2309409-2 Model Download Search Results

Showing 1 of 1 results

Price & Stock Powered by Findchips

Filter by Manufacturer

Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image
2309409-2 TE Connectivity
1 Body Features: Module Key Type Offset Left | Ejector Type Locking | Connector Profile Low | Retention Post Location Both Ends | Ejector Location Both Ends | Latch Material High Temperature Thermoplastic | Configuration Features: Number of Keys 1 | Module Orientation Right Angle | Number of Rows 2 | Number of Positions 260 | Contact Features: Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 5 MICIN | Memory Socket Type Memory Card | Contact Current Rating (Max) .5 AM Other 2309409-2 1 Download Model
Can't find what you're looking for? Request this part