350209-1 Model Download Search Results
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350209-1
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 2 | Number of Power Positions 2 | Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Underplating Material Thickness 50 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Retention Within Housing Without | Co | Other | 350209-1 |
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350209-1
TE's AMP
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1 | 2 CONTACT(S), MALE, COMBINATION LINE CONNECTOR, SOLDER, ROHS COMPLIANT | 350209-1 |
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935020910112
NXP Semiconductors
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1 | Bus Transceiver, HC/UH Series, 8-Func, 1-Bit, True Output, CMOS, PDIP20 | 935020910112 |
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![Part Image](["https://www.te.com/content/dam/te-com/catalog/part/003/502/091/350209-1-t1.jpg/jcr:content/renditions/product-details.png","https://www.te.com/content/dam/te-com/catalog/part/003/502/091/350209-1-t1.jpg/jcr:content/renditions/product-details.png",null])
![Part Image]([null,null,"//content.supplyframe.com/images/process/fit-in/100x100/p/dip_20.jpg"])
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