21274 Footprint, Symbol and 3D Model search results

Showing 25 of 2069 results

Price & Stock Powered by

Filter by Manufacturer

Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	MAL202127471E3 Vishay	1	Aluminum Electrolytic Capacitors - Axial Leaded 470uF 40V 20% Axial	Capacitors, Polarized Axial Diameter Horizontal Mounting	MAL202127471E3	3D model available Symbol and footprint available 3	1 Download Model
	MAL202127479E3 Vishay	1	47 µF 40 V Aluminum Electrolytic Capacitors Axial, Can 3.8Ohm @ 100Hz 2500 Hrs @ 85°C	Capacitors, Polarized Axial Diameter Horizontal Mounting	MAL202127479E3	3D model available Symbol and footprint available 3	1 Download Model
	R5F21274SDFP#V2 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21274SDFP#V2	3D model available Symbol and footprint available 3	1 Download Model
	R5F21274KFP#W4 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21274KFP#W4	3D model available Symbol and footprint available 3	1 Download Model

	R5F21274JFP#U0 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21274JFP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21274SNFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21274SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21274SDFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21274SDFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	1821274 Phoenix Contact	1	MC 0,5/ 5-G-2,54 P20 THR R44 - PCB headers, nominal cross section: 0.5 mm², color: black, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Au, contact connection type: Pin, number of potentials: 5, number of rows: 1, number of positions: 5, number of connections: 5, product range: MC 0,5/..-G-THR, pitch: 2.54 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 2 mm, number of solder pins per potential: 1, plug-in system: COMBICON FMC 0,5,	Other	1821274	3D model available Symbol and footprint available 3	1 Download Model
	R5F21274SNFP#V2 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21274SNFP#V2	3D model available Symbol and footprint available 3	1 Download Model
	212748-2 TE's AMP	1	48 CONTACT(S), HERMAPHRODITIC, TELECOM AND DATACOM CONNECTOR		212748-2	3D model not available Symbol and footprint not available 0	0 Build or Request
	212749-2 TE Connectivity	1	Telecom and Datacom Connector, 48 Contact(s), Male and Female		212749-2	3D model not available Symbol and footprint not available 0	0 Build or Request
	212748-1 TE's AMP	1	48 CONTACT(S), HERMAPHRODITIC, TELECOM AND DATACOM CONNECTOR		212748-1	3D model not available Symbol and footprint not available 0	0 Build or Request
	212748-4 TE Connectivity	1	Telecom and Datacom Connector, 48 Contact(s), Male and Female		212748-4	3D model not available Symbol and footprint not available 0	0 Build or Request
	212749-4 TE Connectivity	1	Telecom and Datacom Connector, 48 Contact(s), Male and Female		212749-4	3D model not available Symbol and footprint not available 0	0 Build or Request
	212748-3 TE's AMP	1	48 CONTACT(S), HERMAPHRODITIC, TELECOM AND DATACOM CONNECTOR		212748-3	3D model not available Symbol and footprint not available 0	0 Build or Request

	212748-3 TE Connectivity	1	Telecom and Datacom Connector, 48 Contact(s), Male and Female		212748-3	3D model not available Symbol and footprint not available 0	0 Build or Request
	212748-4 TE's AMP	1	48 CONTACT(S), HERMAPHRODITIC, TELECOM AND DATACOM CONNECTOR		212748-4	3D model not available Symbol and footprint not available 0	0 Build or Request
	212749-1 TE's AMP	1	48 CONTACT(S), HERMAPHRODITIC, TELECOM AND DATACOM CONNECTOR		212749-1	3D model not available Symbol and footprint not available 0	0 Build or Request
	212749-4 TE's AMP	1	48 CONTACT(S), HERMAPHRODITIC, TELECOM AND DATACOM CONNECTOR		212749-4	3D model not available Symbol and footprint not available 0	0 Build or Request
	212749-2 TE's AMP	1	48 CONTACT(S), HERMAPHRODITIC, TELECOM AND DATACOM CONNECTOR		212749-2	3D model not available Symbol and footprint not available 0	0 Build or Request
	212749-3 TE Connectivity	1	Telecom and Datacom Connector, 48 Contact(s), Male and Female		212749-3	3D model not available Symbol and footprint not available 0	0 Build or Request
	212749-3 TE's AMP	1	48 CONTACT(S), HERMAPHRODITIC, TELECOM AND DATACOM CONNECTOR		212749-3	3D model not available Symbol and footprint not available 0	0 Build or Request
	212749-1 TE Connectivity	1	Telecom and Datacom Connector, 48 Contact(s), Male and Female		212749-1	3D model not available Symbol and footprint not available 0	0 Build or Request
	212748-1 TE Connectivity	1	Telecom and Datacom Connector, 48 Contact(s), Male and Female		212748-1	3D model not available Symbol and footprint not available 0	0 Build or Request
	212748-2 TE Connectivity	1	Telecom and Datacom Connector, 48 Contact(s), Male and Female		212748-2	3D model not available Symbol and footprint not available 0	0 Build or Request
1 2 3 4 5 6 7 8 9

Can't find what you're looking for? Request this part

21274 Model Download Search Results

Popular Ceramic Capacitors