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350789-1
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 3 | PCB Mount Orientation Vertical | Number of Power Positions 3 | Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Multiple Contact Types Without | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Conta | Other | 350789-1 |
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