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2-1445085-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | Number of Rows 1 | Number of Positions 2 | PCB Mount Orientation Vertical | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB | Other | 2-1445085-2 |
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2-1445091-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 2 | PCB Mount Orientation Right Angle | Number of Positions 2 | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.5 | Other | 2-1445091-2 |
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2-1445099-2
TE Connectivity
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1 | PCB Mount Header, Right Angle, Wire-to-Board, 2 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold (Au), Surface Mount, Power, Micro MATE-N-LOK | Other | 2-1445099-2 |
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2-1445093-2
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 2 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Through Hole - Solder, Power, Micro MATE-N-LOK | Other | 2-1445093-2 |
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2-1445084-2
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 2 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Through Hole - Solder, Power, Micro MATE-N-LOK | Other | 2-1445084-2 |
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2-1445050-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Are | Other | 2-1445050-2 |
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2-1445096-2
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 2 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold (Au), Surface Mount, Power, Micro MATE-N-LOK | Other | 2-1445096-2 |
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2-1445057-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | PCB Mount Orientation Right Angle | Number of Positions 2 | Number of Rows 1 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Layout Inline | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area | Other | 2-1445057-2 |
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2-1445097-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | Number of Positions 2 | Number of Rows 1 | PCB Mount Orientation Right Angle | Contact Features: Contact Layout Inline | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Type Pin | Multiple Contact Types Without | PCB Contact Termination Ar | Other | 2-1445097-2 |
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2-1445054-2
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Power Positions 2 | Number of Rows 1 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Tin | Contact Type Pin | PCB Contac | Other | 2-1445054-2 |
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2-1445098-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 2 | Number of Positions 2 | Contact Features: Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Retenti | Other | 2-1445098-2 |
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2-1445055-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 2 | Number of Positions 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 MICM | C | Other | 2-1445055-2 |
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2-1445094-2
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: Multiple Contact Types Without | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contac | Other | 2-1445094-2 |
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2-1445052-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 2 | Number of Rows 1 | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contac | Other | 2-1445052-2 |
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2-1445053-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Power Positions 2 | Number of Positions 2 | Contact Features: Multiple Contact Types Without | Contact Layout Inline | Contact Retention Within Housing Without | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating M | Other | 2-1445053-2 |
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2-1445056-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 2 | Contact Features: Contact Layout Inline | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 2.54 MICM | Mul | Other | 2-1445056-2 |
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2-1445088-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 2 | Number of Positions 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Type Pin | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plati | Other | 2-1445088-2 |
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2-1445085-6
TE Connectivity
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1 | Connector Header Through Hole 6 position 0.118" (3.00mm) , UL94 V-0 , 250V , 100.0µin , -40°C ~ 105°C | Other | 2-1445085-6 |
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2-1445100-5
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Signal Positions 0 | PCB Mount Orientation Right Angle | Number of Power Positions 5 | Number of Positions 5 | Contact Features: PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Type Pin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Retention Within Housi | Other | 2-1445100-5 |
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2-1445054-4
TE Connectivity
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1 | Configuration Features: Number of Power Positions 4 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Layout Inline | Other | 2-1445054-4 |
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2-1445057-5
TE Connectivity
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1 | Configuration Features: Number of Power Positions 5 | PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 5 | Contact Features: Contact Mating Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Are | Other | 2-1445057-5 |
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2-1445093-5
TE Connectivity
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1 | Configuration Features: Number of Positions 5 | Number of Rows 1 | Number of Power Positions 5 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Type Pin | Contact Mating Area Plating Material Thickness 30 MICIN | Cont | Other | 2-1445093-5 |
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2-1445088-6
TE Connectivity
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1 | Configuration Features: Number of Positions 6 | Number of Power Positions 6 | PCB Mount Orientation Right Angle | Number of Rows 1 | Contact Features: Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Layout Inline | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Terminat | Other | 2-1445088-6 |
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2-1445050-8
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Positions 8 | Contact Features: PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Layout Inline | Contact Mating Area Plating Material Th | Other | 2-1445050-8 |
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2-1445050-9
TE Connectivity
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1 | Configuration Features: Number of Power Positions 9 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 9 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 3 | Other | 2-1445050-9 |
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