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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2198346-7
TE Connectivity
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1 | Configuration Features: Number of Positions 320 | Number of Ports 16 | Lightpipe Style Standard | Port Matrix Configuration 2 x 8 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 | Other | 2198346-7 |
3
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2198325-7
TE Connectivity
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1 | Configuration Features: Number of Positions 80 | Number of Ports 4 | Lightpipe Style Standard | Port Matrix Configuration 2 x 2 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G | Other | 2198325-7 |
3
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2198346-7
TE Connectivity
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1 | Configuration Features: Number of Positions 320 | Number of Ports 16 | Lightpipe Style Standard | Port Matrix Configuration 2 x 8 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 | Other | 2198346-7 |
3
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2198325-7
TE Connectivity
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1 | Configuration Features: Number of Positions 80 | Number of Ports 4 | Lightpipe Style Standard | Port Matrix Configuration 2 x 2 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G | Other | 2198325-7 |
3
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2198325-6
TE Connectivity
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1 | Configuration Features: Number of Positions 80 | Port Matrix Configuration 2 x 2 | Lightpipe Style Standard | Number of Ports 4 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G | Other | 2198325-6 |
3
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2198318-6
TE Connectivity
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1 | Configuration Features: Number of Positions 40 | Port Matrix Configuration 2 x 1 | Number of Ports 2 | Lightpipe Style Standard | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 G | Other | 2198318-6 |
3
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2198318-6
TE Connectivity
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1 | Configuration Features: Number of Positions 40 | Port Matrix Configuration 2 x 1 | Number of Ports 2 | Lightpipe Style Standard | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 G | Other | 2198318-6 |
3
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2198325-6
TE Connectivity
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1 | Configuration Features: Number of Positions 80 | Port Matrix Configuration 2 x 2 | Lightpipe Style Standard | Number of Ports 4 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G | Other | 2198325-6 |
3
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219839-7
CommScope Inc
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1 | Interconnection Device, | 219839-7 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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219837-2
TE Connectivity
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1 | CABLE ASSEMBLY | 219837-2 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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219839-1
TE Connectivity
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1 | INTERCONNECTION DEVICE | 219839-1 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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219839-4
TE Connectivity
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1 | INTERCONNECTION DEVICE | 219839-4 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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219839-5
TE Connectivity
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1 | INTERCONNECTION DEVICE | 219839-5 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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219837-9
TE Connectivity
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1 | CABLE ASSEMBLY | 219837-9 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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219838-4
TE Connectivity
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1 | CABLE ASSEMBLY | 219838-4 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2198346-8
TE Connectivity
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1 | Configuration Features: Number of Positions 320 | Lightpipe Style Standard | Port Matrix Configuration 2 x 8 | Number of Ports 16 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 | 2198346-8 |
1
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2198318-2
TE Connectivity
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1 | Configuration Features: Number of Positions 40 | Number of Ports 2 | Lightpipe Style Standard | Port Matrix Configuration 2 x 1 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 G | 2198318-2 |
1
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2198325-8
TE Connectivity
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1 | Configuration Features: Number of Positions 80 | Lightpipe Style Standard | Number of Ports 4 | Port Matrix Configuration 2 x 2 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 G | 2198325-8 |
1
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2198339-5
TE Connectivity
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1 | Configuration Features: Number of Positions 240 | Port Matrix Configuration 2 x 6 | Number of Ports 12 | Lightpipe Style Standard | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 | 2198339-5 |
1
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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219839-6
TE Connectivity
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1 | INTERCONNECTION DEVICE | 219839-6 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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219839-6
CommScope Inc
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1 | Interconnection Device, | 219839-6 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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219837-1
TE Connectivity
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1 | CABLE ASSEMBLY | 219837-1 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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219839-3
TE Connectivity
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1 | INTERCONNECTION DEVICE | 219839-3 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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219836-4
TE Connectivity
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1 | CABLE ASSEMBLY | 219836-4 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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219839-8
TE Connectivity
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1 | INTERCONNECTION DEVICE | 219839-8 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||