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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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3-794682-8
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 8 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Through Hole - Solder, Power, Micro MATE-N-LOK | Other | 3-794682-8 |
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3-794628-8
TE Connectivity
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1 | PCB Mount Header, Right Angle, Wire-to-Board, 8 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Surface Mount, Power, Micro MATE-N-LOK | Other | 3-794628-8 |
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3-794678-6
TE Connectivity
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1 | PCB Mount Header, Right Angle, Wire-to-Board, 6 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Through Hole - Solder, Micro MATE-N-LOK | Other | 3-794678-6 |
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3-794633-8
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 8 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Tin, Surface Mount, Power, Black, Micro MATE-N-LOK | Other | 3-794633-8 |
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3-794681-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 4 | Number of Power Positions 4 | Contact Features: Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .38 MICM | Multiple Contact Types Without | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickn | Other | 3-794681-4 |
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3-794679-6
TE Connectivity
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1 | Connector Header Through Hole, Right Angle 6 position 0.118" (3.00mm) , UL94 V-0 , 250V , -40°C ~ 105°C | Other | 3-794679-6 |
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3-794620-8
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 8 | Number of Power Positions 8 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 | Other | 3-794620-8 |
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3-794630-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 2 | Number of Power Positions 2 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Multiple Contact Types Without | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | C | Header, Receptacle - Straight PTH Box | 3-794630-2 |
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3-794632-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 2 | PCB Mount Orientation Vertical | Number of Power Positions 2 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Type Pin | Multiple Con | Header, Shrouded - Straight PTH Box | 3-794632-2 |
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3-794630-8
TE Connectivity
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1 | Configuration Features: Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 8 | Contact Features: Contact Type Pin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Platin | Header, Shrouded - Straight PTH Box | 3-794630-8 |
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3-794619-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 6 | Number of Positions 6 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Ma | Other | 3-794619-6 |
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3-794681-8
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 8 | Number of Power Positions 8 | Number of Rows 2 | Contact Features: Multiple Contact Types Without | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness .38 MICM | Contact Ma | Other | 3-794681-8 |
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3-794631-4
TE Connectivity
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1 | Configuration Features: Number of Positions 4 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Power Positions 4 | Contact Features: Contact Mating Area Plating Material Thickness .38 MICM | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 15 MICI | Other | 3-794631-4 |
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3-794677-6
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 6 | Number of Positions 6 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Ma | Other | 3-794677-6 |
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3-794680-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 6 | Number of Rows 2 | Number of Positions 6 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types | Other | 3-794680-6 |
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3-794682-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 4 | Number of Positions 4 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Retention Within Housing Without | PCB Contact Termination Area | Other | 3-794682-4 |
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3-794619-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | Number of Rows 2 | Number of Positions 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness .38 MICM | Contact Type Pin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Gold | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 | Other | 3-794619-2 |
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3-794636-8
TE Connectivity
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1 | Configuration Features: Number of Positions 8 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Power Positions 8 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Type Pin | PCB Contact Termination Area | Other | 3-794636-8 |
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3-794637-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Cont | Other | 3-794637-2 |
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3-794681-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 2 | PCB Mount Orientation Vertical | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Materi | Other | 3-794681-2 |
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3-794633-6
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 6 | Number of Power Positions 6 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Multiple Contact Types Without | PCB Contact Terminati | Other | 3-794633-6 |
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3-794620-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 4 | Number of Power Positions 4 | Contact Features: Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .76 MI | Other | 3-794620-4 |
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3-794627-6
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Power Positions 6 | Number of Positions 6 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Multiple Contact Types Wit | Other | 3-794627-6 |
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3-794626-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 4 | PCB Mount Orientation Right Angle | Number of Positions 4 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Multiple Contact Types Without | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact | Other | 3-794626-4 |
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3-794632-6
TE Connectivity
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1 | Configuration Features: Number of Positions 6 | PCB Mount Orientation Vertical | Number of Power Positions 6 | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Multiple Contact Types Without | Header, Receptacle - Straight PTH Box | 3-794632-6 |
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