35071 Model Download Search Results
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350712-1
TE Connectivity
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1 | Configuration Features: Number of Positions 9 | Number of Rows 3 | PCB Mount Orientation Vertical | Number of Power Positions 9 | Contact Features: Contact Layout Matrix | Contact Underplating Material Thickness 50 MICIN | Contact Underplating Material Thickness 1.27 MICM | Contact Current Rating (Max) 12 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Type Pin | Contact Current Rating (Max) 10 AMP | PCB Contact Termination Area Pl | Other | 350712-1 |
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350711-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 6 | Number of Positions 6 | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Layout Matrix | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Current Rating (Max) 10 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 – .91 MICM | PCB Contact Termination Area Plating Material Th | Other | 350711-4 |
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350713-1
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 12 | Number of Rows 3 | Number of Power Positions 12 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Underplating Material Thickness 50 MICIN | Contact Layout Matrix | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Pre-Tin | Contact Retention Within Ho | Other | 350713-1 |
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350714-1
TE Connectivity
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1 | Configuration Features: Number of Power Positions 15 | Number of Rows 3 | Number of Positions 15 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material Pre-Tin | Contact Current Rating (Max) 10 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Multiple | Other | 350714-1 |
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350712-4
TE Connectivity
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1 | Configuration Features: Number of Power Positions 9 | Number of Rows 3 | PCB Mount Orientation Vertical | Number of Positions 9 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Layout Matrix | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness .76 – .91 MICM | Contact Type Pin | Contact Underplating Material Thickness 50 MICIN | Contact Underplating Material Thickness 1.27 MICM | Contact Current Rating (Max) 10 | Other | 350712-4 |
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535071-4
TE Connectivity
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1 | Receptacle, Board-to-Board, 48 Position, 2.54 mm [.1 in] Centerline, Printed Circuit Board, 3 Row, Vertical, 16 Column, Eurocard Connectors | Other | 535071-4 |
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P1FE90VX3-5071
Shindengen Electric Manufacturing Co., Ltd.
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1 | Transistor: N-MOSFET; unipolar; 900V; 1A; Idm: 4A; 36W | Other | P1FE90VX3-5071 |
3
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55935-0710
Molex
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1 | 2.00mm Pitch MicroClasp Wire-to-Board Header, Single Row, Right Angle, 7 Circuits, with PCB Locator | Other | 55935-0710 |
3
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350714-2
TE Connectivity
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1 | Combination Line Connector, 15 Contact(s), Male, Solder Terminal | 350714-2 |
0
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350712-2
TE Connectivity
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1 | Combination Line Connector, 9 Contact(s), Male, Solder Terminal | 350712-2 |
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350714-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 15 | Number of Rows 3 | Number of Positions 15 | Contact Features: Contact Mating Area Plating Material Gold | Contact Type Pin | Multiple Contact Types Without | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 12 AMP | Contact Underplating Material Thickness 1.27 MICM | Contact Curre | 350714-4 |
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350711-1
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 6 | PCB Mount Orientation Vertical | Number of Power Positions 6 | Contact Features: Contact Current Rating (Max) 10 AMP | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Underplating Material Thickness 50 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | PCB Contact Ter | 350711-1 |
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350711-2
TE Connectivity
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1 | Combination Line Connector, 6 Contact(s), Male, Solder Terminal | 350711-2 |
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350714-5
TE's AMP
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1 | 15 CONTACT(S), MALE, COMBINATION LINE CONNECTOR, SOLDER | 350714-5 |
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350714-5
TE Connectivity
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1 | Combination Line Connector, 15 Contact(s), Male, Solder Terminal | 350714-5 |
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350714-3
TE Connectivity
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1 | Combination Line Connector, 15 Contact(s), Male, Solder Terminal | 350714-3 |
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350713-2
TE Connectivity
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1 | Combination Line Connector, 12 Contact(s), Male, Solder Terminal | 350713-2 |
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350712-1
TE's AMP
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1 | 9 CONTACT(S), MALE, COMBINATION LINE CONNECTOR, SOLDER, ROHS COMPLIANT | 350712-1 |
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350712-4
TE's AMP
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1 | 9 CONTACT(S), MALE, COMBINATION LINE CONNECTOR, SOLDER, ROHS COMPLIANT | 350712-4 |
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350712-2
TE's AMP
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1 | 9 CONTACT(S), MALE, COMBINATION LINE CONNECTOR, SOLDER | 350712-2 |
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350714-3
TE's AMP
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1 | 15 CONTACT(S), MALE, COMBINATION LINE CONNECTOR, SOLDER | 350714-3 |
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350715-1
TE Connectivity
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1 | Configuration Features: Number of Positions 6 | Number of Rows 2 | Contact Features: Contact Layout Matrix | Multiple Contact Types Without | Contact Type Socket | Contact Retention Within Housing Without | Dimensions: Row-to-Row Spacing 6.35 MM | Row-to-Row Spacing .25 INCH | Electrical Characteristics: Operating Voltage 600 VAC | Operating Voltage 600 VDC | Housing Features: Housing Color Natural | Housing Material Nylon | Centerline (Pitch) 6.35 MM | Centerline (Pitch) .25 INCH | Industry Standards: UL F | 350715-1 |
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350715-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 6 | Contact Features: Multiple Contact Types Without | Contact Layout Matrix | Contact Type Socket | Contact Retention Within Housing Without | Dimensions: Row-to-Row Spacing 6.35 MM | Row-to-Row Spacing .25 INCH | Electrical Characteristics: Operating Voltage 600 VAC | Operating Voltage 600 VDC | Housing Features: Housing Material Nylon | Centerline (Pitch) .25 INCH | Centerline (Pitch) 6.35 MM | Housing Color White | Industry Standards: Compat | 350715-4 |
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350713-4
TE Connectivity
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1 | Configuration Features: Number of Positions 12 | Number of Rows 3 | PCB Mount Orientation Vertical | Number of Power Positions 12 | Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Thickness 30 – 36 MICIN | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 10 AMP | Contact Retention Within Housing Without | Contact Layout Matrix | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material Thickness 10 | 350713-4 |
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SSB3FM35071112NN
Thomas & Betts
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1 | Barrier Strip Terminal Block, 15A, 1 Row(s), 1 Deck(s) | SSB3FM35071112NN |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![Part Image](["https://www.te.com/content/dam/te-com/catalog/part/003/507/121/350712-1-t1.jpg/jcr:content/renditions/product-details.png","https://www.te.com/content/dam/te-com/catalog/part/003/507/121/350712-1-t1.jpg/jcr:content/renditions/product-details.png",null])
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![Part Image](["https://www.te.com/content/dam/te-com/catalog/part/003/507/131/350713-1-t1.jpg/jcr:content/renditions/product-details.png","https://www.te.com/content/dam/te-com/catalog/part/003/507/131/350713-1-t1.jpg/jcr:content/renditions/product-details.png",null])
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