22944 Model Download Search Results
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22944
HELUKABEL
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1 | Wire And Cable, 3 Conductor(s), 18AWG, 300V, Control Cable/command Cable | 22944 |
0
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2294408-1
TE Connectivity
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1 | zSFP+, Cage Assembly, Signal, Operating Temperature Range -40 – 85 °C [-40 – 185 °F], Data Rate (Max) 32 Gb/s, 8 Ports | Other | 2294408-1 |
3
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ASE-19.922944MHZ-LC
ABRACON
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1 | 3.3V CMOS Compatible 3.2 x 2.5mm SMD Crystal Oscillator | Other | ASE-19.922944MHZ-LC |
3
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TPS22944DCKR
Texas Instruments
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1 | 5.5V, 0.2A, 500mΩ, 100mA Current Limit Load Switch | SOT23 (5-Pin) | TPS22944DCKR |
3
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2294415-2
TE Connectivity
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1 | Body Features: Shield Plating Material Tin over Nickel | Shield Material Stainless Steel | Configuration Features: Port Matrix Configuration 1 x 1 | PCB Mount Orientation Right Angle | Connector Contact Density High | Number of Loaded Positions 8 | Number of Positions 8 | Contact Features: Contact Mating Area Plating Material Gold | Contact Base Material Copper Alloy | Contact Current Rating (Max) 1.5 AMP | Contact Underplating Material Nickel | Housing Features: Centerline (Pitch) 1.27 MM | Mating Entry Lo | 2294415-2 |
1
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2294463-1
TE Connectivity
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1 | Connector Accessory | 2294463-1 |
0
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2294417-1
TE Connectivity
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1 | Body Features: Shield Material Stainless Steel | Shield Plating Material Tin over Nickel | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 8 | Connector Contact Density High | Port Matrix Configuration 1 x 1 | Number of Loaded Positions 8 | Contact Features: Contact Underplating Material Nickel | Contact Current Rating (Max) 1.5 AMP | Contact Mating Area Plating Material Gold | Contact Base Material Copper Alloy | Housing Features: Mating Entry Location Side | Housing Materia | 2294417-1 |
1
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2294463-2
TE Connectivity
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1 | Connector Accessory | 2294463-2 |
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2294408-3
TE Connectivity
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1 | SFP Connector | 2294408-3 |
0
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2294432-1
TE Connectivity
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1 | HDP24-24-21SN-L024,REC,21P,N,THD,12/16,S | 2294432-1 |
1
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2294463-3
TE Connectivity
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1 | Connector Accessory | 2294463-3 |
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2294429-4
TE Connectivity
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1 | Rack and Panel Connector | 2294429-4 |
0
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2294417-2
TE Connectivity
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1 | Body Features: Shield Plating Material Tin over Nickel | Shield Material Stainless Steel | Configuration Features: Connector Contact Density High | PCB Mount Orientation Right Angle | Port Matrix Configuration 1 x 1 | Number of Positions 8 | Number of Loaded Positions 8 | Contact Features: Contact Current Rating (Max) 1.5 AMP | Contact Mating Area Plating Material Gold | Contact Underplating Material Tin | Contact Base Material Copper Alloy | Housing Features: Mating Entry Location Side | Housing Material L | 2294417-2 |
1
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2294488-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Cable Exit Angle 180° | Configuration Features: Connector Seal Code N Seal | Number of Positions 9 | Blank Cavity Position 0 | Contact Features: Contact Current Rating (Max) 25 AMP | Mating Pin Diameter .094 INCH | Contact Current Rating (Max) 100 AMP | Contact Type Pin | Mating Pin Diameter 5.72 MM | Contact Current Rating (Max) 60 AMP | Mating Pin Diameter .225 INCH | Mating Pin Diameter .142 INCH | Mating Pin Diameter 2.39 MM | Mating Pin Diameter 3.61 MM | D | 2294488-1 |
1
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2294435-1
TE Connectivity
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1 | HDP26-24-18PN-L024, PLG, 18P, N, WTHD, P | 2294435-1 |
1
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2294487-1
TE Connectivity
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1 | HDP26-24-33SN-L024, PLG, 33P, N, WTHD, S | 2294487-1 |
1
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2294482-1
TE Connectivity
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1 | HDP26-24-31PT-L024, PLG, 31P, T, WTHD, P | 2294482-1 |
1
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2294415-1
TE Connectivity
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1 | Body Features: Shield Material Stainless Steel | Shield Plating Material Tin over Nickel | Configuration Features: Number of Loaded Positions 8 | Port Matrix Configuration 1 x 1 | Number of Positions 8 | PCB Mount Orientation Right Angle | Connector Contact Density High | Contact Features: Contact Base Material Copper Alloy | Contact Underplating Material Nickel | Contact Current Rating (Max) 1.5 AMP | Contact Mating Area Plating Material Gold | Housing Features: Centerline (Pitch) 1.27 MM | Centerline (Pit | 2294415-1 |
1
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2294494-1
TE Connectivity
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1 | Rack and Panel Connector | 2294494-1 |
0
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2294479-1
TE Connectivity
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1 | HDP26-24-21PN-L024, PLG, 21P, N, WTHD, P | 2294479-1 |
1
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2294417-4
TE Connectivity
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1 | Body Features: Shield Plating Material Tin over Nickel | Shield Material Stainless Steel | Configuration Features: Number of Loaded Positions 8 | PCB Mount Orientation Right Angle | Number of Positions 8 | Connector Contact Density High | Port Matrix Configuration 1 x 1 | Contact Features: Contact Current Rating (Max) 1.5 AMP | Contact Underplating Material Nickel | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Gold | Housing Features: Mating Entry Location Side | Centerline (Pit | 2294417-4 |
1
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2294408-2
TE Connectivity
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1 | Body Features: Heat Sink Height Class PCI | Heat Sink Style Pin | Heat Sink Height .165 INCH | Heat Sink Finish Electroless Nickel | Configuration Features: Number of Ports 8 | Port Matrix Configuration 1 x 8 | Dimensions: PCB Thickness (Recommended) .089 INCH | PCB Thickness (Recommended) 2.25 MM | Electrical Characteristics: Data Rate (Max) 32 GBS | Housing Features: Cage Material Nickel Silver Alloy | Operation/Application: Circuit Application Signal | Heat Sink Compatible Yes | Other: EMI Containment Fe | 2294408-2 |
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2294489-1
TE Connectivity
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0 | HDP24-18-6PN-L024, REC, 6P, N,THD,4/16,P | 2294489-1 |
1
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2294434-1
TE Connectivity
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1 | HDP24-24-33PN-L024, REC, 33P, N,THD,20,P | 2294434-1 |
1
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2294433-1
TE Connectivity
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1 | HDP24-24-31PT-L024, REC, 31P, T,THD,16,P | 2294433-1 |
1
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