22881 Model Download Search Results
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MAX22881CAAP+T
Analog Devices
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1 | Reinforced, Ultra-Low-Power, 4-Channel Digital Isolators | Small Outline Packages | MAX22881CAAP+T |
3
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22-28-8112
Molex
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1 | Headers & Wire Housings 2.54MM BREAKAWAY RA 11 CKT Gold | Other | 22-28-8112 |
3
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22-28-8110
Molex
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1 | KK 100 HDR ASSY RA BKWY 11 CK TIN | Header, Unshrouded - Right Angle PTH Pin | 22-28-8110 |
3
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22-28-8160
Molex
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1 | Headers & Wire Housings BKWY HDR R/A 16P tin | Other | 22-28-8160 |
3
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22-28-8163
Molex
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1 | Headers & Wire Housings 2.54MM BREAKAWAY RA 16 CKT Gold | Other | 22-28-8163 |
3
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95522-2881
Molex
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1 | Modular Jack, Vertical, Top Entry, Through Hole, 8/8, High Profile, no Ribs, Tray | Other | 95522-2881 |
3
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22-28-8151
Molex
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1 | Headers & Wire Housings 15CKT RA HDR | Other | 22-28-8151 |
3
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22-28-8152
Molex
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1 | Headers & Wire Housings HEADER 15POS .100 R/A GOLD | Other | 22-28-8152 |
3
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22-28-8120
Molex
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1 | Headers & Wire Housings BKWY HDR R/A 12P tin | Header, Unshrouded - Right Angle PTH Pin | 22-28-8120 |
3
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22-28-8140
Molex
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1 | Headers & Wire Housings 2.54MM BREAKAWAY RA 14 CKT Tin | Header, Unshrouded - Right Angle PTH Pin | 22-28-8140 |
3
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22-28-8122
Molex
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1 | Headers & Wire Housings 12P BRKAWAY HEADER RA SMT COMPATIBLE AU | Header, Unshrouded - Right Angle PTH Pin | 22-28-8122 |
3
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MAX22881CAAP+
Analog Devices
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1 | Reinforced, Ultra-Low-Power, 4-Channel Digital Isolators | Small Outline Packages | MAX22881CAAP+ |
3
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0022288102
Molex
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1 | KK 254 Breakaway Header, Right-Angle Surface Mount Compatible, 10 Circuits, 0.38µm Gold (Au) Selective Plating, Mating Pin Length 6.20mm | Header, Unshrouded - Right Angle PTH Pin | 0022288102 |
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RH100-12.288-12-1010-TR
RALTRON
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1 | MHz Crystal, 12.288 MHz, 3.2 x 2.5 mm, ±10 ppm tolerance, ±10 ppm stability, 12 pF, -20~70°C, SMD | Other | RH100-12.288-12-1010-TR |
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RH100-12.288-18-2030-EXT-TR
RALTRON
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1 | MHz Crystal, 12.288 MHz, 3.2 x 2.5 mm, ±20 ppm tolerance, ±30 ppm stability, 18 pF, -40~85°C, SMD | Other | RH100-12.288-18-2030-EXT-TR |
3
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H130B-12.288-12-EXT-TR
RALTRON
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1 | MHz Crystal, 12.288 MHz, 5 x 3.2 mm, ±50 ppm tolerance, ±50 ppm stability, 12 pF, -40~85°C, SMD | Other | H130B-12.288-12-EXT-TR |
3
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22-28-8161
Molex
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1 | Headers & Wire Housings 2.54MM BREAKAWAY RA 16 CKT Tin | Header, Unshrouded - Right Angle PTH Pin | 22-28-8161 |
3
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RJE722881441
Amphenol
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1 | Modular Jack - 8P8C, Right Angle, Cat5e, Two Port, Shield With EMI Tabs, Recessed Profile, With LEDs | Other | RJE722881441 |
3
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22-28-8133
Molex
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1 | Headers & Wire Housings KK 100 Hdr Assy RA B Bkwy 13 Ckt 15 SGold | Header, Unshrouded - Right Angle PTH Pin | 22-28-8133 |
3
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2288172-3
TE Connectivity
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1 | Configuration Features: Number of Ports 24 | Port Matrix Configuration 2 x 12 | Number of Positions 480 | Lightpipe Style Standard | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 3 | 2288172-3 |
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2288186-1
TE Connectivity
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1 | Power/Signal Relay | 2288186-1 |
0
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2288140-1
TE Connectivity
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0 | Body Features: Terminal Seal Type Single Wire Seal (SWS) | Contact Features: Terminal Type Receptacle | Mating Tab Width .025 INCH | Wire Contact Termination Area Plating Material Tin | Crimp Type F-Crimp | Contact Size .63mm | Interface Plating Tin (Sn) | Mating Tab Thickness .025 INCH | Contact Fabrication Stamped & Formed | Mating Tab Thickness .64 MM | Mating Tab Width .64 MM | Dimensions: Compatible Insulation Diameter Range .045 – .063 INCH | Wire Size Search .3 MMSQ | Wire Size .25 – .35 MMSQ | C | 2288140-1 |
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2288172-2
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 12 | Number of Ports 24 | Number of Positions 480 | Lightpipe Style Standard | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 3 | 2288172-2 |
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2288172-7
TE Connectivity
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1 | Configuration Features: Lightpipe Style Standard | Number of Positions 480 | Number of Ports 24 | Port Matrix Configuration 2 x 12 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness 29.92 MICIN | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 3 | 2288172-7 |
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2288172-6
TE Connectivity
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1 | Configuration Features: Lightpipe Style Standard | Port Matrix Configuration 2 x 12 | Number of Positions 480 | Number of Ports 24 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 3 | 2288172-6 |
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