214-4 Model Download Search Results
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214-44-624-01-670800
Mill-Max
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1 | IC & Component Sockets 24 PIN Sn/Sn SMT CLOSED FRAME | Other | 214-44-624-01-670800 |
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214-44-320-01-670800
Mill-Max
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1 | DIP DUAL IN LINE SOCKET, Way | Other | 214-44-320-01-670800 |
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214-44-316-01-670800
Mill-Max
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1 | 16 (2 x 8) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Tin Surface Mount | Other | 214-44-316-01-670800 |
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214-44-318-01-670800
Mill-Max
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1 | DIP DUAL IN LINE SOCKET, 18 Way | Dual-In-Line Sockets | 214-44-318-01-670800 |
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214-44-308-01-670800
Mill-Max
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1 | DIP DUAL IN LINE SOCKET, Way | Other | 214-44-308-01-670800 |
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214-4541
Weidmüller
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1 | OMNIMATE Power - series BU/SU 10.16HP SU 10.16HP/03/90G 3.5AG BK BX | Other | 214-4541 |
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HD64F2144FA20V
Renesas Electronics
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1 | RENESAS - HD64F2144FA20V - Microcontroller, H8S Microcontrollers, 16bit, 20 MHz, 128 KB, 4 KB | Quad Flat Packages | HD64F2144FA20V |
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TLE2144CDWG4
Texas Instruments
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1 | TEXAS INSTRUMENTS - TLE2144CDWG4 - Operational Amplifier, Quad, 4 Amplifier, 5.9 MHz, 45 V/?s, ? 2V to ? 22V, WSOIC, 16 Pins | Small Outline Packages | TLE2144CDWG4 |
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2-1445054-4
TE Connectivity
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1 | Configuration Features: Number of Power Positions 4 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Layout Inline | Other | 2-1445054-4 |
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RCJ-412144
Same Sky
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1 | RCJ-41 Series - 4 Port (2x2), Right Angle, Through Hole, RCA Jack Connector | Other | RCJ-412144 |
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2-1445100-4
TE Connectivity
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1 | PCB Mount Header, Right Angle, Wire-to-Board, 4 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Surface Mount, Power, Micro MATE-N-LOK | Other | 2-1445100-4 |
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2-1445099-4
TE Connectivity
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1 | Configuration Features: Number of Positions 4 | Number of Rows 1 | Number of Power Positions 4 | PCB Mount Orientation Right Angle | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plati | Other | 2-1445099-4 |
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2-1445088-4
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 4 | PCB Mount Orientation Right Angle | Number of Power Positions 4 | Contact Features: Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Retention Within Housing Without | Contact Type Pin | Contact Layout Inline | PCB Contact Terminati | Other | 2-1445088-4 |
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2-1445057-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Power Positions 4 | Number of Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Layout Inline | Multiple Contact Types Without | Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Ar | Other | 2-1445057-4 |
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2-1445096-4
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 4 | Number of Power Positions 4 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Contact Retention Within Housing Without | Contact | Other | 2-1445096-4 |
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2-1445050-4
TE Connectivity
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1 | Configuration Features: Number of Power Positions 4 | Number of Rows 1 | Number of Positions 4 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Layout Inline | PCB Contact Termination Area Plating Material Ti | Other | 2-1445050-4 |
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2-1445098-4
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 4 | Number of Positions 4 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Gold | Contact Layout Inline | Multiple Contact Types Without | Contact Type Pin | Contact Mating A | Other | 2-1445098-4 |
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2-1445094-4
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 4 | PCB Mount Orientation Vertical | Number of Positions 4 | Contact Features: Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 2.54 MICM | Contac | Other | 2-1445094-4 |
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2-1445093-4
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 4 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Through Hole - Solder, Power, Micro MATE-N-LOK | Other | 2-1445093-4 |
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2-1445053-4
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 4 | Number of Power Positions 4 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Type Pin | Contact Retention Within Housing Without | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating M | Other | 2-1445053-4 |
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2-1445089-4
TE Connectivity
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1 | Configuration Features: Number of Positions 4 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 4 | Contact Features: Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | Contact Type Pin | Contact Layout Inline | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Platin | Other | 2-1445089-4 |
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2-1445091-4
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Positions 4 | Number of Power Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .38 MICM | Contact Type Pin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Plating | Other | 2-1445091-4 |
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2-1445055-4
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 4 | Number of Positions 4 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating | Other | 2-1445055-4 |
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721-440/001-000
Wago
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1 | THT male header; 1.0 x 1.0 mm solder pin; angled; 100% protected against mismating; Pin spacing 5 mm; 10-pole | Other | 721-440/001-000 |
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722-144/039-000
Wago
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1 | THT female header; straight; Pin spacing 5 mm; 14-pole; 100% protected against mismating; Locking lever; 0.6 x 1.0 mm solder pin | Other | 722-144/039-000 |
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