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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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350209-1
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 2 | Number of Power Positions 2 | Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Underplating Material Thickness 50 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Retention Within Housing Without | Co | Other | Check Price & Stock |
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350209-1
TE's AMP
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1 | 2 CONTACT(S), MALE, COMBINATION LINE CONNECTOR, SOLDER, ROHS COMPLIANT | Check Price & Stock |
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935020910112
NXP Semiconductors
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1 | IC HC/UH SERIES, OCTAL 1-BIT TRANSCEIVER, TRUE OUTPUT, PDIP20, SOT-146-1, DIP-20, Bus Driver/Transceiver | Check Price & Stock |
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