2129- Model Download Search Results
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PCF2129T/2,518
NXP
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1 | NXP - PCF2129T/2,518 - REAL TIME CLOCK/CALENDAR, I2C/SPI, SOIC | Small Outline Packages | PCF2129T/2,518 |
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M55302/129-09
TE Connectivity
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1 | Conn Box Connector HDR 90 POS 2.54mm Solder RA Thru-Hole Package | Other | M55302/129-09 |
3
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LPC2129FBD64/00
NXP
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1 | Single-chip 16/32-bit microcontrollers; 128/256 kB ISP/IAP flash with 10-bit ADC and CAN | Quad Flat Packages | LPC2129FBD64/00 |
3
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ALD212902PAL
Advanced Linear Devices Inc.
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1 | MOSFET Dual N-Ch Matched Pr VGS=0.0V | Dual-In-Line Packages | ALD212902PAL |
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ALD212902SAL
Advanced Linear Devices Inc.
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1 | MOSFET Dual N-Ch Matched Pr VGS=0.0V | Small Outline Packages | ALD212902SAL |
3
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009296001212906
Kyocera AVX
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1 | Headers & Wire Housings 1Way 20-26AWG 300V Horizontal White | Other | 009296001212906 |
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2129260-1
TE Connectivity
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1 | Body Features: Shell Base Material Stainless Steel | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 3 | Number of Signal Positions 40 | Number of Power Positions 0 | Number of Positions 40 | Contact Features: Contact Current Rating (Max) 1 AMP | Number of Utility Contacts 0 | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Housing Features: Housing Colo | Other | 2129260-1 |
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TSW-121-29-H-S
SAMTEC
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1 | 21 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-121-29-H-S |
2
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RM222-010-221-2900
AirBorn
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1 | Rectangular Mil Spec Connectors 2 Row Thru Hole Receptacle | Other | RM222-010-221-2900 |
3
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PCF2129AT/2,518
NXP
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1 | Real Time Clock RTC IC | Small Outline Packages | PCF2129AT/2,518 |
3
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RM372-035-321-2900
AirBorn
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1 | RM37, Rugged Rectangular Connector, 1.91mm Pitch, Right Angle Board Mount Plug, PTH, without Mounting Ears. 3-Row, Size: 035. | Other | RM372-035-321-2900 |
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1 | Real Time Clock RTC IC | Small Outline Packages | PCA2129T/Q900/2,51 |
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1 | 3M 2321291 1.78mm Pitch Straight 32 Way, Through Hole ZIF IC Dip Socket, 1A | Other | 232-1291-00-0602J |
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TS14-1212-90-BK-260-SCR-D
CUI Devices
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0 | Tactile Switches 12 x 12 mm 9 mm 260 gf Short Crimped Black Through Hole SPST | Other | TS14-1212-90-BK-260-SCR-D |
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SSSS212901
ALPS Electric
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1 | Switch Slide SP3T Top Slide 0.3A 6VDC 10000Cycles Gull Wing SMD T/R | Other | SSSS212901 |
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1 | IC & Component Sockets RECPT FOR DIP SOCKET 42 Contact Qty. | Other | 242-1293-29-0602J |
2
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52892-1295
Molex
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1 | CONNECTOR, FPC, ZIF, 0.50MM, 12 WAY | Other | 52892-1295 |
3
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TSW-121-29-T-S
SAMTEC
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1 | 21 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-121-29-T-S |
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2129260-1
TE Connectivity
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1 | Body Features: Shell Base Material Stainless Steel | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 3 | Number of Signal Positions 40 | Number of Power Positions 0 | Number of Positions 40 | Contact Features: Contact Current Rating (Max) 1 AMP | Number of Utility Contacts 0 | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Housing Features: Housing Colo | Other | 2129260-1 |
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2086-1212/997-607
Wago
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1 | THR PCB terminal block; push-button; 1.5 mm²; Pin spacing 3.5 mm; 12-pole; Push-in CAGE CLAMP®; in tape-and-reel packaging | Other | 2086-1212/997-607 |
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TSW-121-29-TM-S
SAMTEC
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1 | 21 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-121-29-TM-S |
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R5F21292SNSP#U0
Renesas Electronics
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1 | The R8C/29 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat | Small Outline Packages | R5F21292SNSP#U0 |
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R5F21292SDSP#U0
Renesas Electronics
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1 | The R8C/29 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat | Small Outline Packages | R5F21292SDSP#U0 |
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TSW-121-29-F-S
SAMTEC
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1 | 21 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-121-29-F-S |
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TSW-121-29-G-S
SAMTEC
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1 | 21 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-121-29-G-S |
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![Part Image](["https://componentsearchengine.com/Thumbnails/9/PCF2129T_2,518.jpg",null,"//content.supplyframe.com/images/process/fit-in/100x100/p/2245_sot162-1_3d.gif"])
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![Part Image](["https://componentsearchengine.com/Thumbnails/9/PCA2129T_Q900_2,51.jpg",null,"//content.supplyframe.com/images/process/fit-in/100x100/p/2245_sot162-1_3d.gif"])
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