 |
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PIC16F18456-I/SP
Microchip
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1 | Microchip PIC16F18456-I/SP, 8bit PIC Microcontroller, 32MHz, 28 kB Flash, 28-Pin SPDIP | Dual-In-Line Packages | PIC16F18456-I/SP |
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PIC16F18456T-I/SO
Microchip
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1 | 8-bit Microcontrollers - MCU 28KB, 2KB RAM, 2xPWMs, Comparator, DAC, 12-bit ADCC, CWG, EUSART, 2 SPI/I2C | Small Outline Packages | PIC16F18456T-I/SO |
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PIC16F18455-E/STX
Microchip
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1 | 8-bit Microcontrollers - MCU 14KB, 1KB RAM, 2xPWMs, Comparator, DAC, 12-bit ADCC, CWG, EUSART, SPI/I2C | Quad Flat No-Lead | PIC16F18455-E/STX |
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IS7-1845ASRH-QZ
Renesas Electronics
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1 | Switching Controllers | Dual-In-Line Packages | IS7-1845ASRH-QZ |
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DS1845E-010+T&R
Analog Devices
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1 | Digital Potentiometer ICs Dual NV w/Memory | Small Outline Packages | DS1845E-010+T&R |
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M20-9981845
Harwin
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1 | M20: 18+18 Pos Plug DIL Straight 3mm THT Connector 6.1mm pin Gold | Header, Vertical | M20-9981845 |
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DS1845B-050+
Analog Devices
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1 | Two linear taper potentiometers DS1845-010 one 10k, 100 position & one 10k, 256 position DS1845-050 one 10k, 100 position & one 50k, 256 postition DS1845-100 one 10k, 100 position & one 100k, 256 position256 bytes of EEPROM memoryAccess to data and potentiometer control via an I2C compatible 2-wire interfaceExternal Write Enable pin to protect data and potentiometer settingsNonvolatile wiper storageOperates from 3V or 5V suppliesPackaging: Flip Chip Package, 16-ball CSBGA, 14-pin TSSOPIndustrial operating t | BGA | DS1845B-050+ |
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1845263
Phoenix Contact
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1 | DMCV 0,5/11-G1-2,54 SMD R56 - PCB headers, nominal cross section: 0.5 mm2, color: black, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Au, contact connection type: Pin, number of potentials: 22, number of rows: 2, number of positions: 11, number of connections: 22, product range: DMCV 0,5/..-G1-SMD, pitch: 2.54 mm, mounting: SMD soldering, pin layout: Linear pad geometry, number of solder pins per potential: 1, plug-in system: COMBICON DFMC 0,5, Pin connector pattern alignm | Other | 1845263 |
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1845234
Phoenix Contact
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1 | DMCV 0,5/ 8-G1-2,54 SMD R44 - PCB headers, nominal cross section: 0.5 mm2, color: black, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Au, contact connection type: Pin, number of potentials: 16, number of rows: 2, number of positions: 8, number of connections: 16, product range: DMCV 0,5/..-G1-SMD, pitch: 2.54 mm, mounting: SMD soldering, pin layout: Linear pad geometry, number of solder pins per potential: 1, plug-in system: COMBICON DFMC 0,5, Pin connector pattern alignme | Other | 1845234 |
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1845260000
Weidmüller
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1 | PCB terminal, 160 V, 16 A, Pitch in mm: 3.50, 2.08 mm², Number of poles: 8, Clamping yoke connection, THT solder connection, 135°, Box | Other | 1845260000 |
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DS1845E-050+T&R
Analog Devices
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1 | Two linear taper potentiometers DS1845-010 one 10k, 100 position & one 10k, 256 position DS1845-050 one 10k, 100 position & one 50k, 256 postition DS1845-100 one 10k, 100 position & one 100k, 256 position256 bytes of EEPROM memoryAccess to data and potentiometer control via an I2C compatible 2-wire interfaceExternal Write Enable pin to protect data and potentiometer settingsNonvolatile wiper storageOperates from 3V or 5V suppliesPackaging: Flip Chip Package, 16-ball CSBGA, 14-pin TSSOPIndustrial operating t | Small Outline Packages | DS1845E-050+T&R |
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1845840
Phoenix Contact
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1 | MDSTBVA 2,5/ 8-G - PCB headers, nominal cross section: 2.5 mm2, color: green, nominal current: 10 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 16, number of rows: 2, number of positions: 8, number of connections: 16, product range: MDSTBVA 2,5/..-G, pitch: 5 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.9 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pattern al | Other | 1845840 |
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1845222
Phoenix Contact
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1 | MC 1,5/ 2-GF-3,81 AU - PCB headers, nominal cross section: 1.5 mm2, color: green, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Au, contact connection type: Pin, number of potentials: 2, number of rows: 1, number of positions: 2, number of connections: 2, product range: MC 1,5/..-GF, pitch: 3.81 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.4 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern alig | Other | 1845222 |
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1845310000
Weidmüller
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1 | PCB terminal, 320 V, 17.5 A, Pitch in mm: 5.00, 2.5 mm², Number of poles: 5, Clamping yoke connection, THT solder connection, 90°, Box | Other | 1845310000 |
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1845578
Phoenix Contact
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1 | MDSTBV 2,5/11-G-5,08 - PCB headers, nominal cross section: 2.5 mm2, color: green, nominal current: 10 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 22, number of rows: 2, number of positions: 11, number of connections: 22, product range: MDSTBV 2,5/..-G, pitch: 5.08 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.9 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pat | Other | 1845578 |
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1845714
Phoenix Contact
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1 | MDSTBV 2,5/10-GF-5,08 - PCB headers, nominal cross section: 2.5 mm2, color: green, nominal current: 10 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 20, number of rows: 2, number of positions: 10, number of connections: 20, product range: MDSTBV 2,5/..-GF, pitch: 5.08 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.9 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector p | Other | 1845714 |
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