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21983 Model Download Search Results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image
2198325-7 TE Connectivity
1 Configuration Features: Number of Positions 80 | Number of Ports 4 | Lightpipe Style Standard | Port Matrix Configuration 2 x 2 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G Other Check Price & Stock 1 Download Model
Part Image Part Image
2198346-7 TE Connectivity
1 Configuration Features: Number of Positions 320 | Number of Ports 16 | Lightpipe Style Standard | Port Matrix Configuration 2 x 8 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 Other Check Price & Stock 1 Download Model
Part Image Part Image
2198346-7 TE Connectivity
1 Configuration Features: Number of Positions 320 | Number of Ports 16 | Lightpipe Style Standard | Port Matrix Configuration 2 x 8 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 Other Check Price & Stock 1 Download Model
Part Image Part Image
2198325-7 TE Connectivity
1 Configuration Features: Number of Positions 80 | Number of Ports 4 | Lightpipe Style Standard | Port Matrix Configuration 2 x 2 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G Other Check Price & Stock 1 Download Model
Part Image Part Image
2198318-6 TE Connectivity
1 Configuration Features: Number of Positions 40 | Port Matrix Configuration 2 x 1 | Number of Ports 2 | Lightpipe Style Standard | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 G Other Check Price & Stock 1 Download Model
Part Image Part Image
2198318-6 TE Connectivity
1 Configuration Features: Number of Positions 40 | Port Matrix Configuration 2 x 1 | Number of Ports 2 | Lightpipe Style Standard | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 G Other Check Price & Stock 1 Download Model
Part Image Part Image
2198325-6 TE Connectivity
1 Configuration Features: Number of Positions 80 | Port Matrix Configuration 2 x 2 | Lightpipe Style Standard | Number of Ports 4 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G Other Check Price & Stock 1 Download Model
Part Image Part Image
2198325-6 TE Connectivity
1 Configuration Features: Number of Positions 80 | Port Matrix Configuration 2 x 2 | Lightpipe Style Standard | Number of Ports 4 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G Other Check Price & Stock 1 Download Model
Part Image Part Image
219838-2 TE Connectivity
1 CABLE ASSEMBLY Check Price & Stock 0 Build or Request
Part Image Part Image
2198373-2 TE Connectivity
1 Configuration Features: Port Matrix Configuration 2 x 1 | Number of Ports 2 | Number of Positions 76 | Number of Rear EONs per Port Column 3 | Contact Features: Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Tin | PCB Contact Termination Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness Check Price & Stock 1 Download Model
Part Image Part Image
2198318-4 TE Connectivity
1 Configuration Features: Port Matrix Configuration 2 x 1 | Number of Positions 40 | Lightpipe Style Standard | Number of Ports 2 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 G Check Price & Stock 1 Download Model
Part Image Part Image
2198339-4 TE Connectivity
1 Configuration Features: Number of Ports 12 | Lightpipe Style Standard | Number of Positions 240 | Port Matrix Configuration 2 x 6 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 Check Price & Stock 1 Download Model
Part Image Part Image
2198339-8 TE Connectivity
1 Configuration Features: Lightpipe Style Standard | Number of Positions 240 | Number of Ports 12 | Port Matrix Configuration 2 x 6 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 Check Price & Stock 1 Download Model
Part Image Part Image
219839-5 TE Connectivity
1 INTERCONNECTION DEVICE Check Price & Stock 0 Build or Request
Part Image Part Image
219837-2 TE Connectivity
1 CABLE ASSEMBLY Check Price & Stock 0 Build or Request
Part Image Part Image
219839-1 TE Connectivity
1 INTERCONNECTION DEVICE Check Price & Stock 0 Build or Request
Part Image Part Image
219837-9 TE Connectivity
1 CABLE ASSEMBLY Check Price & Stock 0 Build or Request
Part Image Part Image
219839-7 CommScope Inc
1 Interconnection Device, Check Price & Stock 0 Build or Request
Part Image Part Image
219838-4 TE Connectivity
1 CABLE ASSEMBLY Check Price & Stock 0 Build or Request
Part Image Part Image
219839-4 TE Connectivity
1 INTERCONNECTION DEVICE Check Price & Stock 0 Build or Request
Part Image Part Image
2198346-8 TE Connectivity
1 Configuration Features: Number of Positions 320 | Lightpipe Style Standard | Port Matrix Configuration 2 x 8 | Number of Ports 16 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 Check Price & Stock 1 Download Model
Part Image Part Image
2198318-2 TE Connectivity
1 Configuration Features: Number of Positions 40 | Number of Ports 2 | Lightpipe Style Standard | Port Matrix Configuration 2 x 1 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 G Check Price & Stock 1 Download Model
Part Image Part Image
2198339-5 TE Connectivity
1 Configuration Features: Number of Positions 240 | Port Matrix Configuration 2 x 6 | Number of Ports 12 | Lightpipe Style Standard | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 Check Price & Stock 1 Download Model
Part Image Part Image
2198325-8 TE Connectivity
1 Configuration Features: Number of Positions 80 | Lightpipe Style Standard | Number of Ports 4 | Port Matrix Configuration 2 x 2 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 G Check Price & Stock 1 Download Model
Part Image Part Image
219839-8 TE Connectivity
1 INTERCONNECTION DEVICE Check Price & Stock 0 Build or Request
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