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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2825261-6
TE Connectivity
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1 | Configuration Features: Number of Positions 6 | Number of Power Positions 0 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Signal Positions 0 | Contact Features: Contact Mating Area Plating Material Thickness 80 MICIN | Contact Layout Inline | Contact Current Rating (Max) 13 AMP | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.032 MICM | Contact Mating Area Plating Material Ti | 2825261-6 |
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1-2825261-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 0 | Number of Positions 16 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Signal Positions 16 | Contact Features: Contact Current Rating (Max) 13 AMP | Contact Mating Area Plating Material Thickness 2.032 MICM | Contact Type Pin | Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 80 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Contact Mating Area Plating Material Tin | 1-2825261-6 |
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