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2007637-5
TE Connectivity
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1 | Configuration Features: Number of Ports 4 | Port Matrix Configuration 2 x 2 | Number of Positions 80 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Centerline (Pitch) .032 INCH | Cent | Other | 2007637-5 |
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2007637-5
TE Connectivity
|
1 | Configuration Features: Number of Ports 4 | Port Matrix Configuration 2 x 2 | Number of Positions 80 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Centerline (Pitch) .032 INCH | Cent | Other | 2007637-5 |
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1-2007637-5
TE Connectivity
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1 | SFP, SFP+ & zSFP+, Cage Assembly with Integrated Connector, Data Rate (Max) 16 Gb/s, Internal/External EMI Springs, EMI Enhanced, With Lightpipe | Other | 1-2007637-5 |
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