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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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21325
Molex
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1 | Barrier Strip Terminal Block, 30A, 2 Row(s), 1 Deck(s), | 21325 |
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21325
HELUKABEL
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1 | Wire And Cable, 8 Conductor(s), 24AWG, 500V, Communication Cable, | 21325 |
0
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0213.250
LITTELFUSE
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1 | Cartridge Fuses 250V .25A Slo-Blo | Resistors, Axial Diameter Horizontal Mounting | 0213.250 |
3
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NK-2E2-021-325-TH00
AirBorn
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1 | CONNECTOR Right Angle 21 Position 0.635 mm 2 Row cable to board Right angle PTH | Other | NK-2E2-021-325-TH00 |
3
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405-52132-51
ept
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1 | 32 pins, unmated stacking height: 1.15 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1, Parallel, SMT, High Density, High Speed, Rugged, EMC | Other | 405-52132-51 |
3
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MIC5213-2.5YC5-TR
Microchip
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1 | LDO Voltage Regulators 80mA uCap LDO | SOT23 (5-Pin) | MIC5213-2.5YC5-TR |
3
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292132-5
TE Connectivity
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1 | Body Features: Primary Product Color Natural | Configuration Features: Number of Positions 5 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Tin | Mating Pin Diameter .6 MM | Contact Mating Area Length 4.2 MM | Contact Mating Area Length .165 INCH | Contact Shape & Form Round | Mating Pin Diameter .024 INCH | Contact Current Rating (Max) 4 AMP | Contact Mating Area Plating Material Thickness 1 MICM | PCB Contact Termination Area Plating Material T | Header, Shrouded - Straight PTH Box | 292132-5 |
3
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292132-5
TE Connectivity
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1 | Body Features: Primary Product Color Natural | Configuration Features: Number of Positions 5 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Tin | Mating Pin Diameter .6 MM | Contact Mating Area Length 4.2 MM | Contact Mating Area Length .165 INCH | Contact Shape & Form Round | Mating Pin Diameter .024 INCH | Contact Current Rating (Max) 4 AMP | Contact Mating Area Plating Material Thickness 1 MICM | PCB Contact Termination Area Plating Material T | Header, Shrouded - Straight PTH Box | 292132-5 |
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406-52132-51
ept
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1 | 32 pins, unmated stacking height: 4.85 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1, Parallel, SMT, High Density, High Speed, Rugged, EMC | Other | 406-52132-51 |
3
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0213.250MXEP
LITTELFUSE
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1 | Cartridge Fuses 250V .25A Slo-Blo | Resistors, Axial Diameter Horizontal Mounting | 0213.250MXEP |
3
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MK-252-021-325-410S
AirBorn
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1 | D-Sub MIL Spec Connectors Microminiature Series .050 | Other | MK-252-021-325-410S |
2
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2132572-1
TE Connectivity
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1 | IMP100O,HMP,V3P6C,RG,LEW46,4.9 | 2132572-1 |
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2132586-1
TE Connectivity
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1 | IMP100O,HMP,V3P8C,LG,REW46,4.9 | 2132586-1 |
0
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2132528-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Rows 9 | Number of Signal Positions 36 | Stackable No | Guide Location Left | PCB Mount Orientation Vertical | Number of Ground Positions 18 | Number of Columns 6 | Number of Positions 54 | Number of Pairs 18 | Contact Features: Contact Shape & Form Dual Beam | PCB Contact Termination Area Plating Material Thickness 1.27 MICM | Contact Underplating Material Nickel | Contact Mating Area Length .177 INCH | Contact Base Material Cop | 2132528-1 |
1
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2132532-3
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Guide Location Right | Number of Signal Positions 36 | Stackable No | Number of Ground Positions 18 | Number of Pairs 18 | Number of Rows 9 | Number of Columns 6 | Number of Positions 54 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Thickness 1. | 2132532-3 |
1
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2132531-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Ground Positions 18 | Stackable No | PCB Mount Orientation Vertical | Number of Pairs 18 | Number of Columns 6 | Number of Positions 54 | Guide Location Right | Number of Rows 9 | Number of Signal Positions 36 | Contact Features: Contact Base Material Copper Alloy | Contact Shape & Form Dual Beam | Contact Mating Area Length 4.9 MM | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Ma | 2132531-2 |
1
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2132595-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Stackable No | Guide Location Right | Number of Ground Positions 24 | Backplane Architecture Orthogonal | Number of Rows 12 | Number of Signal Positions 48 | Number of Pairs 24 | Number of Positions 72 | Number of Columns 6 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Current Rating (Max) .75 AMP | Contact Layout Inline | Contact Base Material Copper Nickel Silico | 2132595-2 |
1
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2132530-3
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Signal Positions 36 | Guide Location Right | Number of Columns 6 | Number of Ground Positions 18 | Number of Pairs 18 | Number of Positions 54 | Stackable No | Number of Rows 9 | PCB Mount Orientation Vertical | Contact Features: Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Length 5.5 MM | PCB Contact Termination Area Plating Material Thickness 1.27 MICM | Contact Mating Area Length .217 INCH | Contact L | 2132530-3 |
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2132533-1
TE Connectivity
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1 | IMP100S,H,V3P6C,RG,LEW39,4.5 | 2132533-1 |
1
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2132533-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Stackable No | Number of Columns 6 | PCB Mount Orientation Vertical | Number of Rows 9 | Number of Signal Positions 36 | Guide Location Right | Number of Pairs 18 | Number of Positions 54 | Number of Ground Positions 18 | Contact Features: Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Materia | 2132533-2 |
1
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2132534-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Pairs 18 | PCB Mount Orientation Vertical | Number of Positions 54 | Number of Rows 9 | Number of Signal Positions 36 | Stackable No | Number of Columns 6 | Number of Ground Positions 18 | Guide Location Unguided | Contact Features: PCB Contact Termination Area Plating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Tin | PCB Contact Terminatio | 2132534-1 |
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2132593-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Backplane Architecture Orthogonal | Number of Positions 72 | PCB Mount Orientation Vertical | Number of Columns 6 | Stackable No | Number of Ground Positions 24 | Guide Location Left | Number of Signal Positions 48 | Number of Rows 12 | Number of Pairs 24 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) .75 AMP | Contact Underplating Material Nickel | PCB Contact Termination Area Pl | 2132593-2 |
0
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2132566-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Backplane Architecture Orthogonal | Number of Positions 54 | Number of Pairs 18 | Number of Rows 9 | Number of Columns 6 | Guide Location Unguided | Stackable No | Number of Signal Positions 36 | PCB Mount Orientation Vertical | Number of Ground Positions 18 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Length 4.5 MM | Contact Layout Inline | Contact Current Rating (Max) .75 AMP | Cont | 2132566-1 |
1
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2132598-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Backplane Architecture Orthogonal | Number of Signal Positions 48 | Number of Columns 6 | Guide Location Unguided | Number of Ground Positions 24 | Stackable No | Number of Pairs 24 | Number of Rows 12 | Number of Positions 72 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | PCB Contact Termination Area Plating Material Thickness .76 – 1.52 MICM | Contact Mating Area Platin | 2132598-1 |
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2132539-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Signal Positions 36 | Number of Pairs 18 | Stackable No | PCB Mount Orientation Vertical | Number of Columns 6 | Number of Rows 9 | Number of Positions 54 | Number of Ground Positions 18 | Guide Location Unguided | Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Shape & Form Dual Beam | PCB Contact Termination Area Plating Material Finish Matte | Contact Mating Area Plating Material Thickness 29.92 M | 2132539-2 |
1
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