18-65 Model Download Search Results
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18-6513-10
ARIES
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1 | 18 (2 x 9) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole | Other | 18-6513-10 |
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44472-1865
Molex
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1 | Mini-Fit HCS Header, 4.20mm Pitch, Dual Row, Vertical, without Snap-in Plastic Peg PCB Lock, 18 Circuits, PA Polyamide Nylon 6/6 94V-0 | Other | 44472-1865 |
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72T1865L6-7BB
Renesas Electronics
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1 | The 72T1865 is a 8K x 18 / 16K x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode. | BGA | 72T1865L6-7BB |
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72T1865L5BBI
Renesas Electronics
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1 | The 72T1865 is a 8K x 18 / 16K x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode. | BGA | 72T1865L5BBI |
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72T1865L4-4BB
Renesas Electronics
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1 | The 72T1865 is a 8K x 18 / 16K x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode. | BGA | 72T1865L4-4BB |
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72T1865L5BB
Renesas Electronics
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1 | The 72T1865 is a 8K x 18 / 16K x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode. | BGA | 72T1865L5BB |
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721-865/001-000
Wago
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1 | THT male header; 1.2 x 1.2 mm solder pin; angled; 100% protected against mismating; Pin spacing 7.5 mm; 5-pole | Other | 721-865/001-000 |
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1 | THR male header; 1.2 x 1.2 mm solder pin; angled; in tape-and-reel packaging; Pin spacing 7.5 mm; 5-pole | Other | 231-865/001-000/105-604/997-407 |
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1 | THR male header; 1.2 x 1.2 mm solder pin; angled; Pin spacing 7.5 mm; 5-pole | Other | 231-865/001-000/105-604 |
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BK-18650-PC4
Memory Protection Devices
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1 | HOLDER BATT LI-ION 2CELL 4PC PIN | Other | BK-18650-PC4 |
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BK-18650-PC2
Memory Protection Devices
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1 | HOLDER BATT 1/LI-ION PROTECTED | Other | BK-18650-PC2 |
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LTC1865ACS8#PBF
Analog Devices
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1 | LTC1865ACS8#PBF, 16 bit ADC Differential, SPI, 8-Pin SOIC | Small Outline Packages | LTC1865ACS8#PBF |
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MY-18650-01
MYOUNG
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1 | Contact / elastic device Plugin Battery Connectors | Other | MY-18650-01 |
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LTC1865AHMS#PBF
Analog Devices
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1 | LINEAR TECHNOLOGY - LTC1865AHMS#PBF - Analogue to Digital Converter, Dual, 16 bit, 250 kSPS, Differential, Single Ended, Serial, Single | Small Outline Packages | LTC1865AHMS#PBF |
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LTC1865LAIMS#PBF
Analog Devices
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1 | Analog to Digital Converters - ADC Power, 3V, 16-Bit, 150ksps 1- and 2-Channel ADCs in MSOP | Small Outline Packages | LTC1865LAIMS#PBF |
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LTC1865ACMS#PBF
Analog Devices
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1 | LINEAR TECHNOLOGY - LTC1865ACMS#PBF - Analogue to Digital Converter, 16 bit, 250 kSPS, Single Ended, SPI, Single, 4.75 V | Small Outline Packages | LTC1865ACMS#PBF |
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1865-13G-LDN
Honeywell
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1 | Force/Pressure transducer | Other | 1865-13G-LDN |
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MAX31865AAP+
Analog Devices
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1 | Temp Monitoring System (Sensor) External Sensor SPI Output 20-SSOP | Small Outline Packages | MAX31865AAP+ |
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1718650
Phoenix Contact
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1 | GSMKDSN 1,5/ 7-7,62 - Printed circuit board terminal, nominal current: 16 A, rated voltage (III/2): 630 V, nominal cross section: 1.5 mm2, number of potentials: 7, number of rows: 1, number of positions per row: 7, product range: GSMKDSN 1,5, pitch: 7.62 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: Wave soldering, conductor/PCB connection direction: 45 °, color: green, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins p | Other | 1718650 |
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50361865
Molex
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1 | Mini-Fit Jr. Header, Dual Row, Right-Angle, with Snap-in Plastic Peg PCB Lock, 24 Circuits | Other | 50361865 |
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50-36-1865
Molex
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1 | Mini-Fit Jr. Header, Dual Row, Right-Angle, with Snap-in Plastic Peg PCB Lock, Nylon 6/6 94V-2, 2.54?m Matte Tin (Sn) Plating, Natural, Tray | Other | 50-36-1865 |
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PS21865-P
Power Semiconductors
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1 | INTELLIGENT POWER MODULE, 600V, 20A, DIP; DC Collector Current:20A; Collector Emitter Saturation Voltage Vce(on):600V; Power Dissipation Pd:52.6W; Junction Temperature, Tj Max:100°C; IGBT Termination:Solder; Product Range:- | Other | PS21865-P |
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BK-18650-PC8
Memory Protection Devices
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1 | HOLDER BATT LI-ION 4CELL 8PC PIN | Dual-In-Line Sockets | BK-18650-PC8 |
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1818656
Phoenix Contact
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1 | DMCV 1,5/10-G1-3,5 P20THR R56 - PCB headers, nominal cross section: 1.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Pin, number of potentials: 20, number of rows: 2, number of positions: 10, number of connections: 20, product range: DMCV 1,5/..-G1-THR, pitch: 3.5 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 2 mm, number of solder pins per potential: 1, plug-in system: COMBICON DFM | Other | 1818656 |
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BHC-18650-1P
Comfortable Electronics
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1 | Holder; MR18650; Batt.no: 1; for PCB; black | Other | BHC-18650-1P |
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