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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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3-794631-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 2 | PCB Mount Orientation Vertical | Number of Power Positions 2 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | Contact Type Pin | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating | Other | 3-794631-2 |
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3-794631-2
TE Connectivity
|
1 | Configuration Features: Number of Rows 2 | Number of Positions 2 | PCB Mount Orientation Vertical | Number of Power Positions 2 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | Contact Type Pin | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating | Other | 3-794631-2 |
3
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||